IP Library Granted Patent US 9,450,419
Granted Patent B2
US 9,450,419 · App. 13/841,829 · Granted Sep 20, 2016

Combined power supply and input/output system with boost capability

Inventors: Joseph Julicher (Maricopa, AZ); Pieter Schieke (Phoenix, AZ); Vivien Delport (Chandler, AZ)
Assignee: MICROCHIP TECHNOLOGY INCORPORATED
H02J4/00G06F13/4072G06F13/4291H02J7/00H04B3/542H04B3/548H04L12/10Y10T307/74
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Quick Facts
Patent No.
US 9,450,419
App. No.
13/841,829
Granted
Sep 20, 2016
Kind
B2
Abstract

A combined power and input/output system for an electronic device includes a host system; a target system operably coupled to the host system via a combined power and I/O line; and a power boost circuit in the target system for enabling a higher voltage target device.

Claims (28)

1. A combined power and input/output system, comprising:

a host system operable to drive a high voltage and a low voltage on a combined power and I/O line;

a target system operably coupled to the host system via the combined power and I/O line; and

a power boost circuit in the target system coupled with the combined power and I/O line and operable to convert the high voltage supplied on the combined power and I/O line to a voltage higher than the high voltage, wherein the higher voltage is stored on a power supply capacitor, wherein the power boost circuit comprises an inductor and a diode interposed between the host system and the power supply capacitor on the combined power and I/O line; and

a switching system operable in cooperation with the power boost circuit to charge and discharge the inductor into the power supply capacitor during communication when said combined power and I/O line is at the high voltage.

2. The combined power and input/output system of claim 1 , wherein a maximum communication baud rate is synchronized to an on period of the power boost circuit.

3. The combined power and input/output system of claim 1 , further comprising a software override of the power boost circuit.

4. The combined power and input/output system of claim 1 , wherein during an input phase the power boost circuit is asserted for a predetermined period after a rising edge of a data bit.

5. The combined power and input/output system of claim 1 , wherein during an output phase, the power boost circuit is asserted for an entirety of a high portion of a data bit.

6. The combined power and input/output system according to claim 1 , further comprising a switch within the target system arranged between the power supply capacitor and the combined power and I/O line.

7. The combined power and input/output system according to claim 6 , wherein the switch is controlled by a tri-state driver whose input is connected with the combined power and I/O line, whose output controls the switch and whose tristate control is connected with the power supply capacitor.

8. The combined power and input/output system according to claim 6 , wherein the switch is a field effect transistor controlled by a further field effect transistor coupled between a gate of the field effect transistor and ground, wherein a gate of the further field effect transistor is connected with the combined power and I/O line.

9. The target system according to claim 1 , further comprising a boost control unit receiving a feedback signal from the power supply capacitor and controlling the switching system, wherein the boost control unit comprises an enable input.

10. A method for providing power and I/O on a single line, comprising:

driving a combined I/O power line by a host to charge a power supply capacitor of a target system in a first mode;

alternately connecting and disconnecting a power boost circuit to charge and discharge the power supply capacitor when driving the combined I/O power line during a communication over the combined I/O power line in a second mode, wherein the power supply capacitor is charged to voltage higher than a voltage provided by the host.

11. A method for providing power and I/O on a single line in accordance with claim 10 , wherein during data input of the target system, the power boost circuit is asserted so as to charge the power supply capacitor responsive to a rising edge of a data bit transmitted by the host.

12. A method for providing power and I/O on a single line in accordance with claim 10 , wherein during data output of the target system, the power boost circuit is asserted for an entire high portion of a data bit.

13. A method for providing power and I/O on a single line in accordance with claim 10 , further comprising employing a software control of the power boost circuit to provide power during a high current activity.

14. An electronic device, comprising:

a host system operable to drive a high voltage and a low voltage on a combined power and I/O line;

a target system operably coupled to the host system via the combined power I/O line;

wherein the target system includes a power boost circuit coupled with the combined power and input/output line and receiving a high voltage signal via the combined power I/O line and a switching system wherein the power boost circuit and switching system are configured to allow the host system to charge a power supply capacitor on the target system in a first mode to a voltage higher than the high voltage, and alternately charge and discharge the power supply capacitor during a communication via the combined power I/O line in a second mode, wherein the alternately charging and discharging is in synchronization with said communication.

15. An electronic device in accordance with claim 14 , wherein the switching system comprises a tristate device.

16. An electronic device in accordance with claim 14 , wherein the switching system comprises a switching transistor.

17. An electronic device in accordance with claim 14 , wherein during data input of the second mode, the power boost circuit is asserted so as to charge the power supply capacitor responsive to a rising edge of a data bit.

18. An electronic device in accordance with claim 14 , wherein during data output of the second mode, the power boost circuit is asserted for an entire high portion of a data bit.

19. An electronic device in accordance with claim 14 , further comprising a software input for the power boost circuit to provide power during a high current activity.

Assignments (16)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 16, 2025
From: MICROCHIP TECHNOLOGY INC.; MICROCHIP TECHNOLOGY IRELAND LIMITED; MICROSEMI CORPORATION; ATMEL CORPORATION; SILICON STORAGE TECHNOLOGY, INC.; MICROSEMI FREQUENCY AND TIME CORP.; MICROSEMI SEMICONDUCTOR ULC; MICROCHIP TECHNOLOGY GERMANY GMBH
To: CRESTONE IP MANAGEMENT, LLC
Reel/Frame 071991/0419 →
RELEASE OF SECURITY INTEREST Recorded Mar 14, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 060894/0437 →
RELEASE OF SECURITY INTEREST Recorded Mar 11, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059363/0001 →
RELEASE OF SECURITY INTEREST Recorded Mar 10, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059863/0400 →
RELEASE OF SECURITY INTEREST Recorded Mar 9, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059358/0001 →
RELEASE OF SECURITY INTEREST Recorded Feb 28, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED
Reel/Frame 059666/0545 →
RELEASE OF SECURITY INTEREST Recorded Feb 25, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059333/0222 →
SECURITY INTEREST Recorded Jun 4, 2021
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 057935/0474 →
SECURITY INTEREST Recorded Dec 24, 2020
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 055671/0612 →
SECURITY INTEREST Recorded Jun 5, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 053468/0705 →
RELEASE OF SECURITY INTEREST Recorded May 30, 2020
From: JPMORGAN CHASE BANK, N.A, AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 053466/0011 →
SECURITY INTEREST Recorded Apr 24, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 053311/0305 →
SECURITY INTEREST Recorded Sep 18, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 047103/0206 →
SECURITY INTEREST Recorded Jun 25, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 046426/0001 →
SECURITY INTEREST Recorded Feb 10, 2017
From: MICROCHIP TECHNOLOGY INCORPORATED
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 041675/0617 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 11, 2013
From: JULICHER, JOSEPH; SCHIEKE, PIETER; DELPORT, VIVIEN
To: MICROCHIP TECHNOLOGY INCORPORATED
Reel/Frame 031387/0603 →
Continuity (1)
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