Integrated circuit packaging system with underfill and method of manufacture thereof

1. A method of manufacture of an integrated circuit packaging system comprising:

providing a substrate with a projection formed along a perimeter of a first surface of the substrate;

mounting an integrated circuit over the first surface;

forming a protruding interconnect over the first surface between the projection and the integrated circuit; and

forming an underfill between the integrated circuit and the projection with a uniform height, the uniform height of the underfill less than a height of the projection.

2. The method as claimed in claim 1 wherein:

providing the substrate with the projection includes providing a projection sidewall substantially coplanar with a substrate sidewall.

3. The method as claimed in claim 1 wherein:

providing the integrated circuit includes providing a flip-chip.

4. The method as claimed in claim 1 further comprising:

exposing a substantially equal portion of each of the protruding interconnect from the underfill.

5. The method as claimed in claim 1 wherein:

forming the underfill includes exposing the integrated circuit from the underfill.

6. A method of manufacture of an integrated circuit packaging system comprising:

providing a substrate with a projection formed along a perimeter of a first surface of the substrate;

mounting an integrated circuit over the first surface;

forming a protruding interconnect over the first surface between the projection and the integrated circuit;

forming an underfill between the integrated circuit and the projection with a uniform height, the uniform height of the underfill less than a height of the projection; and

attaching a device over the integrated circuit by electrically connecting an external connection of the device to the protruding interconnect.

7. The method as claimed in claim 6 wherein:

providing the substrate with the projection includes forming the projection as a continuous structure.

8. The method as claimed in claim 6 wherein:

providing the substrate with the projection includes forming the projection integral with the substrate.

9. The method as claimed in claim 6 wherein:

attaching the device includes attaching an integrated circuit package.

10. The method as claimed in claim 6 wherein:

attaching the device includes forming a package-on-package structure.

11. An integrated circuit packaging system comprising:

a substrate with a projection along a perimeter of a first surface of the substrate;

an integrated circuit over the first surface of the substrate and attached thereto;

a protruding interconnect over the first surface between the projection and the integrated circuit; and

an underfill between the integrated circuit and the projection with a uniform height, the uniform height of the underfill less than a height of the projection.

12. The system as claimed in claim 11 further comprising:

a projection sidewall substantially coplanar with a substrate sidewall.

13. The system as claimed in claim 11 wherein:

the integrated circuit includes a flip-chip.

14. The system as claimed in claim 11 wherein:

the underfill exposes a substantially equal portion of each of the protruding interconnect.

15. The system as claimed in claim 11 wherein:

the integrated circuit is exposed from the underfill.

16. The system as claimed in claim 11 further comprising:

a device over the integrated circuit, the device including an external connection electrically connected to the protruding interconnect.

17. The system as claimed in claim 16 wherein:

the projection includes a continuous structure.

18. The system as claimed in claim 16 wherein:

the projection is integral with the substrate.

19. The system as claimed in claim 16 wherein:

the device includes an integrated circuit package.

20. The system as claimed in claim 16 wherein:

a width of the projection is less than the height of the projection.