Method of making bulk InGaN substrates and devices thereon

1. A method for forming a biaxially relaxed c-plane epitaxial Al x In y Ga (1-x-y) N layer comprising:

providing a substrate having a surface characterized by an orientation within 5 degrees of a c-plane;

forming a pattern of channels in the substrate and isolated regions of the substrate defined by the channels, wherein

the channels are characterized by a sidewall angle with respect to the surface of the isolated regions between 60 degrees and 90 degrees and a pitch ranging from between 10 nm and 1000 nm; and

a surface of the isolated regions is characterized by an orientation within 5 degrees of a c-plane;

growing at least one Al x In y Ga (1-x-y) N epitaxial layer on the isolated regions, comprising:

growing a strained epitaxial Al x In y Ga (1-x-y) N region on the isolated regions, wherein at least during initial stages of growth the strained epitaxial Al x In y Ga (1-x-y) N region comprises a plurality of misfit dislocations; and

increasing a thickness of the at least one epitaxial Al x In y Ga (1-x-y) N layer to cause the isolated regions to close off by lateral growth and to form a coalesced epitaxial Al x In y Ga (1-x-y) N region, wherein the coalesced epitaxial Al x In y Ga (1-x-y) N region is substantially free of misfit dislocations; and

forming at least one biaxially relaxed c-plane epitaxial Al x In y Ga (1-x-y) N layer overlying the coalesced epitaxial Al x In y Ga (1-x-y) N region, wherein

a total thickness of the at least one epitaxial Al x In y Ga (1-x-y) N layer is at least 100 nm; and

the biaxially relaxed c-plane epitaxial Al x In y Ga (1-x-y) N layer is characterized by a biaxial strain less than 0.1% and a total threading dislocation density less than 10 8 cm −2 .

2. The method of claim 1 wherein at least one epitaxial Al x In y Ga (1-x-y) N layer comprises at least two epitaxial Al x In y Ga (1-x-y) N layers wherein at least one epitaxial Al x In y Ga (1-x-y) N layer has a graded composition.

3. The method of claim 1 further comprising subjecting the substrate to a roughening process before formation of the at least one epitaxial Al x In y Ga (1-x-y) N epitaxial layer.

4. The method of claim 1 further comprising forming a second epitaxial Al x In y Ga (1-x-y) N layer on a back side of the substrate.

5. The method of claim 1 wherein the total thickness of the at least one epitaxial Al x In y Ga (1-x-y) N layer is greater than 1 micron.

6. The method of claim 1 wherein the at least one epitaxial Al x In y Ga (1-x-y) N layer comprises at least two epitaxial Al x In y Ga (1-x-y) N layers characterized by a graded composition.

7. The method of claim 1 wherein increasing the thickness of the at least one epitaxial Al x In y Ga (1-x-y) N layer comprises:

depositing Al x Ga (1-x) N material at a first thickness of less than 100 nanometers;

annealing the Al x Ga (1-x) N material at a temperature ranging from between about 1000 degrees and 1400 degrees Celsius; and

depositing Al x Ga (1-x) N material at a second thickness, wherein the a total thickness of the first thickness and the second thickness is greater than 100 nanometers.

8. The method of claim 1 further comprising removing the substrate and the at least one epitaxial Al x In y Ga (1-x-y) N layer to form a free-standing biaxially relaxed c-plane epitaxial Al x In y Ga (1-x-y) N layer, crystal, wafer, or boule.

9. The method of claim 1 further comprising fabricating a light emitting diode or a laser diode on at least a portion of the at least one epitaxial Al x In y Ga (1-x-y) N layer.

10. The method of claim 1 , wherein the thickness of the at least one epitaxial Al x In y Ga (1-x-y) N layer is greater than 10 microns.

11. The method of claim 1 , wherein the substrate comprises bulk gallium nitride.

12. The method of claim 1 , wherein the substrate comprises sapphire.

13. The method of claim 1 , further comprising depositing an additional epitaxial layer by hydride vapor phase epitaxy overlying the at least one Al x In y Ga (1-x-y) N layer.

14. The method of claim 1 , wherein,

at least a portion of the at least one epitaxial Al x In y Ga (1-x-y) N layer proximate to the substrate is patterned; and

at least a portion of the at least one epitaxial Al x In y Ga (1-x-y) N layer distal to the substrate is coalesced or continuous and relaxed, having a strain, relative to fully-relaxed Al x In y Ga (1-x-y) N, of less than 0.01%.

15. The method of claim 1 , wherein the at least one Al x In y Ga (1-x-y) N layer comprises more than one epitaxial Al x In y Ga (1-x-y) N layer, wherein

at least a portion of a first epitaxial Al x In y Ga (1-x-y) N layer overlying the substrate is patterned; and

at least a portion of a second epitaxial Al x In y Ga (1-x-y) N layer overlying the first epitaxial Al x In y Ga (1-x-y) N layer is coalesced or continuous and relaxed, having a strain, relative to fully-relaxed Al x In y Ga (1-x-y) N, of less than 0.01%.

16. The method of claim 1 , wherein at least one of x and y is between 0.01 and 0.50.

17. A device comprising a biaxially relaxed epitaxial Al x In y Ga (1-x-y) N layer formed by the method of claim 1 , wherein the epitaxial Al x In y Ga 1-x-y N layer is characterized by:

0≦x, y, x+y≦1 and y>0.10;

a surface orientation within 5 degrees of a c-plane;

a thickness greater than 100 nanometer;

a concentration of threading dislocations less than 10 8 cm −2 ; and

a biaxial strain less than 0.1%.

18. A device, comprising at least one layer comprising Al x In y Ga 1-x-y N, wherein the at least one layer is characterized by:

0≦x, y, x+y≦1 and y>0.10;

a surface orientation within 5 degrees of a c-plane;

a thickness greater than 100 nanometer;

a concentration of threading dislocations less than 10 8 cm −2 ; and

a biaxial strain less than 0.1%.

19. The device of claim 18 wherein the device is selected from among a light emitting diode, a laser diode, a photodetector, an avalanche photodiode, a transistor, a rectifier, and a thyristor; one of a transistor, a rectifier, a Schottky rectifier, a thyristor, a p-i-n diode, a metal-semiconductor-metal diode, high-electron mobility transistor, a metal semiconductor field effect transistor, a metal oxide field effect transistor, a power metal oxide semiconductor field effect transistor, a power metal insulator semiconductor field effect transistor, a bipolar junction transistor, a metal insulator field effect transistor, a heterojunction bipolar transistor, a power insulated gate bipolar transistor, a power vertical junction field effect transistor, a cascode switch, an inner sub-band emitter, a quantum well infrared photodetector, a quantum dot infrared photodetector, a solar cell, and a diode for photoelectrochemical water splitting and hydrogen generation.