IP Library Granted Patent US 8,858,003
Granted Patent B2
US 8,858,003 · App. 13/468,504 · Granted Oct 14, 2014

Physical force capacitive touch sensors having conductive plane and backlighting

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Quick Facts
Patent No.
US 8,858,003
App. No.
13/468,504
Granted
Oct 14, 2014
Kind
B2
Abstract

A physical force capacitive touch sensor comprises a capacitive sensor element on a substrate, a physically deformable electrically insulating spacer over the capacitive sensor element and a conductive plane over the physically deformable electrically insulating spacer. A protective fascia may be placed over the conductive plane provides an environmental seal for physical and weather protection, but is not essential to operation of the capacitive touch sensor. Back lighting is accomplished with a light transmissive layer having a suspended metal target proximate to the capacitive touch sensor plate. When the light transmissive layer and metal target are displaced toward the capacitive touch sensor plate the capacitance value of the capacitive touch sensor plate changes and that change is detected.

Claims (19)

1. A backlit capacitive touch sensor key, comprising:

a substrate;

a capacitive sensor plate on the substrate;

a light source;

a spacer layer on the substrate, wherein the spacer layer has an opening that surrounds the capacitive sensor plate and the light source;

a flexible light translucent layer;

a metal target attached to a face of the flexible light translucent layer proximate to the capacitive sensor plate, wherein the metal target has opening therein to allow light to pass therethrough;

the flexible light translucent layer is attached to the spacer layer over the capacitive sensor plate and light source, wherein a light transmission cavity is formed between the substrate and the flexible light translucent layer and metal target;

whereby when the flexible light translucent layer and metal target are biased toward the capacitive sensor plate, a capacitance value of the capacitive sensor plate changes.

2. The backlit capacitive touch sensor key according to claim 1 , wherein the light source is at least one light emitting diode (LED).

3. The backlit capacitive touch sensor key according to claim 1 , wherein the light source is an organic light emitting diode (OLED) layer.

4. The backlit capacitive touch sensor key according to claim 1 , wherein the light source is an electroluminescence (EL) layer.

5. The backlit capacitive touch sensor key according to claim 1 , wherein the metal target is light opaque and has at least one opening therein for light from the light source to pass therethrough.

6. The backlit capacitive touch sensor key according to claim 1 , further comprising a flexible over-layer over the flexible light translucent layer.

7. The backlit capacitive touch sensor key according to claim 6 , wherein the flexible over-layer is made of light transmissive material.

8. The backlit capacitive touch sensor key according to claim 6 , wherein the flexible over-layer is made of light opaque material and has opening therein for light from the light source to pass therethrough.

9. The backlit capacitive touch sensor key according to claim 8 , wherein the flexible over-layer is metal.

10. The backlit capacitive touch sensor key according to claim 8 , wherein the flexible over-layer is nonmetallic.

11. The backlit capacitive touch sensor key according to claim 1 , wherein the substrate is a printed circuit board.

Assignments (15)
RELEASE OF SECURITY INTEREST Recorded Mar 14, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 060894/0437 →
RELEASE OF SECURITY INTEREST Recorded Mar 11, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059363/0001 →
RELEASE OF SECURITY INTEREST Recorded Mar 10, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059863/0400 →
RELEASE OF SECURITY INTEREST Recorded Mar 9, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059358/0001 →
RELEASE OF SECURITY INTEREST Recorded Feb 28, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED
Reel/Frame 059666/0545 →
RELEASE OF SECURITY INTEREST Recorded Feb 25, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059333/0222 →
SECURITY INTEREST Recorded Jun 4, 2021
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 057935/0474 →
SECURITY INTEREST Recorded Dec 24, 2020
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 055671/0612 →
SECURITY INTEREST Recorded Jun 5, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 053468/0705 →
RELEASE OF SECURITY INTEREST Recorded May 30, 2020
From: JPMORGAN CHASE BANK, N.A, AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 053466/0011 →
SECURITY INTEREST Recorded Apr 24, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 053311/0305 →
SECURITY INTEREST Recorded Sep 18, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 047103/0206 →
SECURITY INTEREST Recorded Jun 25, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 046426/0001 →
SECURITY INTEREST Recorded Feb 10, 2017
From: MICROCHIP TECHNOLOGY INCORPORATED
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 041675/0617 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 14, 2012
From: PORTER, STEPHEN B.; CURTIS, KEITH; DUVENHAGE, FANIE
To: MICROCHIP TECHNOLOGY INCORPORATED
Reel/Frame 028375/0473 →