Matched coefficient of thermal expansion for an electrostatic chuck
View Patent ↗An apparatus and method are provided for selecting materials for forming an electrostatic clamp. The electrostatic clamp has a backing plate having a first coefficient of thermal expansion, wherein the backing plate provides structural support and rigidity to the electrostatic clamp. The electrostatic clamp further has a clamping plate having a clamping surface associated with contact with a workpiece, wherein the clamping plate has a second coefficient of thermal expansion associated therewith. The clamping plate is bonded, attached or grown to the backing plate, wherein minimal deflection of the clamping plate is evident across a predetermined temperature range. The first coefficient of thermal expansion and second coefficient of thermal expansion, for example, are substantially similar, and vary by no greater than a factor of three.
1. An electrostatic clamp for selectively maintaining a position of a workpiece, the electrostatic clamp comprising:
a backing plate for providing structural support and rigidity to the electrostatic clamp, wherein the backing plate has a first coefficient of thermal expansion associated therewith, wherein the backing plate consists of a metal, therein defining a metallic backing plate; and
a clamping plate having a clamping surface configured to contact the workpiece, wherein the clamping plate has a second coefficient of thermal expansion associated therewith, wherein the clamping plate comprises a ceramic material, therein defining a ceramic clamping plate, wherein the clamping plate is bonded to the backing plate, and wherein the first coefficient of thermal expansion and second coefficient of thermal expansion are minimized, with a maximum difference determined by the geometry of the electrostatic clamp.
2. The electrostatic clamp of claim 1 , wherein the metallic backing plate is comprised of titanium, and wherein the ceramic clamping plate is comprised of aluminum nitride.
3. The electrostatic clamp of claim 1 , wherein the metallic backing plate is comprised of titanium, and wherein the ceramic clamping plate is comprised of aluminum oxide.
4. The electrostatic clamp of claim 1 , wherein the backing plate comprises one or more coolant channels configured to circulate a coolant fluid therethrough, therein controlling a temperature of the electrostatic clamp.
5. The electrostatic clamp of claim 1 , wherein the metal consists of one or more of aluminum, titanium, platinum, and vanadium.
6. An electrostatic clamp for selectively maintaining a position of a workpiece, the electrostatic clamp comprising:
a backing plate for providing structural support and rigidity to the electrostatic clamp, wherein the backing plate has a first coefficient of thermal expansion associated therewith, and wherein the backing plate consists of silicon carbide; and
a clamping plate having a clamping surface configured to contact the workpiece, wherein the clamping plate has a second coefficient of thermal expansion associated therewith, wherein the ceramic clamping plate consists of aluminum nitride, wherein the clamping plate is bonded to the backing plate, and wherein the first coefficient of thermal expansion and second coefficient of thermal expansion are minimized, with a maximum difference determined by the geometry of the electrostatic clamp.
7. A method for manufacturing an electrostatic clamp, the method comprising:
selecting a metallic backing plate material, wherein the metallic backing plate material consists of a metal having a first coefficient of thermal expansion;
selecting a ceramic clamping plate material having a second coefficient of thermal expansion, wherein the first coefficient of thermal expansion and second coefficient of thermal expansion are minimized, with a maximum difference determined by the geometry of the electrostatic clamp; and
forming a backing plate and clamping plate by bonding, attaching, or growing the ceramic clamping plate material on to the backing plate material.
8. The method of claim 7 , wherein the selection of the metallic backing plate material and the ceramic clamping plate material is based on a predetermined temperature range in which the electrostatic clamp is configured to operate.
9. The method of claim 7 , wherein the first coefficient of thermal expansion and second coefficient of thermal expansion vary by no greater than factor of three.
10. The electrostatic clamp of claim 7 , wherein the metal consists of one or more of aluminum, titanium, platinum, and vanadium.
11. An electrostatic clamp for selectively maintaining a position of a workpiece, the electrostatic clamp comprising:
a backing plate for providing structural support and rigidity to the electrostatic clamp, the backing plate consisting of a metal having a first coefficient of thermal expansion associated therewith;
a clamping plate for providing a clamping surface to selectively contact the workpiece, the clamping plate having a second coefficient of thermal expansion associated therewith, wherein the clamping plate is bonded, attached or grown on to the backing plate, and wherein a difference between the first coefficient of thermal expansion and second coefficient of thermal expansion is minimized with a maximum difference determined by the geometry of the electrostatic clamp.
12. The electrostatic clamp of claim 11 , wherein the metal consists of one or more of aluminum, titanium, platinum, and vanadium.