Integrated circuit package-on-package system with underfilling structures and method of manufacture thereof
View Patent ↗A method of manufacturing of an integrated circuit packaging system includes: providing a bottom package in a cavity in a central region of the bottom package having inter-package interconnects in the cavity; forming a vent on an inter-package connection side of the bottom package from an exterior of the bottom package to the cavity; mounting a top package on the inter-package interconnects; and applying an underfill through the vent and into the cavity.
1. A method of manufacture of an integrated circuit packaging system comprising:
providing a bottom package with a cavity in a central region of the bottom package having inter-package interconnects in the cavity;
forming a vent on an inter-package connection side of the bottom package from an exterior of the bottom package to the cavity;
mounting a top package on the inter-package interconnects; and
applying an underfill through the vent and into the cavity.
2. The method as claimed in claim 1 wherein forming the vent includes forming a further vent with a different geometry than the vent.
3. The method as claimed in claim 1 further comprising:
forming bumps on a peripheral region of the inter-package connection side of the bottom package; and
wherein:
mounting the top package includes mounting the top package on the bumps to form a marginal gap between the top package and the bottom package.
4. The method as claimed in claim 1 wherein forming the vent includes forming a wide groove on the inter-package connection side from the exterior of the bottom package, exposing the inter-package interconnects in the cavity.
5. The method as claimed in claim 1 wherein forming the vent includes forming a pair of the vents from opposite sides of the bottom package.
6. A method of manufacture of an integrated circuit packaging system comprising:
providing a bottom package with a cavity in a central region of the bottom package having inter-package interconnects in the cavity, the cavity exposing an interposer;
forming a vent on an inter-package connection side of the bottom package from an exterior of the bottom package to the cavity;
mounting a top package on the inter-package interconnects, the inter-package connection side facing the top package; and
applying an underfill through the vent and into the cavity.
7. The method as claimed in claim 6 wherein forming the vent includes forming vents on each of peripheral sides of the bottom package.
8. The method as claimed in claim 6 wherein mounting the top package includes forming a marginal gap between the top package and the bottom package for increasing flow of the underfill.
9. The method as claimed in claim 6 wherein forming the vent includes forming the vent before the bottom package is cured.
10. The method as claimed in claim 6 wherein forming the vent includes forming the vent having a vent depth with varying height.