Optimized annular copper TSV
The present disclosure provides a thermo-mechanically reliable copper TSV and a technique to form such TSV during BEOL processing. The TSV constitutes an annular trench which extends through the semiconductor substrate. The substrate defines the inner and outer sidewalls of the trench, which sidewalls are separated by a distance within the range of 5 to 10 microns. A conductive path comprising copper or a copper alloy extends within said trench from an upper surface of said first dielectric layer through said substrate. The substrate thickness can be 60 microns or less. A dielectric layer having interconnect metallization conductively connected to the conductive path is formed directly over said annular trench.
1. An integrated circuit structure comprising:
a substrate having at least one semiconductor device formed in a top surface thereof, and a first dielectric layer deposited over said top surface;
an annular trench through said first dielectric layer and extending through said substrate, wherein said substrate constitutes inner and outer sidewalls of said trench, said inner and outer sidewalls separated by a distance within the range of 5 to 10 microns;
a conductive path within said trench and extending from an upper surface of said first dielectric layer through said substrate, said path comprising copper or a copper alloy;
a second dielectric layer containing interconnect metallization, said interconnect metallization conductively connected to said conductive path, said second dielectric layer formed directly on said first dielectric layer and overlying said annular trench.
2. The structure of claim 1 wherein the thickness of said substrate is 60 microns or less.
3. The structure of claim 1 wherein said inner sidewall defines a substrate core having a diameter at said top surface in the range of 4 to 9 microns.
4. The structure of claim 3 wherein said inner and outer sidewalls are separated by a distance within the range of 5.5 and 9 microns and said diameter is in the range of 5 to 8 microns.
5. The structure of claim 1 wherein said inner and outer sidewalls slope in at an angle within 85 and 90 degrees relative to said top surface.
6. The structure of claim 1 wherein said conductive path has average grain size greater than 2 microns.
7. The structure of claim 1 further comprising a dielectric liner separating said conductive path from said substrate, said liner having a thickness in the range of 4000 to 10000 Å.
8. An integrated circuit comprising:
a semiconductor substrate having at least one semiconductor device formed in a top surface thereof;
an annular trench extending from said top surface to a bottom surface of said semiconductor substrate, said annular trench having an inner sidewall defining a core of said semiconductor substrate, said core having a diameter at said top surface between 5 and 8 microns, said inner sidewall sloped between 87 and 90 degrees relative to said top surface;
a conductive path within said annular trench, said conductive path isolated from said semiconductor substrate by a dielectric liner;
a dielectric layer containing interconnect metallization conductively connected to said at least one semiconductor device, said dielectric layer overlying said annular trench.
9. The structure of claim 8 wherein said conductive path comprises copper or a copper alloy and said semiconductor substrate comprises monocrystalline silicon.
10. The structure of claim 8 wherein said dielectric liner has a thickness on said inner sidewall, said thickness near said bottom surface being at least 50 percent of said thickness at said top surface.
11. The structure of claim 10 wherein said dielectric liner at said top surface has a thickness between 400 and 1500 nanometers.
12. The structure of claim 8 wherein said dielectric liner comprises SACVD oxide.
13. The structure of claim 8 wherein said dielectric liner is formed by a combination of SACVD and PECVD.
14. The structure of claim 8 wherein the outside diameter of said trench is between 17.5 and 25 microns at said top surface.
15. The structure of claim 14 wherein said outside diameter of said trench is between 19 and 23 microns at said top surface.