Integrated circuit packaging system with pad connection and method of manufacture thereof
View Patent ↗A method of manufacture of an integrated circuit packaging system includes: forming a peripheral lead having a peripheral lead bottom side, a peripheral lead top side, a peripheral lead non-horizontal side, a peripheral lead horizontal ridge, and a peripheral lead conductive plate, the peripheral lead horizontal ridge protruding from the peripheral lead non-horizontal side; forming a central lead adjacent to the peripheral lead; forming a first top distribution layer on the peripheral lead top side; connecting an integrated circuit to the first top distribution layer; applying an insulation layer directly on a bottom extent of the first top distribution layer and a peripheral lead ridge lower side of the peripheral lead horizontal ridge; and attaching a heatsink to the central lead under the integrated circuit.
1. A method of manufacture of an integrated circuit packaging system comprising:
forming a peripheral lead having a peripheral lead bottom side, a peripheral lead top side, a peripheral lead non-horizontal side, a peripheral lead horizontal ridge, and a peripheral lead conductive plate, the peripheral lead horizontal ridge protruding from the peripheral lead non-horizontal side;
forming a central lead adjacent to the peripheral lead;
forming a first top distribution layer on the peripheral lead top side;
connecting an integrated circuit to the first top distribution layer;
applying an insulation layer directly on a bottom extent of the first top distribution layer and a peripheral lead ridge lower side of the peripheral lead horizontal ridge; and
attaching a heatsink to the central lead under the integrated circuit.
2. The method as claimed in claim 1 wherein forming the peripheral lead includes forming the peripheral lead having the peripheral lead conductive plate with a recess at the peripheral lead bottom side.
3. The method as claimed in claim 1 further comprising forming a central top distribution layer directly on the central lead.
4. The method as claimed in claim 1 wherein forming the peripheral lead includes forming the peripheral lead having a peripheral lead step portion protruding from the peripheral lead top side.
5. The method as claimed in claim 1 wherein forming the central lead includes forming the central lead directly under the integrated circuit.
6. A method of manufacture of an integrated circuit packaging system comprising:
forming a peripheral lead having a peripheral lead bottom side, a peripheral lead top side, a peripheral lead non-horizontal side, a peripheral lead horizontal ridge, and a peripheral lead conductive plate, the peripheral lead horizontal ridge protruding from the peripheral lead non-horizontal side;
forming a central lead adjacent to the peripheral lead;
forming a first top distribution layer on the peripheral lead top side;
connecting an integrated circuit to the first top distribution layer;
forming an encapsulation on the integrated circuit and the first top distribution layer;
applying an insulation layer directly on a bottom extent of the first top distribution layer and a peripheral lead ridge lower side of the peripheral lead horizontal ridge; and
attaching a heatsink to the central lead under the integrated circuit.
7. The method as claimed in claim 6 wherein attaching the heatsink to the central lead includes attaching the heatsink having a cavity within a raised center portion of the heatsink.
8. The method as claimed in claim 6 wherein attaching the heatsink to the central lead includes attaching the heatsink having a fully flat bottom surface.
9. The method as claimed in claim 6 wherein:
forming the peripheral lead includes forming the peripheral lead having a peripheral lead step portion protruding from the peripheral lead top side; and
forming the first top distribution layer includes forming the first top distribution layer having a peripheral distribution step portion directly on the peripheral lead step portion.
10. The method as claimed in claim 6 further comprising applying a sink adhesive on the heatsink and the central lead.