IP Library Granted Patent US 10,405,450
Granted Patent B2
US 10,405,450 · App. 16/275,660 · Granted Sep 3, 2019

High power multilayer module having low inductance and fast switching for paralleling power devices

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Quick Facts
Patent No.
US 10,405,450
App. No.
16/275,660
Granted
Sep 3, 2019
Kind
B2
Abstract

The disclosure is directed to a power module that includes at least one power substrate, a housing arranged on the at least one power substrate, and a first terminal electrically connected to the at least one power substrate. The first terminal includes a contact surface located above the housing at a first elevation. The power module includes a second terminal including a contact surface located above the housing at a second elevation different from the first elevation, a third terminal electrically connected to the at least one power substrate, and a plurality of power devices electrically connected to the at least one power substrate.

Claims (90)

1. A power module, comprising: at least one power substrate; a plurality of power devices electrically connected to the at least one power substrate; the at least one power substrate extending in a width direction and a length direction; a first set of the plurality of power devices arranged in a first row on the at least one power substrate along the width direction; a second set of the plurality of power devices arranged in a second row on the at least one power substrate along the width direction, the first row being positioned at a different position along the length direction of the at least one power substrate then the second row; and a plurality of terminals, each of the plurality of terminals extending in the width direction and the length direction of the at least one power substrate, and each of the plurality of terminals being positioned at a different position along the length direction of the at least one power substrate, wherein the plurality of power devices and plurality of terminals are configured to increase current sharing by the plurality of power devices, wherein a housing arranged on the at least one power substrate; and an isolation structure on and electrically isolated from the at least one power substrate, wherein one of the plurality of terminals is on the isolation structure; and wherein the isolation structure comprises at least one of the following: an embedded isolation component located in the housing, a secondary power substrate arranged on the at least one power substrate, a film isolation component arranged on the at least one power substrate, and a suspension isolation construction located in the housing.

2. The power module of claim 1 , wherein current flows in a loop through the power module through a first one of the plurality of terminals, the at least one power substrate, and a second one of the plurality of terminals to reduce inductance.

3. The power module of claim 1 wherein at least one of the plurality of terminals comprise a sheet metal construction.

4. A system comprising the power module of claim 1 , wherein:

the power module comprises at least two power modules and the at least two power modules are arranged and configured in parallel;

each of the at least two power modules comprises a first terminal of the plurality of terminals;

the first terminals of the at least two power modules being configured to connect to a first buss bar;

the at least two power modules are arranged in a topology pattern; and

the topology pattern forms at least one of the following: a half-bridge configuration, a full-bridge configuration, a common source configuration, a common drain configuration, a neutral point clamp configuration, and a three phase configuration.

5. The system of claim 4 , wherein:

each of the at least two power modules comprises a second terminal of the plurality of terminals; and

the second terminals of the at least two power modules being configured to connect to a second buss bar.

6. The system of claim 5 , wherein each of the power modules are configured such that current flows in a loop through the first terminal of the at least two power modules, the at least one power substrate of the at least two power modules, and the second terminal of the at least two power modules to reduce inductance.

7. A power module, comprising:

at least one power substrate;

a plurality of power devices electrically connected to the at least one power substrate;

the at least one power substrate extending in a width direction and a length direction;

a first set of the plurality of power devices arranged in a first row on the at least one power substrate along the width direction;

a second set of the plurality of power devices arranged in a second row on the at least one power substrate along the width direction, the first row being positioned at a different position along the length direction of the at least one power substrate then the second row; and

a plurality of terminals, each of the plurality of terminals extending in the width direction and the length direction of the at least one power substrate, and each of the plurality of terminals being positioned at a different position along the length direction of the at least one power substrate,

wherein at least one portion of a first one of the plurality of terminals is arranged at a higher elevation than at least one portion of a second one of the plurality of terminals.

