Multi-chip packaged flash memory/support application specific integrated circuit for flash dual inline memory modules
View Patent ↗In one implementation, flash memory chips are provided with an operating power supply voltage to substantially match a power supply voltage expected at an edge connector of a dual inline memory module. The one or more of the flash memory chips and a memory support application integrated circuit (ASIC) may be mounted together into a multi-chip package for integrated circuits. The one or more flash memory chips and the memory support ASIC may be electrically coupled together by routing one or more conductors between each in the multi-chip package. The multi-chip package may be mounted onto a printed circuit board (PCB) of a flash memory DIMM to reduce the number of packages mounted thereto and reduce the height of the flash memory DIMM. The number of printed circuit board layers may also be reduced, such as by integrating address functions into the memory support ASIC.
1. A multi-chip packaged flash memory and support application specific integrated circuit (ASIC) part to mount to a printed circuit board of a flash memory dual inline memory module (DIMM), the multi-chip packaged flash memory and support ASIC part comprising:
an integrated circuit package to mount to the printed circuit board including
a memory support ASIC die, and
one or more pairs of
a spacer under and directly attached to the memory support ASIC die, and
a randomly accessible flash memory die under and directly attached to the spacer,
wherein a width of the randomly accessible flash memory die is greater than a width of the spacer to provide an opening into a perimeter of the randomly accessible flash memory die to which electrical connections may be made.
2. The multi-chip packaged flash memory and support ASIC part of claim 1 , wherein
the integrated circuit package is a multi-chip module integrated circuit package.
3. The multi-chip packaged flash memory and support ASIC part of claim 2 , further comprising:
a first plurality of conductors to electrically couple the memory support ASIC die to one or more independent pads of a pin-out of the integrated circuit package;
a second plurality of conductors to electrically couple the memory support ASIC die to one or more joint pads of the pin-out; and
a third plurality of conductors to electrically couple one or more of the randomly accessible flash memory die to the one or more joint pads of the pin-out;
wherein one or more of the second plurality of conductors and one or more of the third plurality of conductors coupled to the one or more joint pads electrically couple the randomly accessible flash memory die to the memory support ASIC die.
4. The multi-chip packaged flash memory and support ASIC part of claim 1 , further comprising:
a first plurality of conductors to electrically couple the memory support ASIC die to one or more independent pads of a pin-out of the integrated circuit package;
a second plurality of conductors to electrically couple the memory support ASIC die to one or more joint pads of the pin-out; and
a third plurality of conductors to electrically couple one or more of the randomly accessible flash memory die to the one or more joint pads of the pin-out;
wherein one or more of the second plurality of conductors and one or more of the third plurality of conductors coupled to the one or more joint pads electrically couple the randomly accessible flash memory die to the memory support ASIC die.
5. The multi-chip packaged flash memory and support ASIC part of claim 4 , wherein
each of the spacers is a dielectric or insulator so active portions of the circuitry of the randomly accessible flash memory die do not short to active portions of a neighboring integrated circuit die.
6. The multi-chip packaged flash memory and support ASIC part of claim 5 , wherein
the integrated circuit package is a multi-chip module integrated circuit package.
7. The multi-chip packaged flash memory and support ASIC part of claim 4 , wherein
the integrated circuit package is a multi-chip module integrated circuit package.
8. The multi-chip packaged flash memory and support ASIC part of claim 1 , wherein
each of the spacers is a dielectric or insulator so active portions of the circuitry of the randomly accessible flash memory die do not short to active portions of a neighboring integrated circuit die.