INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SUPPORT STRUCTURE AND METHOD OF MANUFACTURE THEREOF

1 . A method of manufacture of an integrated circuit packaging system comprising:

providing a single-layer support structure having a structure non-horizontal surface;

forming a single-layer contact coplanar with the single-layer support structure, the single-layer contact having a contact non-horizontal surface;

forming a single-layer insulation coplanar with the single-layer contact and horizontally between the structure non-horizontal surface and the contact non-horizontal surface;

forming an upper support pad over the single-layer insulation and directly on the single-layer support structure; and

mounting an integrated circuit over the upper support pad.

2 . The method as claimed in claim 1 wherein forming the single-layer insulation includes forming the single-layer insulation having an insulation lower surface below the single-layer contact.

3 . The method as claimed in claim 1 wherein forming the single-layer insulation includes forming the single-layer insulation having an insulation lower surface coplanar with a contact lower surface of the single-layer contact.

4 . The method as claimed in claim 1 further comprising attaching a heat spreader to the single-layer support structure.

5 . The method as claimed in claim 1 wherein:

providing the single-layer support structure includes providing the single-layer support structure having an isolated support structure; and

mounting the integrated circuit includes mounting the integrated circuit directly over the isolated support structure.

6 . A method of manufacture of an integrated circuit packaging system comprising:

providing a single-layer support structure having a structure non-horizontal surface;

forming a single-layer contact coplanar with the single-layer support structure, the single-layer contact having a contact non-horizontal surface;

forming a single-layer insulation coplanar with the single-layer contact and horizontally between the structure non-horizontal surface and the contact non-horizontal surface;

forming an upper support pad over the single-layer insulation and directly on the single-layer support structure;

mounting an integrated circuit over the upper support pad; and

forming an encapsulation over the integrated circuit and directly on the single-layer insulation.

7 . The method as claimed in claim 6 wherein forming the single-layer insulation includes forming the single-layer insulation horizontally between the contact non-horizontal surface and another of the contact non-horizontal surface, the single-layer insulation having an insulation lower surface below the single-layer contact.

8 . The method as claimed in claim 6 wherein forming the single-layer insulation includes forming the single-layer insulation having an insulation lower surface coplanar with a contact lower surface of the single-layer contact and a structure lower surface of the single-layer support structure.

9 . The method as claimed in claim 6 further comprising:

forming a lower support pad directly on the single-layer support structure; and

attaching a heat spreader to the lower support pad.

10 . The method as claimed in claim 6 wherein:

providing the single-layer support structure includes providing the single-layer support structure having an isolated support structure; and

mounting the integrated circuit includes mounting the integrated circuit directly over the isolated support structure; and

further comprising:

attaching an external connector to the single-layer support structure.

11 . An integrated circuit packaging system comprising:

a single-layer support structure having a structure non-horizontal surface;

a single-layer contact coplanar with the single-layer support structure, the single-layer contact having a contact non-horizontal surface;

a single-layer insulation coplanar with the single-layer contact and horizontally between the structure non-horizontal surface and the contact non-horizontal surface;

an upper support pad over the single-layer insulation and directly on the single-layer support structure; and

an integrated circuit over the upper support pad.

12 . The system as claimed in claim 11 wherein the single-layer insulation includes an insulation lower surface below the single-layer contact.

13 . The system as claimed in claim 11 wherein the single-layer insulation includes an insulation lower surface coplanar with a contact lower surface of the single-layer contact.

14 . The system as claimed in claim 11 further comprising a heat spreader attached to the single-layer support structure.

15 . The system as claimed in claim 11 wherein:

the single-layer support structure includes an isolated support structure; and

the integrated circuit is directly over the isolated support structure.

16 . The system as claimed in claim 11 further comprising an encapsulation over the integrated circuit and directly on the single-layer insulation.

17 . The system as claimed in claim 16 wherein the single-layer insulation is horizontally between the contact non-horizontal surface and another of the contact non-horizontal surface, the single-layer insulation having an insulation lower surface below the single-layer contact.

18 . The system as claimed in claim 16 wherein the single-layer insulation includes an insulation lower surface coplanar with a contact lower surface of the single-layer contact and a structure lower surface of the single-layer support structure.

19 . The system as claimed in claim 16 further comprising:

a lower support pad directly on the single-layer support structure; and

a heat spreader attached to the lower support pad.

20 . The system as claimed in claim 16 wherein:

the single-layer support structure includes an isolated support structure; and

the integrated circuit is directly over the isolated support structure; and

further comprising:

an external connector attached to the single-layer support structure.