8. The power module of claim 7 , further comprising:

a housing arranged on the at least one power substrate; and

an isolation structure arranged above and configured to be electrically isolated from the at least one power substrate,

wherein one of the plurality of terminals is connected to the isolation structure; and

wherein the isolation structure comprises at least one of the following: an embedded isolation component located in the housing, a secondary power substrate arranged on the at least one power substrate, a film isolation component arranged on the at least one power substrate, and a suspension isolation construction located in the housing.

9. The power module of claim 7 , wherein current flows in a loop through the power module through a first one of the plurality of terminals, the at least one power substrate, and a second one of the plurality of terminals to reduce inductance.

10. The power module of claim 7 wherein:

at least one of the plurality of terminals comprise a sheet metal construction;

each of the plurality of terminals extend in the width direction and the length direction of the at least one power substrate; and

each of the plurality of terminals being positioned at a different position along the length direction of the at least one power substrate.

11. A system comprising the power module of claim 7 , wherein:

the power module comprises at least two power modules and the at least two power modules are arranged and configured in parallel;

each of the at least two power modules comprises a first terminal of the plurality of terminals;

the first terminals of the at least two power modules being configured to connect to a first buss bar;

the at least two power modules are arranged in a topology pattern; and

the topology pattern forms at least one of the following: a half-bridge configuration, a full-bridge configuration, a common source configuration, a common drain configuration, a neutral point clamp configuration, and a three phase configuration.

12. The system of claim 11 , wherein:

each of the at least two power modules comprises a second terminal of the plurality of terminals; and

the second terminals of the at least two power modules being configured to connect to a second buss bar.

13. The system of claim 12 , wherein each of the power modules are configured such that current flows in a loop through the first terminal of the at least two power modules, the at least one power substrate of the at least two power modules, and the second terminal of the at least two power modules to reduce inductance.

14. A power module, comprising:

at least one power substrate;

a plurality of power devices electrically connected to the at least one power substrate;

the at least one power substrate extending in a width direction and a length direction;

a first set of the plurality of power devices arranged in a first row on the at least one power substrate along the width direction;

a second set of the plurality of power devices arranged in a second row on the at least one power substrate along the width direction, the first row being positioned at a different position along the length direction of the at least one power substrate then the second row; and

a plurality of terminals, each of the plurality of terminals extending in the width direction and the length direction of the at least one power substrate, and each of the plurality of terminals being positioned at a different position along the length direction of the at least one power substrate,

wherein current flows in a loop through the power module through a first one of the plurality of terminals, the at least one power substrate, and a second one of the plurality of terminals to reduce inductance.

15. The power module of claim 14 , further comprising:

a housing arranged on the at least one power substrate; and

an isolation structure arranged above and configured to be electrically isolated from the at least one power substrate,

wherein one of the plurality of terminals is connected to the isolation structure; and

wherein the isolation structure comprises at least one of the following: an embedded isolation component located in the housing, a secondary power substrate arranged on the at least one power substrate, a film isolation component arranged on the at least one power substrate, and a suspension isolation construction located in the housing.

16. The power module of claim 14 wherein:

at least one of the plurality of terminals comprise a sheet metal construction;

each of the plurality of terminals extending in the width direction and the length direction of the at least one power substrate; and

each of the plurality of terminals being positioned at a different position along the length direction of the at least one power substrate.

17. A system comprising the power module of claim 14 , wherein:

the power module comprises at least two power modules and the at least two power modules are arranged and configured in parallel;

each of the at least two power modules comprises a first terminal of the plurality of terminals;

the first terminals of the at least two power modules being configured to connect to a first buss bar;

the at least two power modules are arranged in a topology pattern; and

the topology pattern forms at least one of the following: a half-bridge configuration, a full-bridge configuration, a common source configuration, a common drain configuration, a neutral point clamp configuration, and a three phase configuration.

18. The system of claim 17 , wherein:

each of the at least two power modules comprises a second terminal of the plurality of terminals; and

the second terminals of the at least two power modules being configured to connect to a second buss bar.

19. The system of claim 18 , wherein the power modules are configured such that current flows in a loop through the first terminal of the at least two power modules, the at least one power substrate of the at least two power modules, and the second terminal of the at least two power modules to reduce inductance.

