IP Library Granted Patent US 9,142,387
Granted Patent B2
US 9,142,387 · App. 14/095,575 · Granted Sep 22, 2015

Isotopically-enriched boron-containing compounds, and methods of making and using same

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Quick Facts
Patent No.
US 9,142,387
App. No.
14/095,575
Granted
Sep 22, 2015
Kind
B2
Abstract

An isotopically-enriched, boron-containing compound comprising two or more boron atoms and at least one fluorine atom, wherein at least one of the boron atoms contains a desired isotope of boron in a concentration or ratio greater than a natural abundance concentration or ratio thereof. The compound may have a chemical formula of B 2 F 4 . Synthesis methods for such compounds, and ion implantation methods using such compounds, are described, as well as storage and dispensing vessels in which the isotopically-enriched, boron-containing compound is advantageously contained for subsequent dispensing use.

Claims (15)

1. A process system, comprising:

a process tool;

a first boron precursor source configured to supply a first boron precursor to the process tool; and

a second boron precursor source configured to supply a second boron precursor to the process tool concurrently with the first boron precursor,

wherein the first boron precursor source comprises B 2 F 4 and the second boron precursor source comprises diborane.

2. The process system of claim 1 , wherein the process tool comprises an ion implantation apparatus.

3. The process system of claim 1 , comprising a co-flow feed line for introducing co-flowed first and second boron precursors to the process tool, where each of the first boron precursor source and second boron precursor source comprises a precursor supply vessel coupled in flow communication to the co-flow feed line.

4. The process system of claim 1 , wherein the process tool comprises a boron doping ion implantation apparatus disposed in a manufacturing facility configured to produce product articles, assemblies, or subassemblies, comprising boron doped material.

5. The process system of claim 4 , wherein the manufacturing facility is configured to produce semiconductor product articles, assemblies, or subassemblies, comprising doped boron material.

6. The process system of claim 4 , wherein the manufacturing facility is configured to produce solar energy product articles, assemblies, or subassemblies, comprising boron doped material.

7. The process system of claim 4 , wherein the manufacturing facility is configured to produce flat panel display product articles, assemblies, or subassemblies, comprising boron doped material.

8. The process system of claim 1 , wherein at least one of said B 2 F 4 and diborane is isotopically enriched.

9. The process system of claim 1 , wherein said B 2 F 4 is isotopically enriched.

10. The process system of claim 1 , wherein said diborane is isotopically enriched.

11. The process system of claim 1 , wherein both of said B 2 F 4 and diborane are isotopically enriched.

Assignments (8)
SECURITY INTEREST Recorded Jul 8, 2022
From: ENTEGRIS, INC.; ENTEGRIS GP, INC.; POCO GRAPHITE, INC.; CMC MATERIALS, INC.; INTERNATIONAL TEST SOLUTIONS, LLC; QED TECHNOLOGIES INTERNATIONAL, INC.
To: TRUIST BANK, AS NOTES COLLATERAL AGENT
Reel/Frame 060613/0072 →
ASSIGNMENT OF PATENT SECURITY INTEREST RECORDED AT REEL/FRAME 048811/0679 Recorded Nov 5, 2019
From: GOLDMAN SACHS BANK USA
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 050965/0035 →
SECURITY INTEREST Recorded Nov 13, 2018
From: ENTEGRIS, INC.; SAES PURE GAS, INC.
To: GOLDMAN SACHS BANK USA
Reel/Frame 048811/0679 →
RELEASE OF SECURITY INTEREST Recorded Nov 8, 2018
From: GOLDMAN SACHS BANK USA, AS COLLATERAL AGENT
To: ENTEGRIS, INC.; POCO GRAPHITE, INC.; ATMI, INC.; ATMI PACKAGING, INC.; ADVANCED TECHNOLOGY MATERIALS, INC.
Reel/Frame 047477/0151 →
RELEASE OF SECURITY INTEREST Recorded Nov 8, 2018
From: GOLDMAN SACHS BANK USA, AS COLLATERAL AGENT
To: ENTEGRIS, INC.; POCO GRAPHITE, INC.; ATMI, INC.; ATMI PACKAGING, INC.; ADVANCED TECHNOLOGY MATERIALS, INC.
Reel/Frame 047477/0032 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 4, 2015
From: ADVANCED TECHNOLOGY MATERIALS, INC.
To: ENTEGRIS, INC.
Reel/Frame 034894/0025 →
SECURITY INTEREST Recorded May 2, 2014
From: ENTEGRIS, INC.; POCO GRAPHITE, INC.; ATMI, INC.; ADVANCED TECHNOLOGY MATERIALS, INC.; ATMI PACKAGING, INC.
To: GOLDMAN SACHS BANK USA, AS COLLATERAL AGENT
Reel/Frame 032812/0192 →
SECURITY INTEREST Recorded May 1, 2014
From: ENTEGRIS, INC.; POCO GRAPHITE, INC.; ATMI, INC.; ADVANCED TECHNOLOGY MATERIALS, INC.; ATMI PACKAGING, INC.
To: GOLDMAN SACHS BANK USA, AS COLLATERAL AGENT
Reel/Frame 032815/0852 →