IP Library Granted Patent US 9,983,757
Granted Patent B2
US 9,983,757 · App. 13/355,206 · Granted May 29, 2018

Inductive touch sensor using a flexible coil

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Quick Facts
Patent No.
US 9,983,757
App. No.
13/355,206
Granted
May 29, 2018
Kind
B2
Abstract

An inductive touch sensor comprises an inductors disposed in or on a deformable substrate. When a force is applied to the deformable substrate the physical shape of the inductor will change and thereby change its inductance value. The change in the inductance value can be detected and used to indicate actuation of an associated touch key of the inductive touch sensor. A plurality of inductive touch sensors may be used to form a touch panel.

Claims (34)

1. An inductive touch sensor, comprising:

a flexible substrate configured to be touched by an object;

an inductor attached to or embedded within the flexible substrate such that a deformation of the flexible substrate also deforms the inductor, the inductor and the flexible substrate having a first position and a second position, wherein the flexible substrate and the inductor assume the second position when a force is applied thereto by a touch onto the flexible substrate;

wherein the inductor has a first inductance value when in the first position and a second inductance value when in the second position, and

an electronic circuit coupled to the inductor operable to measure inductance values thereof.

2. The inductive touch sensor according to claim 1 , wherein the first inductance value is greater than the second inductance value.

3. The inductive touch sensor according to claim 1 , wherein the first inductance value is less than the second inductance value.

4. The inductive touch sensor according to claim 1 , wherein the inductor is formed as a spiral coil.

5. The inductive touch sensor according to claim 4 , wherein the distances between the coil turns increase when the force is applied.

6. The inductive touch sensor according to claim 4 , wherein the distances between the coil turns decrease when the force is applied.

7. The inductive touch sensor according to claim 1 , wherein the flexible substrate and inductor are substantially flat when the force is not applied thereto, and concave when the force is applied thereto.

8. The inductive touch sensor according to claim 1 , wherein the flexible substrate and inductor are convex when the force is not applied thereto, and less convex when the force is applied thereto.

9. The inductive touch sensor according to claim 1 , wherein the flexible substrate and inductor are convex when the force is not applied thereto, and substantially flat when the force is applied thereto.

10. The inductive touch sensor according to claim 1 , wherein the inductor is embedded in the flexible substrate.

11. The inductive touch sensor according to claim 1 , wherein the inductor is coterminous with the flexible substrate.

12. The inductive touch sensor according to claim 1 , further comprising:

a support substrate; and

ridge spacers between the support substrate and the flexible substrate, wherein the support substrate, ridge spacers and flexible substrate form a cavity.

13. The inductive touch sensor according to claim 12 , wherein the cavity is filled with a flexible material.

14. The inductive touch sensor according to claim 12 , further comprising a conductive ground plane in the cavity and on an inside face of the support substrate, wherein the conductive ground plane influences the second inductance value of the inductor when in the second position.

15. The inductive touch sensor according to claim 12 , further comprising a magnetic material in the cavity and on an inside face of the support substrate, wherein the magnetic material influences the second inductance value of the inductor when in the second position.

16. The inductive touch sensor according to claim 15 , wherein the magnetic material is selected from the group consisting of ferrite and powered iron.

17. The inductive touch sensor according to claim 1 , wherein the electronic circuit is a mixed signal integrated circuit device.

18. An inductive touch sensor, comprising:

a flexible substrate configured to be touched by an object;

a spiral coil forming an inductor attached to or embedded within the flexible substrate such that a deformation of the flexible substrate also deforms the spiral coil, the spiral coil and the flexible substrate having a first position and a second position, wherein the flexible substrate and the spiral coil assume the second position when a force is applied thereto by a finger of a person;

wherein the spiral coil has a first inductance value when in the first position and a second inductance value when in the second position, and

an electronic circuit coupled to the spiral coil operable to measure inductance values thereof.

19. An inductive touch sensor, comprising:

a mechanically operable button comprising:

a flexible substrate configured to be touched by an object; and

a spiral coil forming an inductor attached to or embedded within the flexible substrate such that a deformation of the flexible substrate also deforms the spiral coil, wherein the spiral coil is the only electronic component in the mechanically operable button and wherein the spiral coil and the flexible substrate having a first position and a second position, wherein the flexible substrate and the spiral coil assume the second position when a force is applied thereto by a finger of a person;

wherein the spiral coil has a first inductance value when in the first position and a second inductance value when in the second position, and

an electronic circuit coupled to the spiral coil operable to measure inductance values thereof.

Assignments (15)
CONFIRMATORY ASSIGNMENT Recorded Sep 7, 2022
From: MICROCHIP TECHNOLOGY INCORPORATED; MICROCHIP TECHNOLOGY IRELAND LIMITED; MICREL LLC; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROCHIP TECHNOLOGY CALDICOT LIMITED
To: POLARIS POWERLED TECHNOLOGIES, LLC
Reel/Frame 061374/0137 →
RELEASE OF SECURITY INTEREST Recorded Mar 14, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 060894/0437 →
RELEASE OF SECURITY INTEREST Recorded Mar 11, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059363/0001 →
RELEASE OF SECURITY INTEREST Recorded Mar 10, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059863/0400 →
RELEASE OF SECURITY INTEREST Recorded Mar 9, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059358/0001 →
RELEASE OF SECURITY INTEREST Recorded Feb 28, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED
Reel/Frame 059666/0545 →
RELEASE OF SECURITY INTEREST Recorded Feb 25, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059333/0222 →
SECURITY INTEREST Recorded Jun 4, 2021
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 057935/0474 →
SECURITY INTEREST Recorded Dec 24, 2020
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 055671/0612 →
SECURITY INTEREST Recorded Jun 5, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 053468/0705 →
RELEASE OF SECURITY INTEREST Recorded May 30, 2020
From: JPMORGAN CHASE BANK, N.A, AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 053466/0011 →
SECURITY INTEREST Recorded Apr 24, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 053311/0305 →
SECURITY INTEREST Recorded Sep 18, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 047103/0206 →
SECURITY INTEREST Recorded Jun 25, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 046426/0001 →
SECURITY INTEREST Recorded Feb 10, 2017
From: MICROCHIP TECHNOLOGY INCORPORATED
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 041675/0617 →