Semiconductor device and method of using substrate having base and conductive posts to form vertical interconnect structure in embedded die package
A semiconductor device has a substrate including a base and a plurality of conductive posts extending from the base. The substrate can be a wafer-shape, panel, or singulated form. The conductive posts can have a circular, rectangular, tapered, or narrowing intermediate shape. A semiconductor die is disposed through an opening in the base between the conductive posts. The semiconductor die extends above the conductive posts or is disposed below the conductive posts. An encapsulant is deposited over the semiconductor die and around the conductive posts. The base and a portion of the encapsulant is removed to electrically isolate the conductive posts. An interconnect structure is formed over the semiconductor die, encapsulant, and conductive posts. An insulating layer is formed over the semiconductor die, encapsulant, and conductive posts. A semiconductor package is disposed over the semiconductor die and electrically connected to the conductive posts.
1. A method of making a semiconductor device, comprising:
providing a substrate including a base and a plurality of conductive posts extending from the base;
disposing a semiconductor die through an opening in the base between the conductive posts;
depositing an encapsulant over the semiconductor die and around the conductive posts; and
removing the base to electrically isolate the conductive posts.
2. The method of claim 1 , further including forming an interconnect structure over the semiconductor die, encapsulant, and conductive posts.
3. The method of claim 1 , further including forming an insulating layer over the semiconductor die, encapsulant, and conductive posts.
4. The method of claim 1 , wherein a height of the semiconductor die is greater than a height of the conductive posts.
5. The method of claim 1 , wherein the semiconductor die is within a height of the conductive posts.
6. A method of making a semiconductor device, comprising:
providing a substrate including a base and a plurality of conductive posts extending from the base;
disposing the substrate over a carrier with the conductive posts disposed between the base and carrier;
disposing a semiconductor die onto the carrier through an opening in the base of the substrate while the conductive posts remain between the base and carrier; and
forming an interconnect structure over the semiconductor die and conductive posts.
7. The method of claim 6 , further including forming an insulating layer over the semiconductor die, encapsulant, and conductive posts.
8. The method of claim 6 , wherein a height of the semiconductor die is greater than a height of the conductive posts.
9. The method of claim 6 , wherein the semiconductor die is within a height of the conductive posts.
10. The method of claim 6 , wherein the conductive posts include a circular, rectangular, tapered, or thinner intermediate shape.
11. The method of claim 6 , further including removing the base of the substrate to electrically isolate the conductive posts.
12. The method of claim 6 , further including disposing a semiconductor package over the semiconductor die and electrically connected to the conductive posts.
13. A method of making a semiconductor device, comprising:
providing a substrate including a plurality of conductive posts and an opening formed completely through the substrate;
disposing a semiconductor die through the opening and between the conductive posts; and
removing a portion of the substrate to electrically isolate the conductive posts.
14. The method of claim 13 , further including forming an interconnect structure over the semiconductor die and conductive posts.
15. The method of claim 13 , further including forming an insulating layer over the semiconductor die and conductive posts.
16. The method of claim 13 , wherein the conductive posts include a circular, rectangular, tapered, or thinner intermediate shape.
17. The method of claim 13 , wherein a height of the semiconductor die is greater than a height of the conductive posts.
18. The method of claim 13 , wherein the semiconductor die is within a height of the conductive posts.
19. The method of claim 1 , further including:
disposing the substrate over a carrier; and
depositing the encapsulant between the base and carrier.