Integrated circuit packaging system with underfill and method of manufacture thereof
A method of manufacture of an integrated circuit packaging system includes: providing a substrate; attaching a flip chip to the substrate; attaching a heat slug to the substrate and the flip chip; and forming a moldable underfill having a top underfill surface on the substrate, the flip chip, and the heat slug, the moldable underfill having a characteristic of being liquid at room temperature and the top underfill surface over the flip chip.
1. A method of manufacture of an integrated circuit packaging system comprising:
providing a substrate;
attaching a flip chip having a top chip surface to the substrate;
applying a thermal interface material to the top chip surface, the thermal interface material fully covering the top chip surface;
attaching a heat slug to the substrate and the thermal interface material; and
forming a moldable underfill having a top underfill surface on the substrate, the flip chip, and the heat slug, the moldable underfill having a characteristic of being liquid at room temperature and the top underfill surface over the flip chip.
2. The method as claimed in claim 1 further comprising forming an external interconnect on the bottom surface of the substrate.
3. The method as claimed in claim 1 wherein attaching the flip chip includes attaching with an internal interconnect the flip chip to the substrate.
4. The method as claimed in claim 1 wherein forming the moldable underfill includes forming the moldable underfill exposing the heat slug.
5. The method as claimed in claim 1 wherein forming the moldable underfill includes enclosing the flip chip in the moldable underfill.