INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INCREASED CONNECTIVITY AND METHOD OF MANUFACTURE THEREOF

1 . A method of manufacture of an integrated circuit packaging system comprising:

forming a lead frame having contact pads and connection leads;

coupling a base integrated circuit to the contact pads;

coupling a chip interconnect between the base integrated circuit, the connection leads, the contact pads, or a combination thereof;

molding a package body on the connection leads, the base integrated circuit, and the chip interconnects, including having the contact pads exposed; and

forming a bottom surface on the package body including forming the connection leads to be coplanar with the bottom surface.

2 . The method as claimed in claim 1 further comprising forming a package stack including:

mounting a wire bond integrated circuit on the base integrated circuit; and

coupling an external integrated circuit package to the contact pads.

3 . The method as claimed in claim 1 wherein forming the lead frame having the contact pads includes:

providing a tie bar on the lead frame;

forming inner contact pads coupled to the tie bar; and

forming outer contact pads coupled to the tie bar.

4 . The method as claimed in claim 1 further comprising forming a dam bar between the connection leads.

5 . The method as claimed in claim 1 wherein forming the package body includes forming a saw line for removing a tie bar coupled to the contact pads.

6 . A method of manufacture of an integrated circuit packaging system comprising:

forming a lead frame having contact pads and connection leads including forming a tie bar for positioning the contact pads;

coupling a base integrated circuit to the contact pads including coupling a chip interconnect between the contact pad and the base integrated circuit;

coupling a chip interconnect between the base integrated circuit, the connection leads, the contact pads, or a combination thereof including coupling a bonding pad, a bond finger, the tie bar, or a combination thereof;

molding a package body on the connection leads, the base integrated circuit, and the chip interconnects, including having the contact pads exposed including injecting an epoxy molding compound; and

forming a bottom surface on the package body including forming the connection leads to be coplanar with the bottom surface.

7 . The method as claimed in claim 6 further comprising forming a package stack comprising:

mounting a wire bond integrated circuit on the base integrated circuit including applying an adhesive on the base integrated circuit; and

coupling an external integrated circuit package to the contact pads includes coupling a ball grid array, a quad flat pack, or a wafer level chip scale package.

8 . The method as claimed in claim 6 wherein forming the lead frame having connection pads includes:

forming inner contact pads coupled to the tie bar;

forming outer contact pads coupled to the tie bar; and

forming an inner lead group and an outer lead group including having the inner contact pads and the outer contact pads in each.

9 . The method as claimed in claim 6 further comprising forming a dam bar between the connection leads including forming a heat spreader coupled to the dam bar by the tie bar.

10 . The method as claimed in claim 6 wherein forming the package body includes forming a saw line for removing the tie bar coupled to the contact pads wherein forming the saw line includes etching by a singulation saw or a laser.

11 . An integrated circuit packaging system comprising:

a package body having contact pads and connection leads exposed;

a base integrated circuit coupled to the contact pads;

chip interconnects between the base integrated circuit, the connection leads, the contact pads, or a combination thereof; and

a bottom surface on the package body with the connection leads formed coplanar to the bottom surface.

12 . The system as claimed in claim 11 further comprising a package stack includes:

a wire bond integrated circuit on the base integrated circuit; and

an external integrated circuit package coupled to the contact pads with the connection leads bent away from the external integrated circuit package.

13 . The system as claimed in claim 11 wherein the package body having the contact pads includes inner contact pads and outer contact pads exposed on the package body.

14 . The system as claimed in claim 11 further comprising a heat spreader coupled to the base integrated circuit.

15 . The system as claimed in claim 11 further comprises:

an adhesive on the base integrated circuit; and

a bond pad on the base integrated circuit, a bond finger on the connection leads, the contact pads, or a combination thereof coupled by the chip interconnects.

16 . The system as claimed in claim 15 further comprising a package stack includes:

a wire bond integrated circuit on the base integrated circuit; and

an external integrated circuit package coupled to the contact pads with the connection leads bent away from the external integrated circuit package includes a ball grid array, a quad flat pack, or a wafer level chip scale package coupled to the contact pads.

17 . The system as claimed in claim 15 wherein the package body having the contact pads includes inner contact pads and outer contact pads exposed on the package body including an inner lead group and an outer lead group formed with the inner contact pads and the outer contact pads in each.

18 . The system as claimed in claim 15 further comprising a heat spreader coupled to the base integrated circuit includes a thermal adhesive between the heat spreader and the base integrated circuit.

19 . The system as claimed in claim 15 wherein the package body includes a saw line adjacent to the contact pads, the saw line formed between an inner lead group and an outer lead group.