Integrated circuit packaging system with dielectric support and method of manufacture thereof
View Patent ↗A method of manufacture of an integrated circuit packaging system includes: providing a package substrate having an outer pad at a substrate top side; forming a resist layer directly on the substrate top side, the resist layer having a resist top side with a channel array adjacent the outer pad exposed from the resist layer; mounting an integrated circuit having an active side facing the resist top side, the integrated circuit having a non-horizontal side adjacent the outer pad; and forming a dielectric between the active side and the resist top side, the dielectric having a fillet extended from the non-horizontal side to the substrate top side inside an inner extent of the channel array.
1. A method of manufacture of an integrated circuit packaging system comprising:
providing a package substrate having an outer pad at a substrate top side;
forming a resist layer directly on the substrate top side, the resist layer having a resist top side with a channel array adjacent the outer pad exposed from the resist layer;
mounting an integrated circuit having an active side facing the resist top side, the integrated circuit having a non-horizontal side adjacent the outer pad, the channel array extended radially from the integrated circuit and beyond the outer pad for eliminating underfill bleed on to the outer pad; and
forming a dielectric between the active side and the resist top side, the dielectric having a fillet extended from the non-horizontal side to the substrate top side.
2. The method as claimed in claim 1 wherein forming the resist layer includes forming the channel array having a primary channel between the integrated circuit and the outer pad.
3. The method as claimed in claim 1 wherein forming the resist layer includes forming the channel array having a primary channel between the outer pad and another of the outer pad.
4. The method as claimed in claim 1 wherein forming the resist layer includes forming the channel array having a primary channel having a primary outer side with a length greater than a width of a primary base of the primary channel, the primary base between the outer pad and another of the outer pad.
5. The method as claimed in claim 1 wherein forming the resist layer includes forming the channel array having a primary channel and an auxiliary channel, the primary channel between the integrated circuit and the outer pad, the auxiliary channel connected to the primary channel at a medium intersection of the channel array.
6. A method of manufacture of an integrated circuit packaging system comprising:
providing a package substrate having an inner pad and an outer pad that are at a substrate top side;
forming a resist layer directly on the substrate top side, the resist layer having a resist top side with a channel array adjacent the outer pad exposed from the resist layer;
mounting an integrated circuit having an active side facing the resist top side and having a connector attached to the inner pad exposed from the resist layer, the integrated circuit having a non-horizontal side adjacent the outer pad, the channel array extended radially from the integrated circuit and beyond the outer pad for eliminating underfill bleed on to the outer pad; and
forming a dielectric between the active side and the resist top side, the dielectric having a fillet extended from the non-horizontal side to the substrate top side.
7. The method as claimed in claim 6 wherein forming the resist layer includes forming the channel array having a primary channel and an auxiliary channel perpendicular to the primary channel, the primary channel between the integrated circuit and the outer pad.
8. The method as claimed in claim 6 wherein forming the resist layer includes forming the channel array having a primary channel and an auxiliary channel with a width greater than a width of the primary channel, the primary channel between the integrated circuit and the outer pad.
9. The method as claimed in claim 6 wherein forming the resist layer includes forming the channel array having a primary channel with a primary outer side at a resist perimeter region of the resist layer.
10. The method as claimed in claim 6 wherein forming the resist layer includes forming the channel array having a primary channel and an auxiliary channel intersecting the primary channel at a largest intersection of the channel array, the primary channel between the outer pad and another of the outer pad.
11. An integrated circuit packaging system comprising:
a package substrate having an outer pad at a substrate top side;
a resist layer directly on the substrate top side, the resist layer having a resist top side with a channel array adjacent the outer pad exposed from the resist layer;
an integrated circuit having an active side facing the resist top side, the integrated circuit having a non-horizontal side adjacent the outer pad, the channel array extended radially from the integrated circuit and beyond the outer pad for eliminating underfill bleed on to the outer pad; and
a dielectric between the active side and the resist top side, the dielectric having a fillet extended from the non-horizontal side to the substrate top side.
12. The system as claimed in claim 11 wherein the resist layer includes the channel array having a primary channel between the integrated circuit and the outer pad.
13. The system as claimed in claim 11 wherein the resist layer includes the channel array having a primary channel between the outer pad and another of the outer pad.
14. The system as claimed in claim 11 wherein the resist layer includes the channel array having a primary channel having a primary outer side with a length greater than a width of a primary base between the outer pad and another of the outer pad.
15. The system as claimed in claim 11 wherein the resist layer includes the channel array having a primary channel and an auxiliary channel connected to the primary channel at a medium intersection of the channel array, the primary channel between the integrated circuit and the outer pad.
16. The system as claimed in claim 11 wherein:
the package substrate includes an inner pad at the substrate top side; and
the integrated circuit includes a connector attached to the inner pad exposed from the resist layer.
17. The system as claimed in claim 16 wherein the resist layer includes the channel array having a primary channel and an auxiliary channel perpendicular to the primary channel, the primary channel between the integrated circuit and the outer pad.
18. The system as claimed in claim 16 wherein the resist layer includes the channel array having a primary channel and an auxiliary channel with a width greater than a width of the primary channel, the primary channel between the integrated circuit and the outer pad.
19. The system as claimed in claim 16 wherein the resist layer includes the channel array having a primary channel with a primary outer side at a resist perimeter region of the resist layer.
20. The system as claimed in claim 16 wherein the resist layer includes the channel array having a primary channel and an auxiliary channel intersecting the primary channel at a largest intersection, the primary channel between the outer pad and another of the outer pad.