Dual hard mask lithography process

1. A method of forming a structure comprising:

forming a stack including at least a dielectric material layer and a first metallic hard mask layer;

patterning said first metallic hard mask layer with at least one line pattern;

forming at least a second metallic hard mask layer over said patterned first metallic hard mask layer;

depositing a first organic planarization layer (OPL) over said second metallic hard mask layer;

transferring a first lithographic pattern through said first OPL into said second metallic hard mask layer by a first etch;

removing said first OPL from above said second metallic hard mask layer;

depositing a second OPL over said second metallic hard mask layer;

transferring a second lithographic pattern through said second OPL into said second metallic hard mask layer by a second etch, wherein a first composite pattern including said first lithographic pattern and said second lithographic pattern is formed in said second metallic hard mask layer; and

transferring a second composite pattern including an intersection of said first composite pattern and said at least one line pattern into said dielectric material layer.

2. The method of claim 1 , further comprising:

coating a first photoresist layer over said second metallic hard mask layer;

forming said first lithographic pattern in said first photoresist layer, wherein said first lithographic pattern is subsequently transferred into said second metallic hard mask layer by said first etch;

coating a second photoresist layer over said second metallic hard mask layer after said first lithographic pattern is transferred into said second metallic hard mask layer; and

forming said second lithographic pattern in said second photoresist layer, wherein said second lithographic pattern is subsequently transferred into said second metallic hard mask layer by said second etch.

3. The method of claim 1 , further comprising:

coating a first photoresist layer over said first OPL, wherein said first lithographic pattern is subsequently transferred from said first photoresist layer through said first OPL into said second metallic hard mask layer by said first etch; and

coating a second photoresist layer over said second OPL, wherein said second lithographic pattern is subsequently transferred from said second photoresist layer through said second OPL into said second metallic hard mask layer by said second etch.

4. The method of claim 3 , further comprising:

depositing a first anti-reflective coating (ARC) layer over said first OPL, wherein said first photoresist layer is formed on said first ARC layer, wherein said first ARC layer functions as an etch mask during transfer of said first lithographic pattern into said first OPL; and

depositing a second ARC layer over said second OPL, wherein said second photoresist layer is formed on said second ARC layer, wherein said second ARC layer functions as an etch mask during transfer of said second lithographic pattern into said second OPL.

5. The method of claim 1 , further comprising depositing said second metallic hard mask layer as a layer comprising at least one metal and at least one organic material.

6. The method of claim 1 , further comprising depositing said second metallic hard mask layer as a layer comprising a metal-organic anti-reflective coating (ARC) material.

7. The method of claim 1 , further comprising depositing said second metallic hard mask layer as a layer comprising at least one of Ta, Ti, W, TaN, TiN, and WN.

8. The method of claim 1 , wherein said first lithographic pattern and said second lithographic pattern are via patterns, and said first composite pattern is a union of said first and second lithographic patterns.

9. A method of foaming a structure comprising:

forming a stack including at least a dielectric material layer and a first metallic hard mask layer;

patterning said first metallic hard mask layer with at least one line pattern;

depositing at least another dielectric material layer over said first metallic hard mask layer;

forming at least a second metallic hard mask layer over said patterned first metallic hard mask layer, wherein said second metallic hard mask layer is formed on said at least another dielectric material layer;

forming a first composite pattern including a first lithographic pattern and a second lithographic pattern in said second metallic hard mask layer, wherein said first composite pattern is subsequently transferred through said at least another dielectric material layer, wherein said first lithographic pattern and said second lithographic pattern are transferred into said second metallic hard mask layer by different etch processes; and

transferring a second composite pattern including an intersection of said first composite pattern and said at least one line pattern into said dielectric material layer.

10. The method of claim 9 , further comprising depositing said at least another dielectric material layer as a stack of an upper dielectric layer and a lower planarization layer, wherein said upper dielectric layer comprises at least one of silicon oxide and a silicon-containing anti-reflective coating (ARC) material, and said lower planarization layer comprises at least one of amorphous carbon and a self-planarizing organic material.

11. The method of claim 9 , further comprising depositing said at least another dielectric material layer as a single dielectric material layer comprising a hydrogenated silicon nitride material.

12. A method of forming a structure comprising:

forming a stack including at least a dielectric material layer and a first metallic hard mask layer;

patterning said first metallic hard mask layer with at least one line pattern;

forming at least a second metallic hard mask layer over said patterned first metallic hard mask layer;

forming a first composite pattern including a first lithographic pattern and a second lithographic pattern in said second metallic hard mask layer, wherein said first lithographic pattern and said second lithographic pattern are transferred into said second metallic hard mask layer by different etch processes; and

transferring a second composite pattern including an intersection of said first composite pattern and said at least one line pattern into said dielectric material layer,

wherein said second composite pattern is transferred to a first depth within said dielectric material layer, and said method further comprises transferring said at least one line pattern into said dielectric material layer, wherein said second composite pattern is further transferred to another depth that is greater than said first depth within said dielectric material layer during transfer of said at least one line pattern into said dielectric material layer.

13. The method of claim 12 , further comprising:

depositing a conductive material within at least one trench formed after transferring said second composite pattern to said second depth; and

removing said first metallic hard mask layer and said conductive material from above said dielectric material layer, wherein at least one integrated line-via structure comprising said conductive material is formed within said dielectric material layer.

