Bump-on-lead flip chip interconnection
View Patent ↗A semiconductor device has a semiconductor die with a plurality of bumps formed over the die. A substrate has a plurality of conductive traces formed on the substrate. Each trace has an interconnect site for mating to the bumps. The interconnect sites have parallel edges along a length of the conductive traces under the bumps from a plan view for increasing escape routing density. The bumps have a noncollapsible portion for attaching to a contact pad on the die and fusible portion for attaching to the interconnect site. The fusible portion melts at a temperature which avoids damage to the substrate during reflow. The noncollapsible portion includes lead solder, and fusible portion includes eutectic solder. The interconnect sites have a width which is less than 1.2 times a width of the conductive trace. Alternatively, the interconnect sites have a width which is less than one-half a diameter of the bump.
1. A method of making a semiconductor device, comprising:
providing a semiconductor die including a composite bump comprising a non-collapsible portion contacting the semiconductor die and collapsible portion formed over the non-collapsible portion away from the semiconductor die;
providing a substrate including a trace;
mounting the composite bump to the trace by applying a force to the composite bump at a first temperature to deform the collapsible portion of the composite bump over the trace; and
removing the force while maintaining the first temperature.
2. The method of claim 1 , further including:
increasing the first temperature to a second temperature greater than the first temperature after removing the force; and
decreasing the second temperature to a third temperature less than the second temperature.
3. The method of claim 1 , further including forming an adhesive layer over a surface of the substrate.
4. The method of claim 1 , wherein an interconnect site between the composite bump and the trace has a width less than a width of the composite bump.
5. The method of claim 1 , wherein the non-collapsible portion of the composite bump includes eutectic solder.
6. The method of claim 1 , wherein the composite bump contacts a sidewall of the trace.
7. A method of making a semiconductor device, comprising:
providing a semiconductor die including a composite bump comprising a non-collapsible portion contacting the semiconductor die and collapsible portion formed over the non-collapsible portion away from the semiconductor die;
mounting the composite bump to a trace by applying a force to the composite bump at a first temperature to deform the collapsible portion of the composite bump over the trace; and
removing the force while maintaining the first temperature.
8. The method of claim 7 , further including increasing the first temperature to a second temperature greater than the first temperature after removing the force.
9. The method of claim 8 , further including decreasing the second temperature to a third temperature less than the second temperature.
10. The method of claim 7 , further including forming an adhesive layer over the trace.
11. The method of claim 7 , wherein an interconnect site between the composite bump and the trace has a width less than a width of the composite bump.
12. The method of claim 7 , wherein the non-collapsible portion of the composite bump includes eutectic solder.
13. The method of claim 7 , wherein the composite bump contacts a sidewall of the trace.
14. A method of making a semiconductor device, comprising:
providing a semiconductor die including a composite bump comprising a non-collapsible portion contacting the semiconductor die and collapsible portion formed over the non-collapsible portion away from the semiconductor die; and
mounting the composite bump over a trace by applying a force at a first temperature to deform a collapsible portion of the composite bump over the trace.
15. The method of claim 14 , further including removing the force while maintaining the first temperature.
16. The method of claim 15 , further including:
increasing the first temperature to a second temperature greater than the first temperature after removing force; and
decreasing the second temperature to a third temperature less than the second temperature.
17. The method of claim 14 , further including forming an adhesive layer over the trace.
18. The method of claim 14 , wherein an interconnect site between the composite bump and the trace has a width less than a width of the composite bump.
19. The method of claim 14 , wherein the non-collapsible portion of the composite bump includes eutectic solder.
20. The method of claim 14 , wherein the composite bump contacts a sidewall of the trace.
21. A semiconductor device, comprising:
a trace including an interconnect site formed over a substrate;
an adhesive layer formed over the substrate; and
a semiconductor die including a composite bump mounted over the interconnect site, wherein the composite bump includes a non-collapsible portion contacting the semiconductor die and collapsible portion formed over the non-collapsible portion away from the semiconductor die.
22. The semiconductor device of claim 21 , wherein the semiconductor die is mounted over the interconnect site without an insulating mask around the interconnect site.
23. The semiconductor device of claim 21 , further including an underfill material deposited between the semiconductor die and the substrate.
24. The semiconductor device of claim 21 , wherein the composite bump contacts a sidewall of the trace.
25. The semiconductor device of claim 21 , wherein a width of the interconnect site is less than a width of the composite bump.