Semiconductor system with fine pitch lead fingers and method of manufacturing thereof
View Patent ↗A semiconductor package system, and method of manufacturing thereof, includes: an electrical substrate having a contact pad; a support structure having a lead finger thereon; a bump on the lead finger, the bump clamped on a top and a side of the lead finger and connected with the contact pad; and an encapsulant over the lead finger and the electrical substrate.
1. A method of manufacturing a semiconductor package system comprising:
providing an electrical substrate having a contact pad;
providing a support structure having a lead finger thereon;
attaching a bump to the lead finger, the bump clamped on a top and a side of the lead finger;
connecting the bump and the contact pad; and
forming an encapsulant over the lead finger and the electrical substrate.
2. The method as claimed in claim 1 wherein providing the support structure provides the top and the side of the lead finger with flat or non-flat surfaces.
3. The method as claimed in claim 1 further comprising:
providing an adjacent lead finger next to the lead finger;
attaching an adjacent bump to the adjacent lead finger, the bump clamped on a top and a side of the adjacent lead finger; and
connecting the bump and the adjacent bump.
4. The method as claimed in claim 1 further comprising:
providing the electrical substrate provides an adjacent contact pad next to the contact pad; and
connecting the bump and the adjacent contact pad.
5. The method as claimed in claim 1 wherein connecting the bump and the contact pad uses a bond wire with a bump bond on one end and a stitch bond on the other end.
6. A method of manufacturing a semiconductor package system comprising:
providing an electrical substrate having a contact pad;
providing a support structure having an attachment site and a lead finger, the lead finger having a substantially trapezoidal cross-section;
attaching the electrical substrate to the attachment site with the contact pad up;
attaching a bump to the lead finger, the bump clamped on a top and a side of the lead finger;
connecting a bond wire between the bump and the contact pad; and
forming an encapsulant over the lead finger the electrical substrate, and the bond wire, the encapsulant leaving lower surfaces of the lead finger exposed.
7. The method as claimed in claim 6 wherein providing the support structure provides an adjacent lead finger having a top and a side of the lead finger with flat or non-flat surfaces.
8. The method as claimed in claim 6 further comprising:
providing an adjacent lead finger next to the lead finger;
attaching an adjacent bump to the adjacent lead finger, the bump clamped on a top and a side of the adjacent lead finger; and
connecting a cross bond wire between the bump and the adjacent bump.
9. The method as claimed in claim 6 further comprising:
providing the electrical substrate provides an adjacent contact pad next to the contact pad; and
connecting a cross bond wire between the bump and the adjacent contact pad.
10. The method as claimed in claim 6 wherein:
providing an adjacent lead finger next to the lead finger;
attaching an adjacent bump to the adjacent lead finer, the adjacent bump clamped on a top and a side of the adjacent lead finger;
providing the electrical substrate provides an adjacent contact pad next to the contact pad; and
connecting a cross bond wire between the adjacent bump and the contact pad or the bump and the adjacent bump, the cross bond wire using a bump bond at one end a stitch bond on the other end.