Integrated circuit packaging system with contacts and method of manufacture thereof
View Patent ↗A method of manufacture of an integrated circuit packaging system includes: forming an isolated contact having a contact protrusion; forming a die paddle, adjacent to the isolated contact, having a die paddle contour; depositing a contact pad on the contact protrusion; coupling an integrated circuit die to the contact protrusion; molding an encapsulation on the integrated circuit die; and depositing an organic filler on and between the isolated contact and the die paddle, the contact protrusion extended past the organic filler.
1. An integrated circuit packaging system comprising:
an isolated contact having a contact protrusion;
a die paddle, adjacent to the isolated contact, having a die paddle contour;
a contact pad on the contact protrusion;
an integrated circuit die coupled to the contact protrusion;
an encapsulation on the integrated circuit die; and
an organic filler on and between the isolated contact and the die paddle, the contact protrusion extended past the organic filler.
2. The integrated circuit packaging system according to claim 1 wherein the isolated contact includes a lower protrusion surface, an upper protrusion surface, a protrusion sidewall, and a protrusion recess in the lower protrusion surface.
3. The integrated circuit packaging system according to claim 1 further comprising:
a substrate; and
a conductive material on the contact pad, the conductive material connecting the isolated contact and the substrate, the conductive material covering the lower protrusion surface, the upper protrusion surface, and the protrusion sidewall.
4. The integrated circuit packaging system according to claim 1 wherein the die paddle contour includes a lower paddle protrusion surface, an upper paddle protrusion surface, and a paddle protrusion sidewall.
5. The integrated circuit packaging system according to claim 1 further comprising:
an internal connection pad on the isolated contact over the contact protrusion; and
a bond wire connecting the integrated circuit die and the internal connection pad.
6. The integrated circuit packaging system according to 1 further comprising:
an internal connection pad on the isolated contact over the contact protrusion; and
a bond wire connecting the integrated circuit die and the internal connection pad;
wherein:
the isolated contact includes a lower protrusion surface, an upper protrusion surface, a protrusion sidewall, and a protrusion recess in the lower protrusion surface.
7. The integrated circuit packaging system according to claim 6 further comprising:
a flip chip coupled to the die paddle; and
a die attach adhesive on the flip chip, the integrated circuit die positioned on the die attach adhesive.
8. The integrated circuit packaging system according to claim 6 wherein the isolated contact having the protrusion recess in the lower protrusion surface includes the protrusion recess in the center of the lower protrusion surface.
9. The integrated circuit packaging system according to claim 6 wherein the isolated contact having the protrusion recess in the lower protrusion surface includes the lower protrusion surface having a cross-shaped groove.
10. The integrated circuit packaging system according to claim 6 wherein the isolated contact having the protrusion recess in the lower protrusion surface includes the protrusion recess in the protrusion sidewall.