Method and system for a GaN vertical JFET utilizing a regrown channel
View Patent ↗A vertical III-nitride field effect transistor includes a drain comprising a first III-nitride material, a drain contact electrically coupled to the drain, and a drift region comprising a second III-nitride material coupled to the drain. The field effect transistor also includes a channel region comprising a third III-nitride material coupled to the drain and disposed adjacent to the drain along a vertical direction, a gate region at least partially surrounding the channel region, having a first surface coupled to the drift region and a second surface on a side of the gate region opposing the first surface, and a gate contact electrically coupled to the gate region. The field effect transistor further includes a source coupled to the channel region and a source contact electrically coupled to the source. The channel region is disposed between the drain and the source along the vertical direction such that current flow during operation of the vertical III-nitride field effect transistor is along the vertical direction, and the channel region extends along at least a portion of the second surface of the gate region.
1. A vertical III-nitride field effect transistor comprising:
a drain comprising a first III-nitride material;
a drain contact electrically coupled to the drain;
a drift region comprising a second III-nitride material coupled to the drain;
a channel region comprising a third III-nitride material coupled to the drain and disposed above the drain along a vertical direction;
a gate region at least partially surrounding the channel region, having a first surface coupled to the drift region and a second surface on a side of the gate region opposing the first surface, wherein a physical boundary between the channel region and the drift region does not extend below the first surface of the gate region in the vertical direction;
a gate contact electrically coupled to the gate region;
a source coupled to the channel region; and
a source contact electrically coupled to the source;
wherein the channel region is disposed between the drain and the source along the vertical direction such that current flow during operation of the vertical III-nitride field effect transistor is along the vertical direction, and the channel region extends along at least a portion of the second surface of the gate region.
2. The vertical III-nitride field effect transistor of claim 1 wherein the first III-nitride material comprises an n-type substrate.
3. The vertical III-nitride field effect transistor of claim 1 wherein the second III-nitride material comprises an n-type GaN epitaxial layer having a dopant concentration less than or equal to a dopant concentration of the first III-nitride material and a thickness greater than 1 μm.
4. The vertical III-nitride field effect transistor of claim 1 wherein a width of the channel region measured along a direction orthogonal to a thickness of the drift region is less than 5 μm.
5. The vertical III-nitride field effect transistor of claim 1 wherein the gate region comprises a p-type III-nitride material.
6. The vertical III-nitride field effect transistor of claim 1 wherein the gate region is further electrically coupled to the drift region.