Silicon controlled rectifier with stress-enhanced adjustable trigger voltage
Device structures, fabrication methods, operating methods, and design structures for a silicon controlled rectifier. The method includes applying a mechanical stress to a region of a silicon controlled rectifier (SCR) at a level sufficient to modulate a trigger current of the SCR. The device and design structures include a SCR with an anode, a cathode, a first region, and a second region of opposite conductivity type to the first region. The first and second regions of the SCR are disposed in a current-carrying path between the anode and cathode of the SCR. A layer is positioned on a top surface of a semiconductor substrate relative to the first region and configured to cause a mechanical stress in the first region of the SCR at a level sufficient to modulate a trigger current of the SCR.
1. A method for modulating a trigger current of a silicon controlled rectifier (SCR), the method comprising:
applying a first mechanical stress from a first stress layer to a first well of the SCR at a level sufficient to adjust an electrical resistance of the first well that is in series with a trigger diode string of a trigger network and thereby modulate the trigger current of the SCR to be equal to a selected value,
wherein the first stress layer is comprised of a dielectric material deposited with deposition conditions selected to impart a stress state that transfers the first mechanical stress from the first stress layer to the first well at a level sufficient to adjust the electrical resistance.
2. The method of claim 1 wherein applying the first mechanical stress from the first stress layer to the first well of the SCR comprises:
reducing the trigger current of the SCR in response to the first mechanical stress.
3. The method of claim 1 wherein applying the first mechanical stress from the first stress layer to the first well of the SCR comprises:
increasing the trigger current of the SCR in response to the first mechanical stress.
4. The method of claim 1 wherein the semiconductor substrate has a top surface, and the first stress layer is located on the top surface of the semiconductor substrate.
5. The method of claim 1 further comprising:
applying a second mechanical stress to a second well of the SCR.
6. The method of claim 5 wherein the first mechanical stress and the second mechanical stress have opposite polarities selected from tensile stress or compressive stress.
7. The method of claim 1 wherein the cathode of the SCR is coupled to an input/output pad, and the anode of the SCR is coupled to a ground pad.
8. A method for forming a device structure including a silicon controlled rectifier (SCR) and a trigger network coupled with the SCR, the method comprising:
forming an anode or a cathode of the SCR in a first well of a semiconductor substrate;
coupling a diode string of the trigger network in series with an electrical resistance represented by the first well; and
depositing a first stress layer comprised of a dielectric material on a top surface of the semiconductor substrate at a first location relative to the first well and with deposition conditions selected to impart a stress state that transfers a first mechanical stress from the first stress layer to the first well at a level sufficient to adjust the electrical resistance of the first well and thereby modulate a trigger current of the SCR to be equal to a selected value.
9. The method of claim 8 wherein the anode is formed in the first well, and further comprising:
forming the cathode of the SCR in a second well of the semiconductor substrate; and
forming a second stress layer on the top surface of the semiconductor substrate at a second location relative to the second well and configured so that the second stress layer causes a second mechanical stress in the second well.
10. The method of claim 9 wherein the first mechanical stress and the second mechanical stress have opposite polarities selected from tensile stress or compressive stress.
11. The method of claim 8 wherein forming the first layer comprised of the dielectric material at the first location on the top surface of the semiconductor substrate comprises:
depositing the first stress layer on the top surface of the semiconductor substrate with deposition conditions that cause internal stress in the first layer; and
patterning the first layer to form the first layer at the first location on the top surface of the semiconductor substrate.
12. The method of claim 9 wherein the cathode is formed in the first well, and further comprising:
forming the anode of the SCR in the second well.
13. The method of claim 8 wherein the trigger current of the SCR is reduced in response to the first mechanical stress.
14. The method of claim 8 wherein the trigger current of the SCR is increased in response to the first mechanical stress.
15. The method of claim 8 further comprising:
coupling the cathode of the SCR to an input/output pad; and
coupling the anode of the SCR to a ground pad.
16. The method of claim 8 wherein the dielectric material is silicon nitride.