Leadframe-based mold array package heat spreader and fabrication method therefor

1. A heat spreader frame comprising:

heat spreaders having upper surfaces;

a peripheral frame surrounding the heat spreaders; spreaders, the peripheral frame having stand-off legs;

tie bars having upper surfaces and a pin identifier at an end portion of the tie bars, the heat spreaders connected to one another and to the peripheral frame by the tie bars, the width of the stand-off legs wider than widths of the tie bars;

at least portions of the upper surfaces of the tie bars being thinned to reduce heights of the tie bars;

the upper surfaces of the heat spreader in an elevated position supported by the peripheral frame; and

the heat spreaders and the tie bars covered by a package molding compound exposing the upper surface of the heat spreaders and one surface of the pin identifier coplanar to the upper surfaces of the heat spreaders.

2. The heat spreader frame of claim 1 wherein the peripheral frame is formed to support the heat spreader upper surfaces in an elevated position with respect thereto with a height greater than a predetermined depth of a mold cavity of the package molding compound configured for receiving the heat spreaders therein.

3. The heat spreader frame of claim 1 wherein the peripheral frame includes openings in the peripheral frame to facilitate mold flow therethrough.

4. The heat spreader frame of claim 1 further comprising ground connection legs extended downwardly from the heat spreaders.

5. The heat spreader frame of claim 1 further comprising a pin 1 identifier of one the tie bars on the one of the tie bars.

6. A heat spreader frame comprising:

a plurality of heat spreaders;

a peripheral frame surrounding the heat spreaders having stand-off legs;

a plurality of tie bars spaced from one another, the plurality of the tie bars connect the heat spreaders to one another and to the peripheral frame having an end portion of one of the tie bars as a pin identifier, a width of the stand-off legs wider than widths of the tie bars, and ends of the tie bars are shaped as enlarged heads;

the peripheral frame formed with a height to support the heat spreaders in an elevated position with respect thereto; and

a package molding compound encapsulating the heat spreaders, tie bars, and the peripheral frame, the upper surface of the heat spreaders and one surface of the pin identifier coplanar to the upper surfaces of the heat spreaders exposed from the package molding compound.

7. The heat spreader frame of claim 6 wherein the peripheral frame is formed to support heat spreader upper surfaces of the heat spreaders in an elevated position with respect thereto with a height greater than the predetermined depth of a mold cavity of the package molding compound configured for receiving the heat spreaders therein.

8. The heat spreader frame of claim 6 wherein the peripheral frame includes openings in the peripheral frame to facilitate mold flow therethrough.

9. The heat spreader frame of claim 6 further comprising a plurality of ground connection legs extended downwardly from the heat spreaders to the height of the peripheral frame.

10. The heat spreader frame of claim 6 further comprising a pin 1 identifier of one of the tie bars on the one of the tie bars, and wherein the heat spreaders are plated with tin or nickel.

11. An integrated circuit package comprising:

a heat spreader having an upper surface;

a tie bar connected to the heat spreader, at least portions of an upper surface of the tie bar being thinned to reduce a height thereof, and an end portion of the tie bar for serving as a pin identifier; and

a package molding compound surrounding the heat spreader and the tie bar, the upper surface of the heat spreader and one surface of the pin identifier coplanar to the upper surface of the heat spreader exposed from the package molding compound.