IP Library Granted Patent US 8,858,150
Granted Patent B2
US 8,858,150 · App. 13/304,741 · Granted Oct 14, 2014

Door detection system

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Quick Facts
Patent No.
US 8,858,150
App. No.
13/304,741
Granted
Oct 14, 2014
Kind
B2
Abstract

A door detection system includes a robot arm unit and a movable unit. The robot arm unit includes at least one bearing platform and at least one level sensing structure disposed on the at least one bearing platform. The level sensing structure includes a plurality of contact sensors, and the wafer carrier device is disposed on the at least one level sensing structure. The movable unit includes at least one movable structure disposed on the robot arm unit. The wafer carrier device has a wafer pick-and-place opening corresponding to the door, and one end of the at least one movable structure can selectively contact the door of the wafer carrier device or been inserted into the wafer carrier device from the wafer pick-and-place opening.

Claims (16)

1. A door detection system for judging whether a door of a wafer carrier device is closed, comprising:

a robot arm unit including at least one bearing platform and at least one level sensing structure disposed on the at least one bearing platform, wherein the level sensing structure includes a plurality of contact sensors, and the wafer carrier device is disposed on the at least one level sensing structure; and

a movable unit including at least one movable structure disposed on the robot arm unit, wherein the wafer carrier device has a wafer pick-and-place opening corresponding to the door;

wherein when the door of the wafer carrier device is closed, one end of the at least one movable structure contacts the door of the wafer carrier device and the bottom of the wafer carrier device simultaneously contacts all of the contact sensors;

wherein when the door of the wafer carrier device is not closed, one end of the at least one movable structure is inserted into the wafer carrier device from the wafer pick-and-place opening and the bottom of the wafer carrier device simultaneously contacts some of the contact sensors.

2. The door detection system of claim 1 , wherein the at least one movable structure includes a fixing portion fixed on the at least one bearing platform, a flexible extending portion extended upwardly from the fixing portion, and a contacting portion bent from the flexible extending portion to selectively contact the door of the wafer carrier device or insert into the wafer carrier device from the wafer pick-and-place opening.

3. The door detection system of claim 1 , wherein the at least one movable structure includes a fixing seat fixed on the at least one bearing platform, a support frame movably disposed on the fixing seat, and a movable element movably disposed on the support frame to selectively contact the door of the wafer carrier device or insert into the wafer carrier device from the wafer pick-and-place opening.

4. The door detection system of claim 3 , wherein the support frame includes a U-shaped frame body, a position-limiting element disposed between two inner walls of the U-shaped frame body, and two arc-shaped sliding grooves symmetrically formed on the U-shaped frame body, wherein the movable element includes a movable block selectively contacting the position-limiting element or separated from the position-limiting element and two pivot posts respectively disposed on two opposite lateral sides of the movable block and respectively slidably disposed in the two arc-shaped sliding grooves, and the movable block of the movable element selectively contacts the door of the wafer carrier device or inserts into the wafer carrier device from the wafer pick-and-place opening.

5. The door detection system of claim 3 , wherein the support frame includes a U-shaped frame body, a position-limiting element disposed between two inner walls of the U-shaped frame body, and two positioning holes symmetrically formed on the U-shaped frame body, wherein the movable element includes a fixing block fixed between the two positioning holes, at least one elastic element received in the fixing block, and a sliding block contacting the at least one elastic element and slidably mated with fixing block, and the sliding block of the movable element selectively contacts the door of the wafer carrier device or inserts into the wafer carrier device from the wafer pick-and-place opening.

6. A door detection system for judging whether a door of a wafer carrier device is closed, comprising:

a robot arm unit including at least one bearing platform and at least one level sensing structure disposed on the at least one bearing platform, wherein the level sensing structure includes a plurality of contact sensors, and the wafer carrier device is disposed on the at least one level sensing structure; and

a movable unit including at least one movable structure disposed on the robot arm unit, wherein the wafer carrier device has a wafer pick-and-place opening corresponding to the door, and one end of the at least one movable structure selectively contacts the door of the wafer carrier device or inserts into the wafer carrier device from the wafer pick-and-place opening.

7. The door detection system of claim 6 , wherein the at least one movable structure includes a fixing portion fixed on the at least one bearing platform, a flexible extending portion extended upwardly from the fixing portion, and a contacting portion bent from the flexible extending portion to selectively contact the door of the wafer carrier device or insert into the wafer carrier device from the wafer pick-and-place opening.

8. The door detection system of claim 6 , wherein the at least one movable structure includes a fixing seat fixed on the at least one bearing platform, a support frame movably disposed on the fixing seat, and a movable element movably disposed on the support frame to selectively contact the door of the wafer carrier device or insert into the wafer carrier device from the wafer pick-and-place opening.

9. The door detection system of claim 8 , wherein the support frame includes a U-shaped frame body, a position-limiting element disposed between two inner walls of the U-shaped frame body, and two arc-shaped sliding grooves symmetrically formed on the U-shaped frame body, wherein the movable element includes a movable block selectively contacting the position-limiting element or separated from the position-limiting element and two pivot posts respectively disposed on two opposite lateral sides of the movable block and respectively slidably disposed in the two arc-shaped sliding grooves, and the movable block of the movable element selectively contacts the door of the wafer carrier device or inserts into the wafer carrier device from the wafer pick-and-place opening.

10. The door detection system of claim 8 , wherein the support frame includes a U-shaped frame body, a position-limiting element disposed between two inner walls of the U-shaped frame body, and two positioning holes symmetrically formed on the U-shaped frame body, wherein the movable element includes a fixing block fixed between the two positioning holes, at least one elastic element received in the fixing block, and a sliding block contacting the at least one elastic element and slidably mated with fixing block, and the sliding block of the movable element selectively contacts the door of the wafer carrier device or inserts into the wafer carrier device from the wafer pick-and-place opening.

Assignments (6)
RELEASE OF SECURITY INTEREST Recorded Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →
RELEASE OF SECURITY INTEREST Recorded Oct 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050695/0825 →
SECURITY INTEREST Recorded Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 27, 2017
From: INOTERA MEMORIES, INC.
To: MICRON TECHNOLOGY, INC.
Reel/Frame 041820/0815 →
SUPPLEMENT NO. 3 TO PATENT SECURITY AGREEMENT Recorded Feb 10, 2017
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 041675/0105 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 28, 2011
From: HSU, SAN CHUAN; SHAO, MING HSUAN; LIN, YAN JANG
To: INOTERA MEMORIES, INC.
Reel/Frame 027314/0649 →