Semiconductor device and method of forming thermal interface material and heat spreader over semiconductor die
View Patent ↗A semiconductor device has a semiconductor die mounted to a substrate. A recess is formed in a back surface of the semiconductor die to an edge of the semiconductor die with sidewalls on at least two sides of the semiconductor die. The sidewalls are formed by removing a portion of the back surface of the die, or by forming a barrier layer on at least two sides of the die. A channel can be formed in the back surface of the semiconductor die to contain the TIM. A TIM is formed in the recess. A heat spreader is mounted in the recess over the TIM with a down leg portion of the heat spreader thermally connected to the substrate. The sidewalls contain the TIM to maintain uniform coverage of the TIM between the heat spreader and back surface of the semiconductor die.
1. A method of making a semiconductor device, comprising:
providing a substrate;
disposing a semiconductor die over the substrate;
forming a recess over a back surface of the semiconductor die to an edge of the semiconductor die with sidewalls of the recess on at least two sides of the semiconductor die;
forming a thermal interface material in the recess; and
disposing a heat spreader in the recess.
2. The method of claim 1 , wherein a down leg portion of the heat spreader is thermally connected to the substrate.
3. The method of claim 1 , further including disposing a plurality of the semiconductor die over the substrate, wherein the heat spreader extends between adjacent semiconductor die.
4. The method of claim 1 , further including forming a barrier layer over the semiconductor die as the sidewalls of the recess.
5. The method of claim 1 , further including depositing an underfill material between the semiconductor die and substrate.
6. The method of claim 1 , further including disposing a discrete electrical device over the substrate.
7. A method of making a semiconductor device, comprising:
providing a substrate;
disposing a semiconductor die over the substrate;
forming a recess in a back surface of the semiconductor die along a perimeter of the semiconductor die;
forming a thermal interface material over a central area of the back surface of the semiconductor die; and
disposing a heat spreader over the semiconductor die with a portion of the thermal interface material disposed in the recess.
8. The method of claim 7 , wherein the heat spreader includes an opening over the back surface of the semiconductor die.
9. The method of claim 8 , wherein the thermal interface material is pressed into the opening when disposing the heat spreader.
10. The method of claim 7 , further including depositing an underfill material between the semiconductor die and substrate.
11. The method of claim 7 , further including disposing a discrete electrical device over the substrate.
12. The method of claim 7 , further including forming a barrier layer over the semiconductor die as sidewalls of the recess.
13. A semiconductor device, comprising:
a substrate;
a semiconductor die disposed over the substrate;
a recess formed over a back surface of the semiconductor die to an edge of the semiconductor die with sidewalls of the recess on at least two sides of the semiconductor die;
a thermal interface material deposited in the recess; and
a heat spreader disposed in the recess.
14. The semiconductor device of claim 13 , wherein a down leg portion of the heat spreader is thermally connected to the substrate.
15. The semiconductor device of claim 13 , further including a plurality of the semiconductor die disposed over the substrate, wherein the heat spreader extends between adjacent semiconductor die.
16. The semiconductor device of claim 13 , further including a barrier layer formed over the semiconductor die as the sidewalls of the recess.
17. The semiconductor device of claim 13 , further including an underfill material deposited between the semiconductor die and substrate.
18. A semiconductor device, comprising:
a substrate;
a semiconductor die disposed over the substrate;
a recess formed in a back surface of the semiconductor die to an edge of the semiconductor die with sidewalls on at least two sides of the semiconductor die;
a thermal interface material formed in the recess; and
a heat spreader disposed in the recess with a down leg portion of the heat spreader thermally connected to the substrate.
19. The semiconductor device of claim 18 , wherein the heat spreader includes an opening over the back surface of the semiconductor die.
20. The semiconductor device of claim 18 , further including a barrier layer formed over the semiconductor die as the sidewalls of the recess.
21. The semiconductor device of claim 18 , further including an underfill material deposited between the semiconductor die and substrate.
22. The semiconductor device of claim 18 , further including a plurality of the semiconductor die disposed over the substrate, wherein the heat spreader extends between adjacent semiconductor die.
23. A semiconductor device, comprising:
a substrate;
a semiconductor die disposed over the substrate and including a recess formed in a back surface along a perimeter of the semiconductor die;
a thermal interface material formed over a central area of the back surface of the semiconductor die; and
a heat spreader disposed over the semiconductor die with a portion of the thermal interface material disposed in the recess.
24. The semiconductor device of claim 23 , further including a plurality of the semiconductor die disposed over the substrate, wherein the heat spreader extends between adjacent semiconductor die.
25. The semiconductor device of claim 23 , further including a barrier layer formed on at least two sides of the semiconductor die.
26. The semiconductor device of claim 23 , further including an underfill material deposited between the semiconductor die and substrate.
27. The semiconductor device of claim 23 , further including a discrete electrical device disposed over the substrate.
28. The semiconductor device of claim 13 , further including a discrete electrical device disposed over the substrate.
29. A semiconductor device, comprising:
a semiconductor die;
a thermal interface material formed over a perimeter of a back surface of the semiconductor die; and
a heat spreader disposed over the thermal interface material with a central opening of the heat spreader extending completely through the heat spreader over the semiconductor die.
30. The semiconductor device of claim 29 , wherein the central opening of the heat spreader is disposed over a central area of the semiconductor die with the central area of the semiconductor die devoid of the heat spreader.
31. The semiconductor device of claim 29 , further including the semiconductor die disposed over a substrate.
32. The semiconductor device of claim 31 , wherein the heat spreader includes a down leg portion thermally connected to the substrate.