IP Library Granted Patent US 8,837,252
Granted Patent B2
US 8,837,252 · App. 13/485,675 · Granted Sep 16, 2014

Memory decoder circuit

Inventors: Lorenzo Bedarida (Vimercate, IT); Nicolas Zammit (Aix en Provence, FR); Emmanuel Racape (Aix-en-Provence, FR)
Assignee: Atmel Corporation
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Quick Facts
Patent No.
US 8,837,252
App. No.
13/485,675
Granted
Sep 16, 2014
Kind
B2
Abstract

A decoder circuit includes high voltage and low voltage transistors. The decoder circuit uses the high voltage transistors during modify operations to provide a high voltage, e.g., a boosted voltage, to memory cells to change memory cell status or perform other operations. The decoder circuit uses the low voltage transistors during read operations.

Claims (29)

1. A memory circuit comprising:

a plurality of memory cells arranged into a plurality of rows and a plurality of columns;

a decoder circuit coupled to the plurality of memory cells, the decoder circuit comprising:

first and second high voltage transistors coupled to a boosted voltage node;

first and second low voltage transistors coupled to a voltage supply node, wherein the boosted voltage node is configured to provide a voltage higher than a supply voltage at the voltage supply node; and

a middle transistor coupled between the first and second high voltage transistors and the first and second low voltage transistors.

2. The memory circuit of claim 1 , further comprising a control circuit coupled to a gate of the third high voltage transistor, the control circuit configured to perform operations comprising:

determining that the memory circuit is performing a read operation;

controlling the middle transistor so that the middle transistor allows current to flow from the first and second high voltage transistors to the first and second low voltage transistors;

determining that the memory circuit is performing a modify operation; and

controlling the middle transistor so that the middle transistor substantially blocks current from flowing from the first and second high voltage transistors to the first and second low voltage transistors.

3. The memory circuit of claim 1 , wherein the first and second high voltage transistors are configured to sustain a first voltage, and wherein the first and second low voltage transistors are configured to sustain a second voltage lower than the first voltage.

4. The memory circuit of claim 1 , wherein the middle transistor is configured to sustain the voltage at the boosted voltage node.

5. The memory circuit of claim 1 , wherein the first and second high voltage transistors are configured to switch at a first switching speed, and wherein the first and second low voltage transistors are configure to switch at a second switching speed faster than the first switching speed.

6. The memory circuit of claim 1 , wherein the first and second high voltage transistors are coupled to a charge pump coupled to the voltage supply node.

7. The memory circuit of claim 1 , wherein the first high voltage transistor includes a drain coupled to the boosted voltage node and a source coupled to a drain of the second high voltage transistor, and wherein the first low voltage transistor includes a source coupled to the voltage supply node and a drain coupled to a drain of the second low voltage transistor.

8. The memory circuit of claim 7 , wherein the source of the first high voltage transistor is coupled to a source of the middle transistor.

9. The memory circuit of claim 8 , wherein the drain of the first low voltage transistor is coupled to a drain of the middle transistor.

10. The memory circuit of claim 9 , wherein the source of the middle transistor is coupled to a decoder output node coupled to the plurality of memory cells.

11. A method performed by a control circuit for a decoder circuit of a memory circuit, the method comprising:

determining that the memory circuit is performing a read operation;

controlling a middle transistor so that the middle transistor allows current to flow from first and second high voltage transistors to first and second low voltage transistors;

determining that the memory circuit is performing a modify operation; and

controlling the middle transistor so that the middle transistor substantially blocks current from flowing from the first and second high voltage transistors to the first and second low voltage transistors.

12. The method of claim 11 , wherein controlling the middle transistor comprises providing a control signal to a gate of the middle transistor.

13. The method of claim 11 , further comprising, during the read operation, controlling the first and second low voltage transistors to read a selected memory cell by applying a supply voltage to a decoder output node coupled to a source of the middle transistor.

14. The method of claim 11 , further comprising, during the modify operation, controlling the first and second high voltage transistors to modify a selected memory cell by applying a boosted voltage to a decoder output node coupled to a source of the middle transistor.

15. The method of claim 11 , wherein the first and second high voltage transistors are configured to sustain a first voltage, and wherein the first and second low voltage transistors are configured to sustain a second voltage lower than the first voltage.

16. The method of claim 11 , wherein the first and second high voltage transistors are configured to switch at a first switching speed, and wherein the first and second low voltage transistors are configure to switch at a second switching speed faster than the first switching speed.

Assignments (19)
RELEASE OF SECURITY INTEREST Recorded Mar 14, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 060894/0437 →
RELEASE OF SECURITY INTEREST Recorded Mar 11, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059363/0001 →
RELEASE OF SECURITY INTEREST Recorded Mar 10, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059863/0400 →
RELEASE OF SECURITY INTEREST Recorded Mar 9, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059358/0001 →
RELEASE OF SECURITY INTEREST Recorded Feb 28, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: ATMEL CORPORATION
Reel/Frame 059262/0105 →
RELEASE OF SECURITY INTEREST Recorded Feb 25, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059333/0222 →
SECURITY INTEREST Recorded Jun 4, 2021
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 057935/0474 →
SECURITY INTEREST Recorded Dec 24, 2020
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 055671/0612 →
SECURITY INTEREST Recorded Jun 5, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 053468/0705 →
RELEASE OF SECURITY INTEREST Recorded May 30, 2020
From: JPMORGAN CHASE BANK, N.A, AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 053466/0011 →
SECURITY INTEREST Recorded Apr 24, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 053311/0305 →
SECURITY INTEREST Recorded Sep 18, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 047103/0206 →
SECURITY INTEREST Recorded Jun 25, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 046426/0001 →
SECURITY INTEREST Recorded Feb 10, 2017
From: ATMEL CORPORATION
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 041715/0747 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENT COLLATERAL Recorded Apr 7, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: ATMEL CORPORATION
Reel/Frame 038376/0001 →
PATENT SECURITY AGREEMENT Recorded Jan 3, 2014
From: ATMEL CORPORATION
To: MORGAN STANLEY SENIOR FUNDING, INC. AS ADMINISTRATIVE AGENT
Reel/Frame 031912/0173 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 9, 2013
From: ZAMMIT, NICOLAS; RACAPE, EMMANUEL
To: ATMEL ROUSSET S.A.S.
Reel/Frame 030177/0755 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 9, 2013
From: BEDARIDA, LORENZO
To: ATMEL CORPORATION
Reel/Frame 030177/0713 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 9, 2013
From: ATMEL ROUSSET S.A.S
To: ATMEL CORPORATION
Reel/Frame 030181/0642 →
Continuity (1)
Related Publication 20130322185A1 · Dec 5, 2013