20. A system comprising:

at least two power modules;

each of the at least two power modules comprises at least one power substrate;

each of the at least two power modules comprises a plurality of power devices electrically connected to the at least one power substrate;

each of the at least two power modules comprises at least two terminals arranged on the at least one power substrate;

each of the at least two power modules comprises a first terminal of the at least two terminals; and

the first terminals of the at least two power modules being configured to connect to a first buss bar,

wherein the at least two power modules are arranged in a topology pattern; and

wherein the topology pattern forms at least one of the following: a half-bridge configuration, a full-bridge configuration, a common source configuration, a common drain configuration, a neutral point clamp configuration, and a three phase configuration.

21. The system of claim 20 , wherein:

each of the at least two power modules comprises a second terminal of the at least two terminals; and

the second terminals of the at least two power modules being configured to connect to a second buss bar.

22. The system of claim 21 , wherein each of the power modules are configured such that current flows in a loop through the first terminal of the at least two power modules, the at least one power substrate of the at least two power modules, and the second terminal of the at least two power modules to reduce inductance.

23. The system of claim 20 , wherein each of the at least two power modules further comprise:

a first set of the plurality of power devices arranged in a first row on the at least one power substrate along a width direction; and

a second set of the plurality of power devices arranged in a second row on the at least one power substrate along the width direction, the first row being positioned at a different position along a length direction of the at least one power substrate then the second row,

wherein the plurality of power devices and the at least two terminals are configured to increase current sharing by the plurality of power devices.

24. The system of claim 20 , wherein:

each of the at least two power modules comprises a housing arranged over the at least one power substrate;

each of the at least two power modules further comprise an isolation structure arranged above and configured to be electrically isolated from the at least one power substrate;

one of the at least two terminals is connected to the isolation structure; and

the isolation structure comprises at least one of the following: an embedded isolation component located in the housing, a secondary power substrate arranged on the at least one power substrate, a film isolation component arranged on the at least one power substrate, and a suspension isolation construction located in the housing.

Assignments (10)
NOTICE OF GRANT OF SECURITY INTEREST IN INTELLECTUAL PROPERTY Recorded Mar 26, 2026
From: WOLFSPEED, INC.
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 075280/0919 →
NOTICE OF GRANT OF SECURITY INTEREST IN INTELLECTUAL PROPERTY Recorded Sep 30, 2025
From: WOLFSPEED, INC.
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 072992/0467 →
NOTICE OF GRANT OF SECURITY INTEREST IN INTELLECTUAL PROPERTY Recorded Sep 30, 2025
From: WOLFSPEED, INC.
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 072992/0588 →
RELEASE OF SECURITY INTEREST IN INTELLECTUAL PROPERTY COLLATERAL AT REEL/FRAME NO. 64185/0755 Recorded Sep 30, 2025
From: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
To: WOLFSPEED, INC.
Reel/Frame 072989/0001 →
NOTICE OF GRANT OF SECURITY INTEREST IN INTELLECTUAL PROPERTY Recorded Sep 30, 2025
From: WOLFSPEED, INC.
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 072992/0113 →
NOTICE OF GRANT OF SECURITY INTEREST IN INTELLECTUAL PROPERTY Recorded Sep 30, 2025
From: WOLFSPEED, INC.
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 072992/0381 →
SECURITY INTEREST Recorded Jun 30, 2023
From: WOLFSPEED, INC.
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION
Reel/Frame 064185/0755 →
CHANGE OF NAME Recorded Feb 14, 2022
From: CREE, INC.
To: WOLFSPEED, INC.
Reel/Frame 059085/0667 →
MERGER Recorded Aug 13, 2021
From: CREE FAYETTEVILLE, INC.
To: CREE, INC.
Reel/Frame 057291/0406 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 14, 2019
From: MCPHERSON, BRICE; LOSTETTER, ALEX
To: CREE FAYETTEVILLE, INC.
Reel/Frame 048333/0524 →
Cited By (3)
US 12,374,660 US 12,489,041 US 12,500,585