Semiconductor device and method of forming RDL using UV-cured conductive ink over wafer level package

1. A method of making a semiconductor device, comprising:

providing a semiconductor die;

depositing an encapsulant around the semiconductor die;

forming a first insulating layer over the semiconductor die;

forming a patterned trench in the first insulating layer and encapsulant;

depositing a conductive ink in the patterned trench in the first insulating layer and encapsulant;

planarizing the conductive ink with the first insulating layer and the encapsulant; and

curing the conductive ink by ultraviolet light at room temperature to form a redistribution layer in the patterned trench.

2. The method of claim 1 , wherein depositing the conductive ink includes:

disposing a stencil over the first insulating layer with an opening in the stencil aligned with the patterned trench; and

depositing the conductive ink through the opening in the stencil into the patterned trench.

3. The method of claim 1 , wherein depositing the conductive ink includes dispensing the conductive ink through a nozzle into the patterned trench.

4. The method of claim 1 , further including:

forming a second insulating layer over the first insulating layer and conductive ink; and

forming an interconnect structure over the conductive ink.

5. A method of making a semiconductor device, comprising:

providing a substrate;

forming a first insulating layer over the substrate;

depositing an encapsulant around the substrate;

forming a trench in the encapsulant and in the first insulating layer;

depositing a conductive ink in the trench in the encapsulant;

curing the conductive ink by ultraviolet light to form a redistribution layer in the trench;

forming a second insulating layer over the first insulating layer and redistribution layer; and

forming an interconnect structure over the redistribution layer.

6. The method of claim 5 , further including curing the conductive ink at room temperature.

7. The method of claim 5 , wherein depositing the conductive ink includes:

disposing a stencil over the first insulating layer; and

depositing the conductive ink through the stencil into the trench.

8. The method of claim 5 , wherein depositing the conductive ink includes dispensing the conductive ink through a nozzle into the trench.

9. The method of claim 5 , further including measuring a volume of the conductive ink according to a size of the trench, wherein depositing the conductive ink includes dispensing the volume of the conductive ink measured according to the size of the trench.

10. The method of claim 5 , further including planarizing the conductive ink with the first insulating layer and the encapsulant.

11. A semiconductor device, comprising:

a semiconductor die;

an encapsulant deposited around the semiconductor die;

a first insulating layer formed over the semiconductor die;

a patterned trench formed in the first insulating layer and encapsulant; and

a conductive ink deposited in the patterned trench and planarized with the first insulating layer and encapsulant, wherein the conductive ink is cured by ultraviolet light.

12. The semiconductor device of claim 11 , further including a stencil disposed over the first insulating layer, wherein the conductive ink is deposited through the stencil into the patterned trench.

13. The semiconductor device of claim 11 , further including a nozzle disposed over the patterned trench, wherein the conductive ink is dispensed through the nozzle into the patterned trench.

14. The semiconductor device of claim 11 , wherein the conductive ink is cured at room temperature.

15. The semiconductor device of claim 11 , further including:

a second insulating layer formed over the first insulating layer and conductive ink; and

an interconnect structure formed over the conductive ink.

16. A semiconductor device, comprising:

a substrate;

a first insulating layer formed over the substrate;

an encapsulant deposited around the substrate;

a trench formed in the first insulating layer and in the encapsulant;

an ultraviolet (UV) curable conductive ink deposited in the trench in the first insulating layer and the encapsulant as a redistribution layer formed in the trench;

a second insulating layer formed over the first insulating layer and redistribution layer; and

an interconnect structure formed over the redistribution layer.

17. The semiconductor device of claim 16 , wherein the UV curable conductive ink is cured by ultraviolet light.

18. The semiconductor device of claim 16 , wherein the UV curable conductive ink is cured at room temperature.

19. The semiconductor device of claim 16 , wherein the UV curable conductive ink includes flaked silver or carbon conductive materials.

20. The semiconductor device of claim 16 , further including the UV curable conductive ink planarized with the first insulating layer and the encapsulant.

21. A method of making a semiconductor device, comprising:

providing a substrate;

forming a first insulating layer over the substrate;

forming a trench in the first insulating layer;

depositing a conductive ink in the trench in the first insulating layer; and

curing the conductive ink by ultraviolet light to form a redistribution layer in the trench.

22. The method of claim 21 , further including measuring a volume of the conductive ink according to a size of the trench, wherein depositing the conductive ink includes dispensing the volume of the conductive ink measured according to the size of the trench.

23. The method of claim 21 , wherein depositing the conductive ink includes:

disposing a stencil over the first insulating layer; and

depositing the conductive ink through the stencil into the trench.

24. The method of claim 21 , wherein depositing the conductive ink includes dispensing the conductive ink through a nozzle into the trench.

25. The method of claim 21 , further including curing the conductive ink at room temperature.

26. The method of claim 21 , further including planarizing the conductive ink with the first insulating layer.