Integrated circuit packaging system with package on package support and method of manufacture thereof
View Patent ↗A method of manufacture of an integrated packaging system includes: providing a substrate; mounting a die over the substrate; mounting an interposer having a slot over the die; covering a first encapsulant over the die and the interposer, a central region of the interposer exposed from the first encapsulant; and forming a hole through the first encapsulant to expose a peripheral portion of the interposer.
1. A method of manufacture of an integrated circuit packaging system comprising:
providing a substrate;
mounting a die over the substrate;
mounting an interposer having a slot over the die;
covering a first encapsulant over the die and the interposer, a central region of the interposer exposed from the first encapsulant;
forming a hole through the first encapsulant to expose a peripheral portion of the interposer; and
mounting a top package having a package interconnect and a supporter over and in direct contact with the interposer, the supporter larger than the package interconnect.
2. The method as claimed in claim 1 wherein the supporter has a supporter height greater than a warp height between a top surface of the first encapsulant and a bottom surface of the top package directly above the hole.
3. The method as claimed in claim 1 further wherein the supporter has a supporter height over the interposer, the supporter height equal to a warp height between a top surface of the first encapsulant and a bottom surface of the top package directly above the hole plus a hole height of the hole.
4. The method as claimed in claim 1 further comprising:
attaching the supporter to the peripheral portion of the interposer through the hole.
5. A method of manufacture of an integrated circuit packaging system comprising:
providing a substrate;
mounting a die over the substrate;
mounting an interposer having a slot over the die;
covering a first encapsulant over the die and the interposer, a central region of the interposer exposed from the first encapsulant;
mounting a top package having a supporter over the interposer;
attaching the supporter to a peripheral portion of the interposer through a hole of the first encapsulant;
attaching a first interconnect from the interposer through the slot to the substrate, and wherein:
covering the first encapsulant includes covering the first encapsulant over the interposer and within the slot.
6. The method as claimed in claim 5 wherein attaching the supporter includes attaching the supporter having a volume greater than a volume of the hole.
7. The method as claimed in claim 5 wherein the central region of the interposer is exposed from a recess of the first encapsulant away from the hole.
8. An integrated circuit packaging system comprising:
a substrate;
a die over the substrate;
an interposer having a slot over the die; and
a first encapsulant over the die and the interposer having a hole through the first encapsulant to expose a peripheral portion of the interposer, a central region of the interposer exposed from the first encapsulant; and
a top package having a package interconnect and a supporter over and in direct contact with the interposer, the supporter larger than the package interconnect.
9. The system as claimed in claim 8 wherein the supporter having has a supporter height greater than a warp height between a top surface of the first encapsulant and a bottom surface of the top package directly above the hole.
10. The system as claimed in claim 8 wherein the supporter has a supporter height over the interposer, the supporter height equal to a warp height between a top surface of the first encapsulant and a bottom surface of the top package directly above the hole plus a hole height of the hole.
11. The system as claimed in claim 8 wherein the supporter is attached to the peripheral portion of the interposer through the hole of the first encapsulant.
12. The system as claimed in claim 11 wherein the supporter has a volume greater than a volume of the hole.
13. The system as claimed in claim 11 wherein the first encapsulant exposes the central region of the interposer from a recess of the first encapsulant away from the hole.
14. The system as claimed in claim 11 further comprising:
a first interconnect extending from the interposer through the slot to the substrate; and wherein:
the first encapsulant is within the slot.
15. The system as claimed in claim 11 wherein the first encapsulant having the hole includes the hole being cylindrical.