Integrated circuit packaging system with interconnect and method of manufacture thereof
View Patent ↗A method of manufacture of an integrated circuit packaging system includes: providing a base carrier; providing a first integrated circuit having a first integrated circuit inactive side and a first integrated circuit active side; coupling a second integrated circuit, having a second integrated circuit inactive side and a second integrated circuit active side, to the first integrated circuit in an active-to-active configuration; attaching the first integrated circuit over the base carrier; attaching a redistribution structure over the first integrated circuit; and forming a base encapsulation over the redistribution structure, the base encapsulation having a recess partially exposing the redistribution structure.
1. A method of manufacture of an integrated circuit packaging system comprising:
providing a base carrier;
providing a first integrated circuit having a first integrated circuit inactive side and a first integrated circuit active side;
coupling a second integrated circuit, having a second integrated circuit inactive side and a second integrated circuit active side, to the first integrated circuit in an active-to-active configuration;
attaching the first integrated circuit over the base carrier;
attaching a redistribution structure directly on the second integrated circuit inactive side; and
forming a base encapsulation over the redistribution structure, the base encapsulation having a recess partially covering and partially exposing the redistribution structure.
2. The method as claimed in claim 1 further comprising coupling a first base connector between the first integrated circuit active side and the base carrier.
3. The method as claimed in claim 1 , further comprising:
attaching a second base connector to the redistribution structure and the base carrier; and
forming a barrier directly on the redistribution structure and covering a portion of the second base connector.
4. A method of manufacture of an integrated circuit packaging system comprising:
providing a base carrier;
providing a first integrated circuit having a first integrated circuit inactive side and a first integrated circuit active side;
attaching a first device-device connector to the first integrated circuit active side;
coupling a second integrated circuit, having a second integrated circuit inactive side and a second integrated circuit active side, to the first integrated circuit in an active-to-active configuration with the first device-device connector;
attaching the first integrated circuit over the base carrier;
attaching a redistribution structure on the second integrated circuit inactive side; and
forming a base encapsulation over the redistribution structure, the base encapsulation having a recess partially exposing and partially covering the redistribution structure.
5. The method as claimed in claim 4 further comprising attaching a first base connector to the first integrated circuit and the base carrier.
6. The method as claimed in claim 4 wherein providing the base carrier includes providing the base carrier having a window with a portion of the first integrated circuit within the window.
7. An integrated circuit packaging system comprising:
a base carrier;
a first integrated circuit having a first integrated circuit inactive side and a first integrated circuit active side;
a second integrated circuit, having a second integrated circuit inactive side and a second integrated circuit active side, to the first integrated circuit in an active-to-active configuration with the first integrated circuit over the base carrier;
a redistribution structure directly on the second integrated circuit inactive side; and
a base encapsulation over the redistribution structure, the base encapsulation having a recess partially exposing and partially covering the redistribution structure.
8. The system as claimed in claim 7 further comprising a first base connector between the first integrated circuit active side and the base carrier.
9. The system as claimed in claim 7 further comprising:
a second base connector attached to the redistribution structure and the base carrier; and
a barrier directly on the redistribution structure and covering a portion of the second base connector.
10. The system as claimed in claim 7 further comprising:
a first device-device connector attached to the first integrated circuit active side; and
wherein:
the second integrated circuit is coupled to the first integrated circuit with the first device-device connector.
11. The system as claimed in claim 10 further comprising a first base connector attached to the first integrated circuit and the base carrier.
12. The system as claimed in claim 10 wherein the base carrier includes a window with a portion of the first integrated circuit within the window.