Composition and method for low temperature deposition of silicon-containing films
View Patent ↗This invention relates to silicon precursor compositions for forming silicon-containing films by low temperature (e.g., <300° C.) chemical vapor deposition processes for fabrication of ULSI devices and device structures. Such silicon precursor compositions comprise at least one disilane derivative compound that is fully substituted with alkylamino and/or dialkylamino functional groups.
1. A composition comprising a disilane compound that is fully substituted with dialkylamino (—N(R 2 )) functional groups, wherein each R is independently selected from the group consisting of C 3 -C 5 alkyl, further comprising a solvent for said disilane compound.
2. The composition of claim 1 , wherein said solvent comprises a hydrocarbon solvent.
3. The composition of claim 1 , wherein said solvent comprises an alkylamine solvent.
4. A method of forming a silicon-containing film on a substrate, comprising contacting the substrate under vapor deposition conditions with a composition comprising a disilane compound that is fully substituted with dialkylamino (—N(R 2 )) functional groups, wherein each R is independently selected from the group consisting of C 3 -C 5 alkyl, wherein the vapor deposition conditions comprise temperature in a range of from 350° C. to 500° C.
5. A method of forming a silicon-containing film on a substrate, comprising contacting the substrate under vapor deposition conditions with a composition comprising a disilane compound that is fully substituted with dialkylamino (—N(R 2 )) functional groups, wherein each R is independently selected from the group consisting of C 3 -C 5 alkyl, wherein the substrate is contacted in said contacting with a co-reactant selected from the group consisting of:
oxygen;
ozone;
CO 2 ;
nitrogen;
ammonia;
compounds of the formula R 3 Si—N 3 wherein each R is independently selected from C 1 -C 3 alkyl;
compounds of the formula R—N═NR′ wherein each R is independently selected from C 1 -C 3 alkyl and R′ is R or H;
compounds of the formula R—N═N + ═NR′ wherein each R is independently selected from C 1 -C 3 alkyl and R′ is R or H;
dinitrogen oxide;
hydrogen;
silane;
disilane;
hafnium sources; and
zirconium sources and
wherein the silicon-containing film comprises a high k gate silicate film.