Dual contact trench resistor in shallow trench isolation (STI) and methods of manufacture
The invention relates to a semiconductor structures and methods of manufacture and, more particularly, to a dual contact trench resistor in shallow trench isolation (STI) and methods of manufacture. In a first aspect of the invention, a method comprises forming a trench in a substrate; forming a first insulator layer within the trench; forming a first electrode within the trench, on the first insulator layer, and isolated from the substrate by the first insulator layer; forming a second insulator layer within the trench and on the first electrode; and forming a second electrode within the trench, on the second insulator layer, and isolated from the substrate by the first insulator layer and the second insulator layer.
1. A method, comprising:
forming a trench in a substrate;
forming a first insulator layer within the trench;
forming a first electrode within the trench, on the first insulator layer, and isolated from the substrate by the first insulator layer;
forming a second insulator layer within the trench and on the first electrode, wherein the second insulator layer is formed with a sloped region having a thickness greater than vertical regions; and
forming a second electrode within the trench, on the second insulator layer, and isolated from the substrate by the first insulator layer and the second insulator layer.
2. The method of claim 1 , wherein:
the first electrode and the second electrode are independent from each other; and
the second electrode is in contact with the first electrode at an exposed portion of the first electrode.
3. The method of claim 1 , wherein the forming of the first electrode and the second electrode comprises depositing one of a polysilicon material, a metal, and a metal silicide.
4. The method of claim 1 , further comprising forming metal contacts on exposed regions of the first electrode and the second electrode.
5. The method of claim 1 , further comprising forming a sidewall spacer comprising oxide within the trench between the second electrode and the second insulator layer.
6. The method of claim 1 , wherein the forming of the trench comprises forming the trench through a shallow trench isolation (STI) structure and extending into the underlying substrate.
7. The method of claim 1 , wherein the forming of the first electrode comprises depositing a polysilicon material into the trench which pinches off a portion of the trench such that the forming of the second electrode comprises depositing the polysilicon material into another portion of the trench.
8. The method of claim 1 , wherein the forming of the first electrode and the second electrode comprises forming the first electrode and the second electrode such that the first electrode and the second electrode are surrounded, at least partially, by a STI structure.
9. The method of claim 1 , further comprising forming at least two STI structures, wherein the trench is formed in one of the STI structures.
10. The method of claim 1 , further comprising one of etching and polishing the first electrode, the first insulator layer, the second electrode, and the second insulator layer to a surface of a structure.
11. The method of claim 1 , wherein the trench is scalable to one of increase and decrease a surface area of the first electrode and the second electrode thereby one of increasing and decreasing, respectively, a resistance of the structure.
12. A method, comprising:
forming a shallow trench isolation (STI) structure in a substrate;
forming a trench through the STI and extending into the substrate;
forming a first insulator layer within the trench with a sloped sidewall greater than 0° which corresponds to a shoulder of the trench;
forming a first electrode within the trench, on the first insulator layer, and isolated from the substrate by the first insulator layer;
forming a second insulator layer within the trench and on the first electrode with a thickness at the sloped sidewall being greater than a thickness of vertical regions;
performing an anisotropic etch to remove the second insulator layer at a bottom of the trench and on a surface of the first electrode outside of the trench; and
forming a second electrode within the trench, on the second insulator layer, and isolated from the substrate by the first insulator layer and the second insulator layer, and the second electrode being in contact with the first electrode at the bottom of the trench,
wherein the forming of the trench comprises scaling the trench to one of increase and decrease a surface area of the first electrode and the second electrode thereby one of increasing and decreasing, respectively, a resistance of a structure.
13. The method of claim 12 , wherein the forming of the first electrode and the second electrode comprises depositing one of a polysilicon material, a metal, and a metal silicide.
14. The method of claim 12 , further comprising forming metal contacts on exposed regions of the first electrode and the second electrode.
15. The method of claim 12 , further comprising forming a sidewall spacer comprising oxide within the trench between the second electrode and the second insulator layer.
16. The method of claim 12 , wherein the forming of the first electrode comprises depositing a polysilicon material into the trench which pinches off a portion of the trench such that the forming of the second electrode comprises depositing the polysilicon material into another portion of the trench.
17. A structure comprising:
a first insulator layer provided within a trench;
a first electrode provided within the trench, on the first insulator layer, and isolated from a substrate by the first insulator layer;
a second insulator layer provided within the trench and on the first electrode,
the second insulator layer having a greater thickness at a slope region corresponding to a shoulder of the trench than a thickness at a vertical region, where the slope region is greater than 0°; and
a second electrode provided within the trench, on the second insulator layer, and isolated from the substrate by the first insulator layer and the second insulator layer.
18. The structure of claim 17 , wherein:
the first electrode and the second electrode are independent from each other;
the first electrode and the second electrode are formed from one of a polysilicon material, a metal, and a metal silicide;
the first electrode and the second electrode are connected to metal contacts;
the structure further comprises a sidewall spacer comprising oxide within the trench between the second electrode and the second insulator layer;
the trench is formed through a shallow trench isolation (STI) structure and extends into the underlying substrate;
the first electrode pinches off a portion of the trench such that the second electrode is within another portion of the trench;
the first electrode and the second electrode are surrounded, at least partially, by an STI structure;
the structure further comprises at least two STI structures, wherein the trench is formed in one of the STI structures; and
the STI structures protrude above a surface of the substrate and the trench extends into the substrate.
19. The structure of claim 17 , wherein the trench is scalable to one of increase and decrease a surface area of the first electrode and the second electrode thereby one of increasing and decreasing, respectively, a resistance of the structure.
20. The method of claim 1 , wherein a slope of the sloped region is 60° to 80°.
21. The method of claim 20 , wherein the slope of the sloped region is 70°.
22. The method of claim 1 , wherein the second insulator layer is etched using an anisotropic etching process.
23. The method of claim 22 , wherein the anisotropic etching process removes the second insulator layer at a bottom of the trench and on a surface of the first electrode outside of the trench.
24. The method of claim 23 , wherein the second insulator layer remains on a shoulder after the anisotropic etching process due to its thickness.
25. The method of claim 17 , wherein the sloped sidewall is 60° to 80° and an anisotropic etching process removes the second insulator layer at a bottom of the trench and on a surface of the first electrode outside of the trench.