Method of fabricating a gallium nitride merged P-i-N Schottky (MPS) diode
View Patent ↗A semiconductor structure includes a III-nitride substrate with a first side and a second side opposing the first side. The III-nitride substrate is characterized by a first conductivity type and a first dopant concentration. The semiconductor structure also includes a III-nitride epitaxial structure including a first III-nitride epitaxial layer coupled to the first side of the III-nitride substrate and a plurality of III-nitride regions of a second conductivity type. The plurality of III-nitride regions have at least one III-nitride epitaxial region of the first conductivity type between each of the plurality of III-nitride regions. The semiconductor structure further includes a first metallic structure electrically coupled to one or more of the plurality of III-nitride regions and the at least one III-nitride epitaxial region. A Schottky contact is created between the first metallic structure and the at least one III-nitride epitaxial region.
1. A semiconductor structure comprising:
a free-standing III-nitride wafer having a first side and a second side opposing the first side, wherein the free-standing III-nitride wafer is characterized by a first conductivity type and a first dopant concentration;
a III-nitride epitaxial structure comprising:
a first III-nitride epitaxial layer coupled directly to the first side of the free-standing III-nitride wafer, wherein the first III-nitride epitaxial layer is characterized by the first conductivity type and a second dopant concentration lower than the first dopant concentration; and
a plurality of III-nitride regions of a second conductivity type, the plurality of III-nitride regions of the second conductivity type having at least one III-nitride epitaxial region of the first conductivity type disposed between adjacent ones of the plurality of III-nitride regions of the second conductivity type; and
a first metallic structure electrically coupled to one or more of the plurality of III-nitride regions of the second conductivity type and the at least one III-nitride epitaxial region of the first conductivity type, wherein a Schottky contact is created between the first metallic structure and the at least one III-nitride epitaxial region of the first conductivity type.
2. The semiconductor structure of claim 1 further comprising a second metallic structure electrically coupled to the second side of the free-standing III-nitride wafer.
3. The semiconductor structure of claim 1 wherein:
the plurality of III-nitride regions of the second conductivity type comprise a plurality of III-nitride epitaxial structures of the second conductivity type embedded in the first III-nitride epitaxial layer; and
the at least one III-nitride epitaxial region of the first conductivity type comprises at least one portion of the first III-nitride epitaxial layer.
4. The semiconductor structure of claim 1 wherein:
the plurality of III-nitride regions of the second conductivity type comprise a plurality of regions in the first III-nitride epitaxial layer doped with a dopant of the second conductivity type; and
the at least one III-nitride epitaxial region of the first conductivity type comprises at least one portion of the first III-nitride epitaxial layer.
5. The semiconductor structure of claim 1 wherein:
the plurality of III-nitride regions of the second conductivity type comprise a plurality of III-nitride epitaxial structures of the second conductivity type formed on the first III-nitride epitaxial layer; and
the at least one III-nitride epitaxial region of the first conductivity type comprises at least one epitaxial structure of the first conductivity type formed on the first III-nitride epitaxial layer.
6. The semiconductor structure of claim 1 wherein at least one of the plurality of III-nitride regions of the second conductivity type is configured to provide edge termination to a semiconductor device.
7. The semiconductor structure of claim 1 wherein the first metallic structure is electrically coupled to a first portion of the plurality of III-nitride regions of the second conductivity type and is not electrically coupled to a second portion of the plurality of III-nitride regions of the second conductivity type, and each of the second portion of the plurality of III-nitride regions of the second conductivity type are separated from one another by a spacing that increases with distance from the first metallic structure.
8. A semiconductor structure comprising:
a III-nitride substrate having a first side and a second side opposing the first side, wherein the III-nitride substrate is characterized by a first conductivity type;
a III-nitride epitaxial structure comprising:
a first III-nitride epitaxial layer coupled to the first side of the III-nitride substrate; and
a plurality of III-nitride regions of a second conductivity type having at least one III-nitride epitaxial region of the first conductivity type disposed between adjacent ones of the plurality of III-nitride regions of the second conductivity type;
a first metallic structure electrically coupled to a first portion of the plurality of III-nitride regions of the second conductivity type and the at least one III-nitride epitaxial region of the first conductivity type, wherein a Schottky contact is created between the first metallic structure and the at least one III-nitride epitaxial region of the first conductivity type, and wherein the first metallic structure is not electrically coupled to a second portion of the plurality of III-nitride regions of the second conductivity type, each of the second portion of the plurality of III-nitride regions of the second conductivity type being separated from one another by a spacing that increases with distance from the first metallic structure; and
a second metallic structure electrically coupled to the second side of the III-nitride substrate.
9. The semiconductor structure of claim 8 wherein:
the plurality of III-nitride regions of the second conductivity type comprise a plurality of III-nitride epitaxial structures of the second conductivity type embedded in the first III-nitride epitaxial layer; and
the at least one III-nitride epitaxial region of the first conductivity type comprises at least one portion of the first III-nitride epitaxial layer.
10. The semiconductor structure of claim 8 wherein:
the plurality of III-nitride regions of the second conductivity type comprise a plurality of regions in the first III-nitride epitaxial layer doped with a dopant of the second conductivity type; and
the at least one III-nitride epitaxial region of the first conductivity type comprises at least one portion of the first III-nitride epitaxial layer.
11. The semiconductor structure of claim 8 wherein:
the plurality of III-nitride regions of the second conductivity type comprise a plurality of III-nitride epitaxial structures of the second conductivity type formed on the first III-nitride epitaxial layer; and
the at least one III-nitride epitaxial region of the first conductivity type comprises at least one epitaxial structure of the first conductivity type formed on the first III-nitride epitaxial layer.
12. The semiconductor structure of claim 8 wherein the second metallic structure comprises an ohmic contact to the second side of the III-nitride substrate.
13. The semiconductor structure of claim 8 wherein at least one of the plurality of III-nitride regions of the second conductivity type is configured to provide edge termination to a semiconductor device.
14. The semiconductor structure of claim 8 wherein the III-nitride substrate is characterized by the first conductivity type and a first dopant concentration, and the first III-nitride epitaxial layer is characterized by the first conductivity type and a second dopant concentration lower than the first dopant concentration.
15. The semiconductor structure of claim 8 wherein the first III-nitride epitaxial layer is directly coupled to the first side of the III-nitride substrate.