14. The method of claim 12 , further comprising:

coating a first photoresist layer over said second metallic hard mask layer;

forming said first lithographic pattern in said first photoresist layer, wherein said first lithographic pattern is subsequently transferred into said second metallic hard mask layer by a first etch;

coating a second photoresist layer over said second metallic hard mask layer after said first lithographic pattern is transferred into said second metallic hard mask layer; and

forming said second lithographic pattern in said second photoresist layer, wherein said second lithographic pattern is subsequently transferred into said second metallic hard mask layer by a second etch.

15. The method of claim 12 , further comprising:

depositing a first organic planarization layer (OPL) over said second metallic hard mask layer, wherein said first lithographic pattern is subsequently transferred through said first OPL into said second metallic hard mask layer by a first etch;

removing said first OPL from above said second metallic hard mask layer; and

depositing a second OPL over said second metallic hard mask layer, wherein said second lithographic pattern is subsequently transferred through said second OPL into said second metallic hard mask layer by a second etch.

16. The method of claim 15 , further comprising:

coating a first photoresist layer over said first OPL, wherein said first lithographic pattern is subsequently transferred from said first photoresist layer through said first OPL into said second metallic hard mask layer by said first etch; and

coating a second photoresist layer over said second OPL, wherein said second lithographic pattern is subsequently transferred from said second photoresist layer through said second OPL into said second metallic hard mask layer by said second etch.

17. The method of claim 12 , further comprising depositing said second metallic hard mask layer as a layer comprising at least one metal and at least one organic material.

18. The method of claim 17 , further comprising:

depositing a first anti-reflective coating (ARC) layer over said first OPL, wherein said first photoresist layer is formed on said first ARC layer, wherein said first ARC layer functions as an etch mask during transfer of said first lithographic pattern into said first OPL; and

depositing a second ARC layer over said second OPL, wherein said second photoresist layer is formed on said second ARC layer, wherein said second ARC layer functions as an etch mask during transfer of said second lithographic pattern into said second OPL.

19. The method of claim 12 , further comprising depositing said second metallic hard mask layer as a layer comprising a metal-organic anti-reflective coating (ARC) material.

20. The method of claim 12 , further comprising depositing said second metallic hard mask layer as a layer comprising at least one of Ta, Ti, W, TaN, TiN, and WN.

21. The method of claim 12 , further comprising depositing at least another dielectric material layer over said first metallic hard mask layer, wherein said second metallic hard mask layer is formed on said at least another dielectric material layer, wherein said first composite pattern is subsequently transferred through said at least another dielectric material layer.

22. The method of claim 21 , further comprising depositing said at least another dielectric material layer as a stack of an upper dielectric layer and a lower planarization layer, wherein said upper dielectric layer comprises at least one of silicon oxide and a silicon-containing anti-reflective coating (ARC) material, and said lower planarization layer comprises at least one of amorphous carbon and a self-planarizing organic material.

23. The method of claim 12 , wherein said first lithographic pattern and said second lithographic pattern are via patterns, and said first composite pattern is a union of said first and second lithographic patterns.

24. A method of forming a structure comprising:

forming a stack including at least a dielectric material layer and a first metallic hard mask layer;

patterning said first metallic hard mask layer with at least one line pattern;

forming at least a second metallic hard mask layer, a first organic planarization layer (OPL), and a first photoresist layer over said patterned first metallic hard mask layer;

forming a first lithographic pattern in said first photoresist layer and transferring said first lithographic pattern into said first OPL and said second metallic hard mask layer by a first etch;

removing said first OPL from above said second metallic hard mask layer;

forming a second OPL and a second photoresist layer over said second metallic hard mask layer;

patterning a second lithographic pattern in said second photoresist layer and transferring said second lithographic pattern into said second OPL and said second metallic hard mask layer by a second etch, wherein a first composite pattern including said first lithographic pattern and said second lithographic pattern is formed in said second metallic hard mask layer; and

transferring a second composite pattern including an intersection of said first composite pattern and said at least one line pattern into said dielectric material layer.

25. A method of forming a structure comprising:

forming a stack including at least a dielectric material layer and a first metallic hard mask layer;

patterning said first metallic hard mask layer with at least one line pattern;

forming at least another dielectric material layer, a second metallic hard mask layer, a first organic planarization layer (OPL), and a first photoresist layer over said patterned first metallic hard mask layer;

forming a first lithographic pattern in said first photoresist layer and transferring said first lithographic pattern into said first OPL and said second metallic hard mask layer by a first etch;

removing said first OPL from above said second metallic hard mask layer;

forming a second OPL and a second photoresist layer over said second metallic hard mask layer;

patterning a second lithographic pattern in said second photoresist layer and transferring said second lithographic pattern into said second OPL and said second metallic hard mask layer by a second etch, wherein a first composite pattern including said first lithographic pattern and said second lithographic pattern is formed in said second metallic hard mask layer;

transferring said first composite pattern through said at least another dielectric material layer; and

transferring a second composite pattern including an intersection of said first composite pattern and said at least one line pattern into said dielectric material layer.