IP Library Granted Patent US 8,525,583
Granted Patent B2
US 8,525,583 · App. 13/561,416 · Granted Sep 3, 2013

Circuit, an adjusting method, and use of a control loop

Inventors: Lutz Dathe (Dresden, DE); Matthias Vorwerk (Dresden, DE); Thomas Hanusch (Coswig, DE)
Assignee: Atmel Corporation
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,525,583
App. No.
13/561,416
Granted
Sep 3, 2013
Kind
B2
Abstract

A circuit, an adjusting method, and use of a control loop for adjusting a data retention voltage and/or a leakage current of a CMOS circuit for a sleep mode, wherein the CMOS circuit is operated to control in a measuring mode, whereby in the measuring mode a leakage current exclusively flows through the CMOS circuit, the control loop in the measuring mode adjusts the data retention voltage and/or the leakage current, and the adjustments of the control loop for the sleep mode are stored.

Claims (63)

1. A circuit comprising:

a CMOS circuit having NMOS field-effect transistors and having PMOS field-effect transistors;

a first load device, wherein source terminals of the NMOS field-effect transistors of the CMOS circuit are connectable via the first load device to a first supply voltage;

a second load device, wherein source terminals of the PMOS field-effect transistors of the CMOS circuit are connectable via the second load device to a second supply voltage; and

an evaluation circuit configured to:

evaluate a first source voltage at the source terminals of the NMOS field-effect transistors;

evaluate a second source voltage at the source terminals of the PMOS field-effect transistors;

determine whether a leakage current through the CMOS circuit is predominantly due to the NMOS field-effect transistors or the PMOS field-effect transistors;

adjust, when a determination is made that the leakage current is predominately due to the PMOS field-effect transistors, a first voltage drop across the first load device; and

adjust, when a determination is made that the leakage current is predominately due to the NMOS field-effect transistors, a second voltage drop across the second load device.

2. The circuit of claim 1 , wherein the circuit is configured to alternate between a sleep mode in which the leakage current flows through the CMOS circuit and an operating mode in which an operating current flows through the CMOS circuit, and wherein the operating current exceeds the leakage current.

3. The circuit of claim 1 , wherein one or more of the following is true:

the circuit has a first memory that is configured to store the adjustment of the first voltage drop; and

the circuit has a second memory configured to store the adjustment of the second voltage drop.

4. The circuit of claim 1 , wherein the first load device is configured to operate in a sleep mode in which the first voltage drop is generated via only a leakage current that flows through the CMOS circuit and the first load device.

5. The circuit of claim 1 , wherein the second load device is configured to operate in a sleep mode in which the second voltage drop is generated via only a leakage current that flows through the CMOS circuit and the second load device.

6. The circuit of claim 1 , wherein:

the evaluation circuit has a device for measuring a condition; and

the evaluation circuit is configured to perform one or more of the following:

adjust the first voltage drop to as a function of the measurement; and

adjust the second voltage drop as a function of the measurement.

7. The circuit of claim 6 , wherein:

the device comprises a temperature sensor; and

the condition comprises a temperature.

8. The circuit of claim 1 , wherein one or more of the following is true:

the first load device has an adjustable load comprising a plurality of transistors that act between the source terminals of the NMOS field-effect transistors and the first supply voltage; and

the second load device has an adjustable load comprising a plurality of transistors that act between the source terminals of the PMOS field-effect transistors and the second supply voltage.

9. The circuit of claim 1 , wherein:

the circuit, to adjust, when a determination is made that the leakage current is predominately due to the PMOS field-effect transistors, a first voltage drop across the first load device, is configured to adjust the first voltage drop across the first load device to the lowest voltage drop; and

the circuit, to adjust, when a determination is made that the leakage current is predominately due to the NMOS field-effect transistors, a second voltage drop across the second load device, is configured to adjust the second voltage drop across the second load device to the lowest voltage drop.

10. A method comprising:

determining a first source voltage applied at source terminals of NMOS field-effect transistors of a CMOS circuit;

determining a second source voltage applied at source terminals of PMOS field-effect transistors of the CMOS circuit;

determining whether a leakage current through the CMOS circuit is predominantly due to the NMOS field-effect transistors or the PMOS field-effect transistors;

adjusting, when a determination is made that the leakage current is predominately due to the PMOS field-effect transistors, a first voltage drop across a first load device, the first load device being connected to the source terminals of the NMOS field-effect transistor; and

adjusting, when a determination is made that the leakage current is predominately due to the NMOS field-effect transistors, a second voltage drop across a second load device, the second load device being connected to the source terminals of the PMOS field-effect transistor.

11. The method of claim 10 , wherein:

the first load device is directly connected to the source terminals of the NMOS field-effect transistor; and

the second load device is directly connected to the source terminals of the PMOS field-effect transistor.

