High temperature equalized electrical parasitic power packaging method for many paralleled semiconductor power devices
View Patent ↗A four quadrant power module with lower substrate parallel power paths and upper substrate equidistant clock tree timing utilizing parallel leg construction in a captive fastener power module housing.
1. A four quadrant power module, comprising:
a power circuit including power devices arranged in a first quadrant power section, a second quadrant power section, third quadrant power section, and fourth quadrant power section; a first quadrant power section including power devices connected from the first power substrate to the third power substrate,
a second quadrant power section including power devices connected from the second power substrate to the fourth power substrate,
a third quadrant power section including power devices connected from the third power substrate to the fifth power substrate,
a fourth quadrant power section including power devices connected from the fourth power substrate to the sixth power substrate,
a first power contact connected to the first power substrate;
a second power contact connected to the second power substrate;
a third power contact connected to the third power substrate;
a fourth power contact connected to the fourth power substrate;
a fifth power contact connected to the fifth power substrate;
a sixth power contact connected to the sixth power substrate;
a first gate source interconnection substrate connected to at least one power device, the first gate source interconnection substrate including a first gate contact and a first source contact;
a second gate source interconnection substrate connected to at least one power device, the second gate source interconnection substrate including a second gate contact and a second source contact;
a third gate source interconnection substrate connected to at least one power device, the third gate source interconnection substrate including a third gate contact and a third source contact;
a fourth gate source interconnection substrate connected to at least one power device, the fourth gate source interconnection substrate including a fourth gate contact and a fourth source contact;
each upper interconnection substrate including traces in a clock tree equidistant path layout having at least one central trunks connected to branches.
2. The four quadrant power module of claim 1 , connected in a four quadrant full bridge connection.