Electrostatic discharge protection device and electronic apparatus thereof
View Patent ↗An electrostatic discharge protection device has a substrate, a P-well, a N-well, and an isolation portion. The P-well and N-well formed in the substrate are neighboring to each other. Along a specific direction, the P-well has a first N-type, a first P-type, a second N-type, a second P-type, and a third N-type high doping regions sequentially located thereon, and the N-well has a third P-type, a fourth N-type, a fourth P-type, a fifth N-type, and a fifth P-type high doping regions sequentially located thereon. The first N-type, the third N-type, the first P-type, and the second P-type high doping regions are coupled to a ground end, the third P-type, the fifth P-type, the fourth N-type, and the fifth N-type high doping regions are coupled to a voltage supply end, and the second N-type and the fourth P type high doping regions are coupled to an input/output end.
1. An electrostatic discharge protection device, comprising:
a substrate;
a first P-well, formed in the substrate, wherein along a specific direction, the P-well has a first N-type high doping region, a first P-type high doping region, a second N-type high doping region, a second P-type high doping region, and a third N-type high doping regions sequentially located thereon, and the first, third N-type high doping regions and the first, second P-type doping regions are connected to a first ground end; and
a first N-well, formed in the substrate, neighboring to the first P-well, wherein along the specific direction, the N-well has a third P-type high doping region, a fourth N-type high doping region, a fourth P-type high doping region, a fifth N-type high doping region, and a fifth P-type high doping regions sequentially located thereon, and the third, fifth P-type high doping regions and the fourth, fifth N-type high doping regions are coupled to a first voltage supply end, and the second N-type high doping region, the fourth P-type high doping region are coupled to the first input/output end.
2. The electrostatic discharge protection device according to claim 1 , further comprising:
a second P-well, formed in the substrate, neighboring to the first N-well, wherein along the specific direction, the second P-well has a sixth N-type high doping region, a sixth P-type high doping region, a seventh N-type high doping region, a seventh P-type high doping region, and a eighth N-type high doping regions sequentially located thereon, and the sixth, eighth N-type high doping regions and the sixth, seventh P-type high doping regions are coupled to a second ground end;
and a second N-well, formed in the substrate, neighboring to the second P-well, wherein along the specific direction, the second N-well has a eighth P-type high doping region, a ninth N-type high doping region, a ninth P-type high doping region, a tenth N-type high doping region, and a tenth P-type high doping region sequentially located thereon, the eighth, tenth P-type high doping regions and the ninth, tenth N-type high doping region are coupled to the second voltage supply end, and the seventh N-type high doping region and the ninth P-type high doping region are coupled to a second input/output end.
3. The electrostatic discharge protection device according to claim 2 , wherein a first silicon controlled rectifier path is formed between the second P-type high doping region and the fourth N-type high doping region, a second silicon controlled rectifier path is formed between the fifth N-type high doping region and the sixth P-type high doping region, and a third silicon controlled rectifier path is formed between the seventh P-type high doping region and the ninth N-type high doping region.
4. The electrostatic discharge protection device according to claim 2 , further comprising:
a second isolation portion formed between the fifth P-type high doping region and the sixth N-type high doping region; and
a third isolation portion formed between the eighth N-type high doping region and the eighth P-type high doping region.
5. The electrostatic discharge protection device according to claim 1 , wherein a first silicon controlled rectifier path is formed between the second P-type high doping region and the fourth N-type high doping region.
6. The electrostatic discharge protection device according to claim 1 , further comprising a first isolation portion formed between the third N-type high doping region and the third P-type high doping region.
7. The electrostatic discharge protection device according to claim 6 , wherein the first isolation portion is formed in the first N-well and the first P-well, and the first isolation portion is a strip-shaped insulation portion to absolutely the third N-type high doping region from the third P-type high doping region.
8. The electrostatic discharge protection device according to claim 6 , further comprising:
a second isolation portion formed between the third N-type high doping region and the third P-type high doping region, wherein the first isolation portion and the second isolation portion are respectively formed in the first P-well and the first N-well; and
a high doping region formed in the first P-well and the first N-well and between the first isolation portion and the second insulation portion.
9. The electrostatic discharge protection device according to claim 8 , wherein the first isolation portion is a strip-shaped insulation portion to absolutely the third N-type high doping region from the high doping region, and the second isolation portion is another strip-shaped insulation portion to absolutely the third P-type high doping region from the high doping region.
10. The electrostatic discharge protection device according to claim 1 , wherein the first P-type high doping region and the second P-type high doping region forms a ring-shaped P-type high doping region encircling the second N-type high doping region, and the fourth N-type high doping region and the fifth N-type high doping region forms a ring-shaped N-type high doping region encircling the fourth P-type high doping region.
11. An electronic device, comprising:
a chip; and
an electrostatic discharge protection device, comprising:
a substrate;
a first P-well, formed in the substrate, wherein along a specific direction, the P-well has a first N-type high doping region, a first P-type high doping region, a second N-type high doping region, a second P-type high doping region, and a third N-type high doping regions sequentially located thereon, and the first, third N-type high doping regions and the first, second P-type doping regions are connected to a first ground end; and
a first N-well, formed in the substrate, neighboring to the first P-well, wherein along the specific direction, the N-well has a third P-type high doping region, a fourth N-type high doping region, a fourth P-type high doping region, a fifth N-type high doping region, and a fifth P-type high doping regions sequentially located thereon, and the third, fifth P-type high doping regions and the fourth, fifth N-type high doping regions are coupled to a first voltage supply end, and the second N-type high doping region, the fourth P-type high doping region are coupled to the first input/output end.