12. The method of claim 10 , comprising alternating between a sleep mode in which the leakage current flows through the CMOS circuit and an operating mode in which an operating current flows through the CMOS circuit, and wherein the operating current exceeds the leakage current.

13. The method of claim 10 , comprising one or more of the following:

storing the adjustment of the first voltage drop; and

storing the adjustment of the second voltage drop.

14. The method of claim 10 , comprising operating the first load device in a sleep mode in which the first voltage drop is generated via only a leakage current that flows through the CMOS circuit and the first load device.

15. The method of claim 10 , comprising operating the second load device in a sleep mode in which the second voltage drop is generated via only a leakage current that flows through the CMOS circuit and the second load device.

16. The method of claim 10 , comprising:

measuring a condition; and

performing one or more of the following:

adjusting the first voltage drop as a function of the measurement; and

adjusting the second voltage drop as a function of the measurement.

17. The method of claim 16 , wherein measuring the condition comprises measuring a temperature using a temperature sensor.

18. The method of claim 10 , wherein one or more of the following is true:

the first load device has an adjustable load comprising a plurality of transistors that act between the source terminals of the NMOS field-effect transistors and the first supply voltage; and

the second load device has an adjustable load comprising a plurality of transistors that act between the source terminals of the PMOS field-effect transistors and the second supply voltage.

19. The method of claim 10 , wherein:

adjusting, when a determination is made that the leakage current is predominately due to the PMOS field-effect transistors, a first voltage drop across the first load device, comprises adjusting the first voltage drop across the first load device to the lowest voltage drop; and

adjusting, when a determination is made that the leakage current is predominately due to the NMOS field-effect transistors, a second voltage drop across the second load device, comprises adjusting the second voltage drop across the second load device to the lowest voltage drop.

20. An apparatus, comprising:

means for determining a first source voltage applied at source terminals of NMOS field-effect transistors of a CMOS circuit;

means for determining a second source voltage applied at source terminals of PMOS field-effect transistors of the CMOS circuit;

means for determining whether a leakage current through the CMOS circuit is predominantly due to the NMOS field-effect transistors or the PMOS field-effect transistors;

means for adjusting, when a determination is made that the leakage current is predominately due to the PMOS field-effect transistors, a first voltage drop across a first load device, the first load device being connected to the source terminals of the NMOS field-effect transistor; and

means for adjusting, when a determination is made that the leakage current is predominately due to the NMOS field-effect transistors, a second voltage drop across a second load device, the second load device being connected to the source terminals of the PMOS field-effect transistor.

Assignments (18)
RELEASE OF SECURITY INTEREST Recorded Mar 14, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 060894/0437 →
RELEASE OF SECURITY INTEREST Recorded Mar 11, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059363/0001 →
RELEASE OF SECURITY INTEREST Recorded Mar 10, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059863/0400 →
RELEASE OF SECURITY INTEREST Recorded Mar 9, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059358/0001 →
RELEASE OF SECURITY INTEREST Recorded Feb 28, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: ATMEL CORPORATION
Reel/Frame 059262/0105 →
RELEASE OF SECURITY INTEREST Recorded Feb 25, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059333/0222 →
SECURITY INTEREST Recorded Jun 4, 2021
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 057935/0474 →
SECURITY INTEREST Recorded Dec 24, 2020
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 055671/0612 →
SECURITY INTEREST Recorded Jun 5, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 053468/0705 →
RELEASE OF SECURITY INTEREST Recorded May 30, 2020
From: JPMORGAN CHASE BANK, N.A, AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 053466/0011 →
SECURITY INTEREST Recorded Apr 24, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 053311/0305 →
SECURITY INTEREST Recorded Sep 18, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 047103/0206 →
SECURITY INTEREST Recorded Jun 25, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 046426/0001 →
SECURITY INTEREST Recorded Feb 10, 2017
From: ATMEL CORPORATION
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 041715/0747 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENT COLLATERAL Recorded Apr 7, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: ATMEL CORPORATION
Reel/Frame 038376/0001 →
PATENT SECURITY AGREEMENT Recorded Jan 3, 2014
From: ATMEL CORPORATION
To: MORGAN STANLEY SENIOR FUNDING, INC. AS ADMINISTRATIVE AGENT
Reel/Frame 031912/0173 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 30, 2013
From: ATMEL AUTOMOTIVE GMBH
To: ATMEL CORPORATION
Reel/Frame 030315/0732 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 29, 2013
From: DATHE, LUTZ; VORWERK, MATTHIAS; HANUSCH, THOMAS
To: ATMEL AUTOMOTIVE GMBH
Reel/Frame 030306/0720 →
Priority Claims (1)
DE 10 2008 053 535 · Oct 28, 2008 · national
Continuity (3)
Continuation 12607630 · Oct 28, 2009
Provisional Application 61117414 · Nov 24, 2008
Related Publication 20120293246A1 · Nov 22, 2012