Double gate planar field effect transistors
A stacked planar device and method for forming the same is shown that includes forming, on a substrate, a stack of layers having alternating sacrificial and channel layers, patterning the stack such that sides of the stack include exposed surfaces of the sacrificial and channel layers, forming a dummy gate structure over a region of the stack to establish a planar area, forming a dielectric layer around the dummy gate structure to cover areas adjacent to the planar area, removing the dummy gate structure to expose the stack, selectively etching the stack to remove the sacrificial layers from the channel layers in the planar area, and forming a gate conductor over and in between the channel layers to form a transistor device.
1. A method for forming a stacked planar structure comprising
forming, on a substrate, a stack of layers having alternating sacrificial and channel layers;
forming a dummy gate structure over a region of the stack to establish a planar area;
forming a dielectric layer around the dummy gate structure to cover areas adjacent to the planar area;
removing the dummy gate structure to expose the stack;
etching the stack only in regions that are outside of the planar area and uncovered by the dielectric layer, such that sides of the stack include exposed surfaces of the sacrificial and channel layers;
selectively etching the stack to remove the sacrificial layers from the channel layers in the planar area; and
forming a gate conductor over and in between the channel layers to form a transistor device.
2. The method of claim 1 , wherein selectively removing comprises performing a directionally selective etch.
3. The method of claim 1 , further comprising forming a hardmask pattern on the stack to pattern the stack.
4. The method of claim 1 , further comprising doping the planes of channel material using source diffusion annealing.
5. The method of claim 1 , wherein the channel material is silicon and the sacrificial material is silicon-germanium.
6. The method of claim 1 , further comprising forming a fin mask to establish a location for nanowire formation.
7. The method of claim 6 , further comprising etching the stack around the fin mask to form etched stacked layers.
8. The method of claim 7 , wherein the etched stacked layers connect to source and drain regions and further comprising spacers along junctions between the source and drain regions and the etched stacked layers.
9. A method for forming a chip comprising:
forming, on a substrate, a stack of layers having alternating sacrificial and channel layers;
forming a fin mask onto the alternating layers to establish a nanowire location;
forming a solid mask on the alternating layers to establish a planar location;
forming a dummy gate structure over the masks;
forming a dielectric layer around the dummy gate structure to cover areas adjacent to the masks;
removing the dummy gate structure to expose the masks;
etching the stack around the fin mask and the planar mask to expose a fin portion of the stack at the nanowire location and a planar portion of the stack at the planar location;
selectively etching the stack to remove the sacrificial layers from the channel layers in the fin portion and the planar portion; and
forming a gate conductor over and in between the channel layers to form a transistor device.
10. The method of claim 9 , wherein said selectively removing comprises performing a directionally selective etch.
11. The method of claim 9 , further comprising doping the nanowires and planes of channel material using source diffusion annealing.
12. The method of claim 9 , wherein the channel material is silicon and the sacrificial material is silicon-germanium.
13. The method of claim 9 , further comprising isolating the at least one nanowire channel and the at least one planar channel using shallow trench isolation.
14. The method of claim 9 , further comprising forming spacers at the ends of the fin portion of the stack to protect the etched stack.
15. A method for forming a stacked planar structure comprising
forming, on a substrate, a stack of layers having alternating sacrificial and channel layers;
etching the stack in regions outside of a planar area that is defined by a planar hardmask and a dielectric sidewall, such that sides of the stack include exposed surfaces of the sacrificial and channel layers;
selectively etching the stack to remove the sacrificial layers from the channel layers in the planar area; and
forming a gate conductor over and in between the channel layers to form a transistor device.
16. The method of claim 1 , wherein each dimension of the planar area is substantially greater than a thickness of any layer of sacrificial or channel material in the stack.
17. The method of claim 15 , wherein a length and width of the planar hardmask are each substantially greater than a thickness of any layer of sacrificial or channel material in the stack.