Integrated circuit packaging system with vertical interconnection and method of manufacture thereof

1. A method of manufacture of an integrated circuit packaging system comprising:

forming an outer contact pad having an outer pad top side;

mounting an integrated circuit above the outer pad top side;

attaching a device connector to the integrated circuit;

forming an encapsulation having an encapsulation top side and an encapsulation bottom side, the encapsulation bottom side partially exposed and the encapsulation directly on the device connector and over the integrated circuit;

forming a vertical interconnect through the encapsulation, the vertical interconnect having an interconnect bottom side directly on the outer pad top side and an interconnect top side exposed from the encapsulation; and

attaching an external connector on a side of the outer contact pad opposite the outer pad top side with the vertical interconnect directly thereon.

2. The method as claimed in claim 1 further comprising providing a package substrate having a substrate top side with the integrated circuit thereover, the substrate top side coplanar with the outer pad top side.

3. The method as claimed in claim 1 wherein forming the encapsulation includes forming the encapsulation having an encapsulation outer protrusion with an outer protrusion bottom side directly on the outer pad top side.

4. The method as claimed in claim 1 wherein attaching the device connector to the integrated circuit includes attaching the device connector to the outer pad top side and the integrated circuit.

5. The method as claimed in claim 1 wherein forming the encapsulation includes forming the encapsulation having an encapsulation cavity with the outer contact pad within the encapsulation cavity.

6. A method of manufacture of an integrated circuit packaging system comprising:

forming an outer contact pad having an outer pad top side;

mounting an integrated circuit above the outer pad top side;

attaching a device connector to the integrated circuit;

forming an encapsulation having an encapsulation top side and an encapsulation bottom side, the encapsulation bottom side partially exposed and the encapsulation directly on the device connector and the integrated circuit;

forming a vertical interconnect through the encapsulation, the vertical interconnect having an interconnect bottom side directly on the outer pad top side and an interconnect top side exposed from the encapsulation and coplanar with the encapsulation top side; and

attaching an external connector on a side of the outer contact pad opposite the outer pad top side with the vertical interconnect directly thereon.

7. The method as claimed in claim 6 wherein forming the outer contact pad includes forming the outer contact pad having an outer pad recess with the vertical interconnect within the outer pad recess.

8. The method as claimed in claim 6 wherein forming the outer contact pad includes forming the outer contact pad having an outer pad lower end protruding from the encapsulation bottom side.

9. The method as claimed in claim 6 wherein forming the outer contact pad includes forming the outer contact pad having an outer pad base segment below an outer pad overhang segment and directly on an encapsulation protrusion of the encapsulation.

10. The method as claimed in claim 6 wherein forming the outer contact pad includes forming the outer contact pad having an outer pad upper end and an outer pad lower end exposed from the encapsulation, the outer pad lower end having a width greater than a width of the outer pad upper end.

11. An integrated circuit packaging system comprising:

an outer contact pad having an outer pad top side;

an integrated circuit above the outer pad top side;

a device connector attached to the integrated circuit;

an encapsulation having an encapsulation top side and an encapsulation bottom side, the encapsulation bottom side partially exposed and the encapsulation directly on the device connector and the integrated circuit;

a vertical interconnect through the encapsulation, the vertical interconnect having an interconnect bottom side directly on the outer pad top side and an interconnect top side exposed from the encapsulation; and

an external connector attached on a side of the outer contact pad opposite the outer pad top side with the vertical interconnect directly thereon.

12. The system as claimed in claim 11 further comprising a package substrate having a substrate top side with the integrated circuit thereover, the substrate top side coplanar with the outer pad top side.

13. The system as claimed in claim 11 wherein the encapsulation includes an encapsulation outer protrusion with an outer protrusion bottom side directly on the outer pad top side.

14. The system as claimed in claim 11 wherein the a device connector is attached to the outer pad top side and the integrated circuit.

15. The system as claimed in claim 11 wherein the encapsulation includes an encapsulation cavity with the outer contact pad within the encapsulation cavity.

16. The system as claimed in claim 11 wherein the vertical interconnect includes the interconnect top side coplanar with the encapsulation top side.

17. The system as claimed in claim 16 wherein the outer contact pad includes an outer pad recess with the vertical interconnect within the outer pad recess.

18. The system as claimed in claim 16 wherein the outer contact pad includes an outer pad lower end protruding from the encapsulation bottom side.

19. The system as claimed in claim 16 wherein the outer contact pad includes an outer pad base segment below an outer pad overhang segment and directly on an encapsulation protrusion of the encapsulation.

20. The system as claimed in claim 16 wherein the outer contact pad includes an outer pad upper end and an outer pad lower end exposed from the encapsulation, the outer pad lower end having a width greater than a width of the outer pad upper end.