Integrated circuit packaging system with routable traces and method of manufacture thereof

1. A method of manufacture of an integrated circuit packaging system comprising:

providing a leadframe with a conductive layer at a leadframe active side for protecting a lead pad and a routable trace, the leadframe having an overmold recess at a leadframe inactive side;

forming an overmold layer in the overmold recess;

etching a portion of the leadframe between the lead pad and the routable trace to expose the overmold layer for forming the lead pad and routable trace;

mounting a die over the leadframe;

forming an encapsulation directly on the conductive layer, the lead pad, the routable trace, the die, and the overmold layer; and

forming an external interconnect at the leadframe inactive side.

2. The method as claimed in claim 1 wherein providing the leadframe includes forming the conductive layer at the leadframe inactive side.

3. The method as claimed in claim 1 wherein forming the overmold layer includes forming the overmold layer with an overmold recess depth.

4. The method as claimed in claim 1 wherein etching the leadframe includes etching the leadframe using the overmold layer as an etch stop for controlling the trace height.

5. The method as claimed in claim 1 wherein mounting the die includes mounting a flip chip, wire bond chip, hybrid chip, or a combination thereof.

6. A method of manufacture of an integrated circuit packaging system comprising:

providing a leadframe with a conductive layer on a leadframe active side for protecting a lead pad and a routable trace, the leadframe having an overmold recess at a leadframe inactive side;

forming an overmold layer in the overmold recess;

etching a portion of the leadframe between the lead pad and the routable trace to expose the overmold inner side of the overmold layer for forming the lead pad and routable trace;

mounting a die over the leadframe;

connecting an internal interconnect between the die and the leadframe;

forming an encapsulation directly on the conductive layer, the lead pad, the routable trace, the die, the internal interconnect, and the overmold layer; and

forming an external interconnect at the leadframe inactive side.

7. The method as claimed in claim 6 wherein providing the leadframe includes forming the conductive layer at the lead pad inactive side of the lead pad and the trace bottom side of the routable trace.

8. The method as claimed in claim 6 wherein forming the overmold layer includes forming the overmold layer with an overmold recess depth in the overmold recess.

9. The method as claimed in claim 6 wherein etching the leadframe includes etching the leadframe using the overmold inner side of the overmold layer as an etch stop for controlling the trace height.

10. The method as claimed in claim 6 further comprising:

etching the lead pad for forming a lead recess between the lead pad inactive side and the overmold layer;

forming an external interconnect at the lead recess; and

wherein:

mounting the die includes mounting a flip chip, wire bond chip, hybrid chip, or a combination thereof.

11. An integrated circuit packaging system comprising:

a leadframe with a conductive layer on a leadframe active side for protecting a lead pad and a routable trace, the leadframe having an overmold recess at a leadframe inactive side;

an overmold layer in the overmold recess, the overmold layer exposed between the lead pad and the routable trace for forming the lead pad and routable trace;

an encapsulation directly on the conductive layer, the lead pad, the routable trace, and the overmold layer; and

an external interconnect at the leadframe inactive side.

12. The system as claimed in claim 11 wherein the leadframe includes the conductive layer on the leadframe inactive side.

13. The system as claimed in claim 11 wherein the overmold layer is formed with an overmold recess depth.

14. The system as claimed in claim 11 wherein the leadframe is etched down to an etch stop at the overmold layer for controlling the trace height.

15. The system as claimed in claim 11 wherein the die is a flip chip, wire bond chip, hybrid chip, or a combination thereof.

16. The system as claimed in claim 11 further comprising:

an internal interconnect is between the die and the leadframe; and

wherein:

the encapsulation is directly on the conductive layer, the lead pad, the routable trace, the die, the internal interconnect, and the overmold layer.

17. The system as claimed in claim 16 wherein the leadframe includes the conductive layer at the lead pad inactive side of the lead pad and the trace bottom side of the routable trace.

18. The system as claimed in claim 16 wherein the overmold layer is formed with an overmold recess depth in the overmold recess.

19. The system as claimed in claim 16 wherein the leadframe is etched down to an etch stop at the overmold inner side of the overmold layer for controlling the trace height.

20. The system as claimed in claim 16 further comprising:

the lead pad having a lead recess between the lead pad inactive side and the overmold layer;

an external interconnect at the lead recess; and

wherein:

the die is a flip chip, wire bond chip, hybrid chip, or a combination thereof.