Integrated circuit packaging system with interconnects and method of manufacture thereof

1. A method of manufacture of an integrated circuit packaging system comprising:

providing a base carrier having a carrier pad;

forming a conductive post on the carrier pad of the base carrier, the conductive post having a top protrusion with a protrusion top side and the conductive post for forming an electrolytic bond with the carrier pad;

mounting a base integrated circuit over the base carrier;

forming a base encapsulation over the base integrated circuit, the base encapsulation having an encapsulation top side and an encapsulation recess with the conductive post partially exposed within the encapsulation recess, the encapsulation recess wider near the encapsulation top side than near the conductive post, and the encapsulation top side above the protrusion top side; and

forming a stack external connector completely filling and conforming to the contours of encapsulation recess and the top protrusion.

2. The method as claimed in claim 1 further comprising forming a seed layer over the base carrier.

3. The method as claimed in claim 1 wherein forming the conductive post includes forming the conductive post having a post recess at the protrusion top side.

4. The method as claimed in claim 1 wherein forming the conductive post includes forming the conductive post having a body with the top protrusion horizontally extending beyond a non-horizontal extent of the body.

5. The method as claimed in claim 1 wherein forming the conductive post includes forming the conductive post with a body having a non-horizontal extent coplanar with a non-horizontal extent of the top protrusion.

6. A method of manufacture of an integrated circuit packaging system comprising:

providing a base carrier having a carrier pad;

forming a conductive post on the carrier pad of the base carrier, the conductive post having a top protrusion with a protrusion top side and the conductive post for forming an electrolytic bond with the carrier pad;

mounting a base integrated circuit over the base carrier;

forming a base encapsulation over the base integrated circuit, the base encapsulation having an encapsulation top side and an encapsulation recess with the protrusion top side partially exposed within the encapsulation recess, the encapsulation recess wider near the encapsulation top side than near the conductive post, and the encapsulation top side above the protrusion top side; and

forming a stack external connector completely filling and conforming to the contours of encapsulation recess and the top protrusion.

7. The method as claimed in claim 6 further comprising forming a seed layer over portions of the carrier pad of the base carrier.

8. The method as claimed in claim 6 wherein forming the conductive post includes forming the conductive post having a post recess at the protrusion top side, the post recess horizontally bounded by the top protrusion.

9. The method as claimed in claim 6 wherein forming the conductive post includes forming the conductive post having a body with the top protrusion horizontally extending beyond a non-horizontal extent of the body, a horizontal width of the top protrusion greater than a horizontal width of the body.

10. The method as claimed in claim 6 wherein forming the conductive post includes forming the conductive post with a body and an interior protrusion, the body having a non-horizontal extent coplanar with a non-horizontal extent of the top protrusion, the interior protrusion having an interior protrusion top side coplanar with the top protrusion top side.

11. An integrated circuit packaging system comprising:

a base carrier having a carrier pad;

a conductive post on the carrier pad of the base carrier, the conductive post having a top protrusion with a protrusion top side and the conductive post for forming an electrolytic bond with the carrier pad;

a base integrated circuit over the base carrier;

a base encapsulation over the base integrated circuit, the base encapsulation having an encapsulation top side and an encapsulation recess with the conductive post partially exposed within the encapsulation recess, the encapsulation recess wider near the encapsulation top side than near the conductive post, and the encapsulation top side above the protrusion top side; and

a stack external connector completely filling and conforming to the contours of encapsulation recess and the top protrusion.

12. The system as claimed in claim 11 further comprising a seed layer over the base carrier.

13. The system as claimed in claim 11 wherein the conductive post includes a post recess at the protrusion top side.

14. The system as claimed in claim 11 wherein the conductive post includes a body with the top protrusion horizontally extending beyond a non-horizontal extent of the body.

15. The system as claimed in claim 11 wherein the conductive post includes a body having a non-horizontal extent coplanar with a non-horizontal extent of the top protrusion.

16. The system as claimed in claim 11 wherein the base encapsulation includes the encapsulation recess with the protrusion top side partially exposed within the encapsulation recess.

17. The system as claimed in claim 16 further comprising a seed layer over portions of the carrier pad of the base carrier.

18. The system as claimed in claim 16 wherein the conductive post includes a post recess at the protrusion top side, the post recess horizontally bounded by the top protrusion.

19. The system as claimed in claim 16 wherein the conductive post includes a body with the top protrusion horizontally extending beyond a non-horizontal extent of the body, a horizontal width of the top protrusion greater than a horizontal width of the body.

20. The system as claimed in claim 16 wherein the conductive post includes a body and an interior protrusion, the body having a non-horizontal extent coplanar with a non-horizontal extent of the top protrusion, the interior protrusion having an interior protrusion top side coplanar with the top protrusion top side.