Integrated circuit packaging system with shielding spacer and method of manufacture thereof
View Patent ↗A method of manufacture of an integrated circuit packaging system includes: providing a substrate; mounting a bottom integrated circuit over the substrate; connecting a bottom interconnect between the bottom integrated circuit and the substrate; and mounting a bottom shield-spacer above the bottom integrated circuit and the bottom shield-spacer includes a bottom shield plate above the bottom integrated circuit, a bottom shield pillar extending from a bottom shield foot and connected to the bottom shield plate, and a protuberance extending vertically above the bottom shield pillar and directly above the bottom shield foot.
1. An integrated circuit packaging system comprising:
a substrate;
a bottom integrated circuit over the substrate;
a bottom interconnect connected between the bottom integrated circuit and the substrate; and
a bottom shield-spacer above the bottom integrated circuit and the bottom shield-spacer includes a bottom shield plate above the bottom integrated circuit, a bottom shield pillar extends from a bottom shield foot and connects to the bottom shield plate, and a protuberance extends vertically above the bottom shield pillar and directly above the bottom shield foot.
2. The system as claimed in claim 1 wherein the bottom shield-spacer includes a bottom shield extension and the bottom shield extension extends above or below the bottom shield plate.
3. The system as claimed in claim 1 further comprising a top shield-spacer above the bottom shield-spacer in direct contact with the protuberance.
4. The system as claimed in claim 1 further comprising an adhesive deposited over the substrate for attaching and grounding the bottom shield-spacer.
5. The system as claimed in claim 1 wherein the bottom shield-spacer includes a bottom shield tie bar in direct contact with the bottom shield plate and the bottom shield tie bar overhangs the bottom shield pillar.
6. The system as claimed in claim 1 wherein the bottom shield plate of the bottom shield-spacer includes corner cover and the bottom shield pillar connects to the corner cover of the bottom shield plate.
7. The system as claimed in claim 6 wherein the bottom shield-spacer includes the bottom shield foot with a hole therethrough.
8. The system as claimed in claim 6 further comprising a middle integrated circuit above the bottom shield-spacer and the middle integrated circuit includes an overhang beyond the bottom integrated circuit.
9. The system as claimed in claim 6 wherein the protuberance is a bottom shield male protuberance, a bottom shield female protuberance, or a combination thereof.
10. The system as claimed in claim 6 further comprising a bottom adhesive below the bottom shield-spacer for affixing the bottom integrated circuit to the bottom shield-spacer.