Integrated circuit packaging system with interconnects
View Patent ↗A method of manufacture of an integrated circuit packaging system includes: providing a base substrate; mounting a base integrated circuit over the base substrate; attaching a lead to the base integrated circuit and the base substrate, the lead having a lead attachment portion over the base integrated circuit; and forming a base encapsulation over the lead, the base encapsulation having a cavity exposing the lead attachment portion.
1. An integrated circuit packaging system comprising:
a base substrate;
a base integrated circuit over the base substrate;
a lead attached to the base integrated circuit and the base substrate, the lead having a lead attachment portion over the base integrated circuit, a device-lead attach layer is attached to the base integrated circuit and the lead attachment portion; and
a base encapsulation over the lead, the base encapsulation having a cavity exposing top surface of the lead attachment portion and a sidewall of a lead upper portion, wherein the top surface of the exposed lead attachment portion is lower than a top surface of the base encapsulation.
2. The system as claimed in claim 1 wherein the lead includes the lead upper portion and a lead top connection portion downwardly extending from the lead upper portion to the lead attachment portion.
3. The system as claimed in claim 1 wherein the lead is attached to a base inactive side of the base integrated circuit.
4. The system as claimed in claim 1 further comprising:
an internal package paddle;
an internal integrated circuit over the internal package paddle;
an internal encapsulation over the internal integrated circuit and directly on the lead.
5. The system as claimed in claim 1 further comprising an additional base integrated circuit over the base integrated circuit.
6. The system as claimed in claim 1 further comprising a base connector attached to the base integrated circuit and the base substrate.
7. The system as claimed in claim 6 wherein:
the lead includes the lead upper portion and a lead top connection portion downwardly extending from the lead upper portion to the lead attachment portion; and
the base encapsulation includes the cavity partially exposing the lead top connection portion.
8. The system as claimed in claim 6 wherein the lead is attached to a periphery at a base inactive side of the base integrated circuit.
9. The system as claimed in claim 6 further comprising:
an internal package paddle;
an internal integrated circuit over the internal package paddle;
an internal encapsulation over the internal integrated circuit and directly on the lead, a top extent of the internal encapsulation coplanar with a top extent of the lead attachment portion.
10. The system as claimed in claim 6 further comprising:
an additional base integrated circuit over the base integrated circuit; and
an additional base connector directly attached to the additional base integrated circuit and the base substrate.