IP Library Granted Patent US 8,651,025
Granted Patent B2
US 8,651,025 · App. 13/285,033 · Granted Feb 18, 2014

Overhead hoist transport system

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Quick Facts
Patent No.
US 8,651,025
App. No.
13/285,033
Granted
Feb 18, 2014
Kind
B2
Abstract

An overhead wafer transport system includes an over head transportation (OHT) rail and at least one shuttle. The OHT rail includes a main track and two lateral tracks, each having a hollow transverse cross-section, each lateral track being in corresponding connection with the main track through the two sides thereof, constituting an approximate tri-directional branch form. The shuttle has a track-interface assembly and a docking unit, the track-interface assembly being adapted to travel along the OHT rail. The track-interface assembly being arranged at the junction of the two lateral tracks and the main track, wherein the track-interface assembly is adapted to selectively travel along at least one of the main track and the lateral tracks. Therefore, the overhead wafer transport system can be applied to a clean room with higher transfer efficiency and clean room space utilization.

Claims (11)

1. An overhead wafer transport system comprising:

an overhead transportation (OHT) rail including a main track and two lateral tracks, each having a hollow transverse cross-section, each lateral track being in corresponding connection with the main track through the two respective sides thereof; and

a shuttle having a track-interface assembly and a docking unit, wherein the track-interface assembly is adapted to travel along the OHT rail and includes a frame structure, three pairs of main wheels and four pairs of branching wheels, wherein the frame structure is substantially H-shaped and includes a vertical bar coupled between two horizontal bars;

wherein the four pairs of branching wheels are correspondingly arranged on the two horizontal bars with a predetermined distance in between;

wherein when the shuttle travels toward a junction of the two lateral tracks and the main track, the track-interface assembly is adapted to selectively travel along at least one of the main track and the lateral tracks.

2. The overhead wafer transport system according to claim 1 , wherein each of the main track and the two lateral tracks comprises a track frame, a guiding member and a track section.

3. The overhead wafer transport system according to claim 2 , wherein the connecting junction of the main track and the two lateral tracks forms an extended reinforced section.

4. The overhead wafer transport system according to claim 2 , wherein the cross-section of the track frame is substantially U-shaped.

5. The overhead wafer transport system according to claim 2 , wherein the guiding member is fixedly arranged on the upper inner surface of the track frame.

6. The overhead wafer transport system according to claim 4 , wherein the lateral sides of the track frame extend to form the track section.

7. The overhead wafer transport system according to claim 1 , wherein three pairs of wheels are adapted in the hollow portion of the tracks and configured to selectively travel along the main track and the lateral tracks on the track section thereof.

Assignments (5)
RELEASE OF SECURITY INTEREST Recorded Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →
RELEASE OF SECURITY INTEREST Recorded Oct 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050695/0825 →
SECURITY INTEREST Recorded Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 27, 2017
From: INOTERA MEMORIES, INC.
To: MICRON TECHNOLOGY, INC.
Reel/Frame 041820/0815 →
SUPPLEMENT NO. 3 TO PATENT SECURITY AGREEMENT Recorded Feb 10, 2017
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 041675/0105 →