IP Library Granted Patent US 8,836,412
Granted Patent B2
US 8,836,412 · App. 14/101,164 · Granted Sep 16, 2014

Charge pump with a power-controlled clock buffer to reduce power consumption and output voltage ripple

Inventors: Kesheng Wang (Milpitas, CA); Ali Al-Shamma (San Jose, CA)
Assignee: SanDisk 3D LLC
H03L7/0802
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Quick Facts
Patent No.
US 8,836,412
App. No.
14/101,164
Granted
Sep 16, 2014
Kind
B2
Abstract

A charge pump system includes a charge pump that receives its clock signals, generated by an oscillator circuit, though a clock buffer. The clock buffer is power-controlled to reduce power consumption and output voltage ripple. The buffer is formed of a series of inverter that are connected to the power supply level through a clamping element, such as a transistor whose gate is controlled by a regulation signal based on feedback from the pump's output.

Claims (26)

1. A charge pump system, comprising:

a charge pump circuit connected to receive N pump clock signals and generate therefrom an output voltage, where N is an integer greater than or equal to one;

regulation circuitry connected to receive the output voltage and generate a regulation signal based on the output voltage;

an oscillator circuit providing N initial clock signals; and

N clock buffer circuits, each receiving a corresponding one of the initial clock signals and generating therefrom a corresponding one of the pump clock signals, wherein each of the buffer circuits includes:

a plurality of inverters connected in series, with the first inverter in the series connected to receive the corresponding initial clock signal as input and the last inverter in the series providing the corresponding pump clock signal as output; and

a corresponding plurality of clamp elements connected to receive the regulation signal and through which a corresponding one of the inverter is connected to a power supply level, the voltage level being supplied to the corresponding inverter being dependent upon the regulation signal.

2. The charge pump system of claim 1 , wherein the charge pump circuit is a Dickson type charge pump.

3. The charge pump system of claim 1 , wherein the charge pump circuits is a voltage doubler type charge pump.

4. The charge pump system of claim 1 , wherein the charge pump circuits is a four-phase type of charge pump.

5. The charge pump circuit of claim 1 , wherein N is two and the pump clock signals are non-overlapping.

6. The charge pump circuit of claim 1 , wherein the regulation circuitry includes:

a voltage divider connected between the output voltage and ground; and

a comparator having a first input connected to a node of the voltage divider, a second input connected to a reference voltage level, and an output supplying the regulation signal.

7. The charge pump circuit of claim 1 , wherein each of the inverter comprises:

a PMOS transistor between an internal node and, through the corresponding clamp element, the power supply level; and

an NMOS transistor connected between the internal node and ground,

wherein the input of the inverter is connected to the gates of the PMOS and NMOS transistors and the output of the inverter is taken from the internal node.

8. The charge pump system of claim 1 , wherein the clamp element is a PMOS transistor having a gate voltage determined by the regulation signal.

9. The charge pump system of claim 1 , wherein the clamp element is an NMOS transistor having a gate voltage determined by the regulation signal.

10. The charge pump system of claim 9 , wherein the regulation circuitry includes an auxiliary charge pump for use in generating the regulation signal.

11. The charge pump system of claim 1 , wherein the clamp element is a PMOS transistor having a gate voltage determined by the regulation signal in parallel with an NMOS transistor having a gate voltage determined by the regulation signal.

12. The charge pump system of claim 1 , wherein the charge pump system is a peripheral circuit element on a monolithic three-dimensional semiconductor memory device.

13. The charge pump system of claim 12 , wherein the semiconductor memory device further comprises a three-dimensional (3D) non-volatile memory that includes multiple memory cells arranged in multiple physical levels above a silicon substrate.

14. The charge pump system of claim 13 , wherein the charge pump system is connectable to the three-dimensional (3D) non-volatile memory to supply a programming voltage level thereto.

15. The charge pump system of claim 13 , wherein the charge pump system is connectable to the three-dimensional (3D) non-volatile memory to supply an erase voltage level thereto.

Assignments (7)
PARTIAL RELEASE OF SECURITY INTERESTS Recorded Apr 25, 2025
From: JPMORGAN CHASE BANK, N.A., AS AGENT
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 071382/0001 →
SECURITY AGREEMENT Recorded Apr 25, 2025
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 071050/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 31, 2024
From: SANDISK TECHNOLOGIES LLC
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 069796/0423 →
CHANGE OF NAME Recorded May 25, 2016
From: SANDISK TECHNOLOGIES INC
To: SANDISK TECHNOLOGIES LLC
Reel/Frame 038807/0948 →
CORRECTIVE ASSIGNMENT TO CORRECT THE INCORRECT LISTED PATENT NUMBER 8853569 TO THE CORRECT PATENT NUMBER 8883569 PREVIOUSLY RECORDED ON REEL 038300 FRAME 0665. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Apr 25, 2016
From: SANDISK 3D LLC
To: SANDISK TECHNOLOGIES INC.
Reel/Frame 038520/0552 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 30, 2016
From: SANDISK 3D LLC.
To: SANDISK TECHNOLOGIES INC.
Reel/Frame 038300/0665 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 19, 2013
From: WANG, KESHENG; AL-SHAMMA, ALI
To: SANDISK 3D LLC
Reel/Frame 031819/0315 →
Continuity (2)
Provisional Application 61763432 · Feb 11, 2013
Related Publication 20140225652A1 · Aug 14, 2014