Integrated circuit packaging system with interconnects and method of manufacture thereof
View Patent ↗A method of manufacture of an integrated circuit packaging system includes: providing a package carrier having a carrier top side; mounting an integrated circuit over the carrier top side; attaching a bottom attachment directly on the integrated circuit; dragging a sandwich connector from the bottom attachment, the sandwich connector having a connector diameter; and attaching a top attachment directly on the sandwich connector, the top attachment wider than the bottom attachment.
1. A method of manufacture of an integrated circuit packaging system comprising:
providing a package carrier having a carrier top side;
mounting an integrated circuit over the carrier top side;
attaching a ball-shaped bottom attachment having a pre-determined diameter and a height as measured from a top surface of a contact pad of the integrated circuit, directly on the integrated circuit;
attaching a first end of a sandwich connector to the bottom attachment, the sandwich connector having a connector diameter and an indentation, wherein the connector diameter is smaller than the bottom attachment height, and wherein the indentation is above and off-center from the bottom attachment;
attaching a second end of the sandwich connector to the carrier top side; and
attaching a top attachment directly on the first end of the sandwich connector and over the bottom attachment, the top attachment wider than the connector diameter and the diameter of the bottom attachment, and wherein the top attachment and the bottom attachment have the same central axis in both x and y directions as seen in a plan view.
2. The method as claimed in claim 1 wherein attaching the first end of the sandwich connector to the bottom attachment includes attaching the sandwich connector along a peripheral side of the integrated circuit.
3. The method as claimed in claim 1 further comprising forming an encapsulation over the top attachment and the sandwich connector.
4. The method as claimed in claim 1 wherein attaching the first end of the sandwich connector to the bottom attachment includes attaching the sandwich connector approximately perpendicular to the bottom attachment and approximately parallel to an active side of the integrated circuit.
5. An integrated circuit packaging system comprising:
a package carrier having a carrier top side;
an integrated circuit over the carrier top side;
a ball-shaped bottom attachment having a pre-determined diameter and a height as measured from a top surface of a contact pad of the integrated circuit, directly on the integrated circuit;
a sandwich connector attached to the bottom attachment, the sandwich connector having a connector diameter and an indentation, wherein the connector diameter is smaller than the bottom attachment height, and wherein the indentation is above and off-center from the bottom attachment; and
a top attachment directly on an end portion of the sandwich connector and over the bottom attachment, the top attachment wider than the connector diameter and the diameter of the bottom attachment, and wherein the top attachment and the bottom attachment have the same central axis in both x and y directions as seen in a plan view.
6. The system as claimed in claim 5 wherein the sandwich connector is approximately perpendicular to the bottom attachment.
7. The system as claimed in claim 5 wherein the sandwich connector includes the sandwich connector attached to the carrier top side.
8. The system as claimed in claim 7 wherein the sandwich connector is along a peripheral side of the integrated circuit.
9. The system as claimed in claim 7 further comprising an encapsulation over the top attachment and the sandwich connector.
10. The system as claimed in claim 7 wherein the sandwich connector is approximately parallel to an active side of the integrated circuit.