Integrated circuit packaging system with locking interconnects and method of manufacture thereof
View Patent ↗A method of manufacture of an integrated circuit packaging system includes: providing a lead frame having a hole, a lead extension, and an exterior pad under the lead extension with the hole abutting the lead extension; connecting an electrical interconnect between an integrated circuit and the lead extension; forming an encapsulation over the integrated circuit and surrounding the electrical interconnect and through the hole; and removing a bottom portion of the lead frame resulting in a stand-off lead from the lead extension with the exterior pad on the stand-off lead.
1. An integrated circuit packaging system comprising:
a stand-off lead having a lead protrusion;
an exterior pad on and under the stand-off lead;
an integrated circuit connected to the stand-off lead; and
an encapsulation over the integrated circuit with the encapsulation coplanar to a portion of the exterior pad and not coplanar with other portion of the exterior pad;
the encapsulation includes a recessed edge; and
the lead protrusion extends to the recessed edge at a portion of the perimeter of the stand-off lead and the encapsulation extends below the lead protrusion at other portion of the perimeter of the stand-off lead.
2. The system as claimed in claim 1 further comprising:
an interior pad on and over the stand-off lead; and
wherein:
the integrated circuit is connected to the interior pad.
3. The system as claimed in claim 2 further comprising an electrical interconnect between the integrated circuit and the interior pad.
4. An integrated circuit packaging system comprising:
a stand-off lead having a lead protrusion;
an exterior pad on and under the stand-off lead;
an integrated circuit connected to the stand-off lead; and
an encapsulation over the integrated circuit with the encapsulation coplanar to a portion of the exterior pad and not coplanar with other portion of the exterior pad
a stand-off die paddle, having a paddle protrusion, adjacent to the stand-off lead; and
wherein:
the integrated circuit is mounted to the stand-off die paddle;
the encapsulation includes a recessed edge; and
the paddle protrusion extends to the recessed edge at a portion of a perimeter of the stand-off die paddle and within the encapsulation at other portion of the perimeter portion of the stand-off die paddle.
5. The system as claimed in claim 4 ,
wherein:
the recessed edge is between the paddle protrusion and the lead protrusion.
6. The system as claimed in claim 4 ,
wherein:
the encapsulation includes a bottom side below both the paddle protrusion and the lead protrusion.
7. The system as claimed in claim 4 , further comprising:
an interior pad on and over the stand-off lead; and
wherein:
the integrated circuit is connected to the interior pad.
8. The system as claimed in claim 7 , further comprising:
an electrical interconnect between the integrated circuit and the interior pad.
9. An integrated circuit packaging system comprising:
a stand-off lead having a lead protrusion;
an exterior pad on and under the stand-off lead;
an integrated circuit connected to the stand-off lead; and
an encapsulation over the integrated circuit with the encapsulation coplanar to a portion of the exterior pad and not coplanar with other portion of the exterior pad;
a stand-off die paddle, having a paddle protrusion, adjacent to the stand-off lead;
an exterior paddle pad is on and under the stand-off die paddle; and
wherein:
the encapsulation is coplanar with the exterior paddle pad at a portion of the perimeter of the stand-off die paddle and not coplanar with the exterior paddle pad at other portion of the perimeter of the stand-off die paddle.
10. The system as claimed in claim 9
wherein:
the exterior pad is coplanar with the exterior paddle pad.
11. The system as claimed in claim 9 , further comprising:
an interior pad on and over the stand-off lead; and
wherein:
the integrated circuit is connected to the interior pad.
12. The system as claimed in claim 11 , further comprising:
an electrical interconnect between the integrated circuit and the interior pad.
13. The system as claimed in claim 9 , wherein:
the recessed edge is between the paddle protrusion and the lead protrusion.
14. The system as claimed in claim 9 , wherein:
the encapsulation includes a bottom side below both the paddle protrusion and the lead protrusion.