IP Library Granted Patent US 8,542,037
Granted Patent B2
US 8,542,037 · App. 13/355,749 · Granted Sep 24, 2013

Multi-level high voltage pulser integrated circuit using low voltage MOSFETs

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Quick Facts
Patent No.
US 8,542,037
App. No.
13/355,749
Granted
Sep 24, 2013
Kind
B2
Abstract

A multi-level high-voltage pulse generator integrated circuit has a digital logic-level control interface circuit. A pair of complementary MOSFETs is controlled by the digital control interface circuit. A pair of supply voltage rails is provided, wherein one of the pair of supply voltage rails is connected to each of the pair of complementary MOSFETs. A pair of Zener diodes is provided, wherein one of the pair of Zener diodes is connected to each of the pair of complementary MOSFETs. A pair of resistors is provided, wherein one of the pair of resistors is connected in parallel with each of the pair of Zener diodes. A pair of complementary voltage blocking-MOSFETs having predetermined gate bias voltages is provided, wherein each of the pair complementary voltage blocking-MOSFETs is attached to a corresponding one pair of complementary MOSFETs.

Claims (23)

1. A multi-level high-voltage pulse generator integrated circuit comprising:

a digital logic-level control interface circuit;

a pair of complementary MOSFETs controlled by the digital control interface circuit;

a pair of supply voltage rails, wherein one of the pair of supply voltage rails is connected to each of the pair of complementary MOSFETs;

a pair of Zener diodes, wherein one of the pair of Zener diodes is connected to each of the pair of complementary MOSFETs;

a pair of resistors, wherein one of the pair of resistors is connected in parallel with each of the pair of Zener diodes;

a pair of complementary voltage blocking-MOSFETs having predetermined gate bias voltages, wherein each of the pair complementary voltage blocking-MOSFETs is attached to a corresponding one pair of complementary MOSFETs.

2. A multi-level high voltage pulse generator integrated circuit comprising in accordance with claim 1 wherein the digital logic-level control interface circuit comprises a direct-coupling gate driver connected to each of the pair of complementary MOSFETs.

3. A multi-level high voltage pulse generator integrated circuit comprising in accordance with claim 1 wherein the pair of supply voltage rails are complementary voltage sources.

4. A multi-level high voltage pulse generator integrated circuit comprising in accordance with claim 1 wherein gate terminals of each of the pair of complementary voltage blocking-MOSFETs is connected to ground.

5. A multi-level high-voltage pulse generator integrated circuit comprising:

a digital logic-level control interface circuit;

at least one pair of complementary MOSFETs controlled by the digital control interface circuit;

at least one pair of supply voltage rails, wherein one of the at least one pair of supply voltage rails is connected to each of the at least one pair of complementary MOSFETs;

at least one pair of Zener diodes, wherein one of the at least one pair of Zener diodes is connected to each of the at least one pair of complementary MOSFETs;

at least one pair of resistors, wherein one of the at least one pair of resistors is connected in parallel with each of the at least one pair of Zener diodes;

at least one pair complementary voltage blocking-MOSFETs having predetermined gate bias voltages, wherein each of the at least one pair complementary voltage blocking-MOSFETs is attached to a corresponding one of the at least one pair of complementary MOSFETs.

6. A multi-level high voltage pulse generate integrated circuit comprising in accordance with claim 5 wherein a number of pairs of complementary MOSFETs is equal to a number of pairs of complementary voltage blocking-MOSFETs to generate an even number of multiple voltage levels.

7. A multi-level high voltage pulse generate integrated circuit comprising in accordance with claim 5 wherein a number of pairs of complementary MOSFETs is unequal to a number of pairs of complementary voltage blocking-MOSFETs to generate an odd number of multiple voltage levels.

8. A multi-level high voltage pulse generator integrated circuit comprising in accordance with claim 5 wherein the digital logic-level control interface circuit comprises direct-coupling gate drivers connected to each of the at least one pair of complementary MOSFETs.

9. A multi-level high voltage pulse generator integrated circuit comprising in accordance with claim 5 wherein the at least one pair of supply voltage rails are complementary voltage sources.

10. A multi-level high voltage pulse generator integrated circuit comprising in accordance with claim 5 wherein the at least one pair of supply voltage rails are shared limited number of complementary voltage sources.

11. A multi-level high voltage pulse generator integrated circuit comprising in accordance with claim 5 wherein gate terminals of each of the at least one pair of complementary voltage blocking-MOSFETs is connected to ground.

Assignments (17)
RELEASE OF SECURITY INTEREST Recorded Mar 14, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 060894/0437 →
RELEASE OF SECURITY INTEREST Recorded Mar 11, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059363/0001 →
RELEASE OF SECURITY INTEREST Recorded Mar 10, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059863/0400 →
RELEASE OF SECURITY INTEREST Recorded Mar 9, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059358/0001 →
RELEASE OF SECURITY INTEREST Recorded Feb 28, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED
Reel/Frame 059666/0545 →
RELEASE OF SECURITY INTEREST Recorded Feb 25, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059333/0222 →
SECURITY INTEREST Recorded Jun 4, 2021
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 057935/0474 →
SECURITY INTEREST Recorded Dec 24, 2020
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 055671/0612 →
SECURITY INTEREST Recorded Jun 5, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 053468/0705 →
RELEASE OF SECURITY INTEREST Recorded May 30, 2020
From: JPMORGAN CHASE BANK, N.A, AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 053466/0011 →
SECURITY INTEREST Recorded Apr 24, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 053311/0305 →
SECURITY INTEREST Recorded Sep 18, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 047103/0206 →
SECURITY INTEREST Recorded Jun 25, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 046426/0001 →
SECURITY INTEREST Recorded Feb 10, 2017
From: MICROCHIP TECHNOLOGY INCORPORATED
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 041675/0617 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 22, 2014
From: SUPERTEX LLC
To: MICROCHIP TECHNOLOGY INCORPORATED
Reel/Frame 034689/0257 →
CHANGE OF NAME Recorded Dec 19, 2014
From: SUPERTEX, INC.
To: SUPERTEX LLC
Reel/Frame 034682/0134 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 23, 2012
From: CHOY, BEN; CHU, CHING
To: SUPERTEX, INC.
Reel/Frame 027575/0065 →