Integrated circuit packaging system with heatsink cap and method of manufacture thereof
View Patent ↗A method of manufacture of an integrated circuit packaging system includes: providing a substrate; attaching an integrated circuit to the substrate; molding an encapsulation directly on the integrated circuit and the substrate; forming a trench in the encapsulation having a trench bottom surface and surrounding the integrated circuit; and mounting a heatsink having a heatsink rim over the integrated circuit with the heatsink rim within the trench and the heatsink electrically isolated from the substrate.
1. An integrated circuit packaging system comprising:
a substrate;
an integrated circuit attached to the substrate;
an encapsulation molded directly on the integrated circuit and the substrate with the encapsulation having a trench with a trench bottom surface and the trench surrounding the integrated circuit and a device inactive side of the integrated circuit exposed from the encapsulation with the device inactive side coplanar with an encapsulation top side; and
a heatsink having a heatsink body and a heatsink rim extending downward below the heatsink body, the heatsink mounted over the integrated circuit with the heatsink rim within the trench.
2. The system as claimed in claim 1 wherein the heatsink includes:
the heatsink rim attached to the trench bottom surface;
the heatsink having a heatsink inner surface attached to the integrated circuit; and
further comprising:
an adhesive layer between the heatsink rim and the trench bottom surface, and
a thermal interface material layer between the heatsink inner surface and the integrated circuit.
3. The system as claimed in claim 1 wherein the encapsulation includes the trench having debris characteristic of laser etching.
4. The system as claimed in claim 1 wherein the encapsulation includes the trench having scratches characteristic of sawing.
5. The system as claimed in claim 1 further comprising connecting an external interconnect to the substrate interconnect.
6. The system as claimed in claim 5 wherein the encapsulation includes the trench having a molded surface characteristic of molding.
7. The system as claimed in claim 5 wherein the encapsulation includes the trench having a trench depth less than a device height of the integrated circuit.
8. The system as claimed in claim 5 further comprising a thermal interface material layer directly on a device inactive side and an encapsulation top side.
9. The system as claimed in claim 5 further comprising a trench segment of the trench aligned with a horizontal side of the integrated circuit.