IP Library Granted Patent US 8,749,294
Granted Patent B2
US 8,749,294 · App. 12/986,968 · Granted Jun 10, 2014

Low pin count high voltage ultrasound transmitter and method therefor

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,749,294
App. No.
12/986,968
Granted
Jun 10, 2014
Kind
B2
Abstract

An integrated single channel or multi-channel ultrasound transmitter that minimizes the number of input connections to a controller such as an FPGA, field programmable gate array, or a custom integrated circuit in an ultrasound system. The method is accomplished by integrating, in low voltage logic, a means to store and or program the patterns required for the transmitter output. The number of logic input connections can be further reduced by further integrating, in low voltage logic, programmable individual time delays and frequency divider for each transmitter output.

Claims (32)

1. An ultrasound transmitter comprising:

control logic circuitry having a single input trigger to switch to at least two different voltage levels, wherein the control circuitry comprises:

a shift register for each voltage level output of the transmitter, wherein the shift register defines a high voltage output pattern for each voltage level output of the transmitter; and

a latch coupled to the shift register for sending data to the shift register;

a high voltage output driver circuit coupled to the control logic circuitry;

a counter having an input coupled to the single input trigger and an output coupled to each shift register; and

a frequency divider having an input coupled to the single input trigger and an output coupled to the counter; and

wherein an oscillator signal is coupled to an input of the frequency divider and an input of the counter.

2. The ultrasound transmitter of claim 1 , wherein the control logic circuitry switches between two voltage levels, where the two voltage levels is one of: a positive voltage and ground, a negative voltage and ground, or a positive voltage and a negative voltage.

3. The ultrasound transmitter of claim 1 , wherein the control logic circuitry switches between three different voltage levels, the three different voltage levels being a positive voltage, a negative voltage, and ground.

4. The ultrasound transmitter of claim 1 , wherein the control logic circuitry switches between five different voltage levels, the five different voltage levels being a first positive voltage, a second positive voltage, a first negative voltage, a second negative voltage, and ground.

5. The ultrasound transmitter of claim 1 , wherein the control logic circuitry switches between seven different voltage levels, the seven different voltage levels being a first positive voltage, a second positive voltage, a third positive voltage, a first negative voltage, a second negative voltage, a third negative voltage, and ground.

6. The ultrasound transmitter of claim 1 , wherein the high voltage output circuit which outputs two voltage levels comprises:

a P-type transistor having a first terminal coupled to a first voltage level, a second terminal coupled to the control logic circuitry, and a third terminal coupled to an output terminal of the ultrasound transmitter; and

an N-type transistor having a first terminal coupled to the output terminal of the ultrasound transmitter, a second terminal coupled to the control logic circuitry, and a third terminal coupled to a second voltage level.

7. The ultrasound transmitter of claim 1 , wherein the high voltage output circuit which outputs three voltage levels comprises:

a first P-type transistor having a first terminal coupled to a first voltage level, a second terminal coupled to the control logic circuitry, and a third terminal coupled to an output terminal of the ultrasound transmitter;

a first N-type transistor having a first terminal coupled to the output terminal of the ultrasound transmitter, a second terminal coupled to the control logic circuitry, and a third terminal coupled to a second voltage level;

a second P-type transistor having a first terminal coupled to ground, a second terminal coupled to the control logic circuitry, and a third terminal coupled to an output terminal of the ultrasound transmitter;

a second N-type transistor having a first terminal coupled to the output terminal of the ultrasound transmitter, a second terminal coupled to the control logic circuitry, and a third terminal coupled to ground;

a first diode coupled to the third terminal of the second N-type transistor and to the output terminal of the ultrasound transmitter; and

a second diode coupled to the first terminal of the second N-type transistor and to the output terminal of the ultrasound transmitter.

8. The ultrasound transmitter of claim 1 , wherein the high voltage output circuit which outputs five voltage levels comprises:

a first P-type transistor having a first terminal coupled to a first voltage level, a second terminal coupled to the control logic circuitry, and a third terminal coupled to an output terminal of the ultrasound transmitter;

a first N-type transistor having a first terminal coupled to the output terminal of the ultrasound transmitter, a second terminal coupled to the control logic circuitry, and a third terminal coupled to a second voltage level;

a second P-type transistor having a first terminal coupled to a third voltage level, a second terminal coupled to the control logic circuitry, and a third terminal coupled to an output terminal of the ultrasound transmitter;

a second N-type transistor having a first terminal coupled to the output terminal of the ultrasound transmitter, a second terminal coupled to the control logic circuitry, and a third terminal coupled to a fourth voltage source;

a third P-type transistor having a first terminal coupled to ground, a second terminal coupled to the control logic circuitry, and a third terminal coupled to an output terminal of the ultrasound transmitter;

a third N-type transistor having a first terminal coupled to the output terminal of the ultrasound transmitter, a second terminal coupled to the control logic circuitry, and a third terminal coupled to ground;

a first pair of diodes coupled to the first P-type transistor and the first N-type transistor and the output terminal of the ultrasound transmitter;

a second pair of diodes coupled to the second P-type transistor and the second N-type transistor and the output terminal of the ultrasound transmitter; and

a third pair of diodes coupled to the third P-type transistor and the third N-type transistor and the output terminal of the ultrasound transmitter.

Assignments (17)
RELEASE OF SECURITY INTEREST Recorded Mar 14, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 060894/0437 →
RELEASE OF SECURITY INTEREST Recorded Mar 11, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059363/0001 →
RELEASE OF SECURITY INTEREST Recorded Mar 10, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059863/0400 →
RELEASE OF SECURITY INTEREST Recorded Mar 9, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059358/0001 →
RELEASE OF SECURITY INTEREST Recorded Feb 28, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED
Reel/Frame 059666/0545 →
RELEASE OF SECURITY INTEREST Recorded Feb 25, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059333/0222 →
SECURITY INTEREST Recorded Jun 4, 2021
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 057935/0474 →
SECURITY INTEREST Recorded Dec 24, 2020
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 055671/0612 →
SECURITY INTEREST Recorded Jun 5, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 053468/0705 →
RELEASE OF SECURITY INTEREST Recorded May 30, 2020
From: JPMORGAN CHASE BANK, N.A, AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 053466/0011 →
SECURITY INTEREST Recorded Apr 24, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 053311/0305 →
SECURITY INTEREST Recorded Sep 18, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 047103/0206 →
SECURITY INTEREST Recorded Jun 25, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 046426/0001 →
SECURITY INTEREST Recorded Feb 10, 2017
From: MICROCHIP TECHNOLOGY INCORPORATED
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 041675/0617 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 22, 2014
From: SUPERTEX LLC
To: MICROCHIP TECHNOLOGY INCORPORATED
Reel/Frame 034689/0257 →
CHANGE OF NAME Recorded Dec 19, 2014
From: SUPERTEX, INC.
To: SUPERTEX LLC
Reel/Frame 034682/0134 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 7, 2011
From: LAI, JIMES
To: SUPERTEX INC
Reel/Frame 025602/0796 →