IP Library Granted Patent US 9,070,875
Granted Patent B2
US 9,070,875 · App. 14/104,984 · Granted Jun 30, 2015

Low temperature GST process

Inventor: Jun-Fei Zheng (Westport, CT)
Assignee: ENTEGRIS, INC.
H01L45/144C23C16/305C23C16/452C23C16/45512C23C16/45565C23C16/45574H01L45/06H01L45/1616
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 9,070,875
App. No.
14/104,984
Granted
Jun 30, 2015
Kind
B2
Abstract

A deposition process to form a conformal phase change material film on the surface of a substrate to produce a memory device wafer comprises providing a substrate to a chamber of a deposition system; providing an activation region; introducing one or more precursors into the chamber upstream of the substrate; optionally introducing one or more co-reactants upstream of the substrate; activating the one or more precursors; heating the substrate; and depositing the phase change material film on the substrate from the one or more precursors by chemical vapor deposition. The deposited phase change material film comprises Ge x Sb y Te z A m in which A is a dopant selected from the group of N, C, In, Sn, and Se. In one implementation, the process is carried out to form GST films doped with carbon and nitrogen, to impart beneficial film growth and performance properties to the film.

Claims (8)

1. A process for forming a germanium telluride material on a substrate, comprising vaporizing germanium and tellurium precursors, to form corresponding precursor vapor; heating the tellurium precursor vapor to temperature sufficient for activation thereof, separate from the germanium precursor; contacting the germanium precursor vapor and activated tellurium precursor vapor with the substrate under conditions enabling formation of said germanium telluride material on the substrate, wherein the germanium telluride material comprises material of the formula Ge x Te z A m , wherein A comprises one or more elements selected from the group consisting of N, C, In, Sn, and Se, and wherein x is from 0.1 to 0.6, z is from 0.2 to 0.9, and m is from 0 to 0.15.

2. The process of claim 1 , wherein the substrate during said contacting is at temperature below the crystallization temperature of said germanium telluride material.

3. The process of claim 1 , wherein the substrate during said contacting is at temperature in a range of from 110° C. to 300° C.

4. The process of claim 1 , wherein the tellurium precursor vapor is heated in said heating to temperature in a range of from 180° C. to 450° C. for activation thereof.

5. The process of claim 1 , wherein the germanium precursor comprises a precursor selected from the group consisting of Ge(IV) amides, Ge(IV) mixed alkyl/amides, Ge(II) amidinates, Ge(II) amides, Ge(IV) guanidinates, germylenes, and Ge(II)Cp, wherein Cp is cyclopentadienyl.

6. The process of claim 1 , wherein the germanium precursor comprises Ge[Pr i NC(n-Bu)NPr i ] 2 .

7. A process for forming a germanium telluride material on a substrate, comprising vaporizing germanium and tellurium precursors, to form corresponding precursor vapor; heating the tellurium precursor vapor to temperature sufficient for activation thereof, separate from the germanium precursor;

contacting the germanium precursor vapor and activated tellurium precursor vapor with the substrate under conditions enabling formation of said germanium telluride material on the substrate, wherein the tellurium precursor comprises a precursor of the formula TeL n or cyclic LTe(-L-) 2 TeL, wherein at least one L contains a N bonded to one said Te, n is between 2-6, inclusive, and each L is independently selected from the alkyl and aryl groups consisting of: amides of the form —NR 1 R 2 wherein R 1 , R 2 represents H, an alkyl group, or a silyl group; cyclic amides of the form —NR wherein R represents a C 1 -C 6 linear, branched, cyclic, or silyl group; imido groups of the form ═NR wherein R represents a C 1 -C 6 linear, branched, cyclic, or silyl group; a group of the form —N(R)—, wherein the —N(R)— bridges 2 telluriums; diamides of the form —NR 1 -A-R 2 N— wherein R 1 , R 2 and A, are, independently, a C 1 -C 6 linear, branched, cyclic, or silyl group; aminoamide groups of the form —NR 1 -A-NR 2 R 3 wherein R 1 , R 2 , R 3 and A are, independently, a C 1 -C 6 linear, branched, cyclic, or silyl group; alkoxyamide groups of the form —NR 1 -A-OR 2 wherein R 1 , R 2 and A are, independently, a C 1 -C 6 linear, branched, cyclic, or silyl group; amidinate groups of the form —NR 1 —C(R 2 )—NR 3 wherein R 1 , R 2 , R 3 are, independently, a C 1 -C 6 linear, branched, cyclic, or silyl group; and guanidinate groups of the form —NR 1 —C(NR 2 R 3 )—NR 4 wherein R 1 , R 2 , R 3 , R 4 are, independently, a C 1 -C 6 linear, branched, cyclic, or silyl group.

Assignments (8)
SECURITY INTEREST Recorded Jul 8, 2022
From: ENTEGRIS, INC.; ENTEGRIS GP, INC.; POCO GRAPHITE, INC.; CMC MATERIALS, INC.; INTERNATIONAL TEST SOLUTIONS, LLC; QED TECHNOLOGIES INTERNATIONAL, INC.
To: TRUIST BANK, AS NOTES COLLATERAL AGENT
Reel/Frame 060613/0072 →
ASSIGNMENT OF PATENT SECURITY INTEREST RECORDED AT REEL/FRAME 048811/0679 Recorded Nov 5, 2019
From: GOLDMAN SACHS BANK USA
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 050965/0035 →
SECURITY INTEREST Recorded Nov 13, 2018
From: ENTEGRIS, INC.; SAES PURE GAS, INC.
To: GOLDMAN SACHS BANK USA
Reel/Frame 048811/0679 →
RELEASE OF SECURITY INTEREST Recorded Nov 8, 2018
From: GOLDMAN SACHS BANK USA, AS COLLATERAL AGENT
To: ENTEGRIS, INC.; POCO GRAPHITE, INC.; ATMI, INC.; ATMI PACKAGING, INC.; ADVANCED TECHNOLOGY MATERIALS, INC.
Reel/Frame 047477/0151 →
RELEASE OF SECURITY INTEREST Recorded Nov 8, 2018
From: GOLDMAN SACHS BANK USA, AS COLLATERAL AGENT
To: ENTEGRIS, INC.; POCO GRAPHITE, INC.; ATMI, INC.; ATMI PACKAGING, INC.; ADVANCED TECHNOLOGY MATERIALS, INC.
Reel/Frame 047477/0032 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 4, 2015
From: ADVANCED TECHNOLOGY MATERIALS, INC.
To: ENTEGRIS, INC.
Reel/Frame 034894/0025 →
SECURITY INTEREST Recorded May 2, 2014
From: ENTEGRIS, INC.; POCO GRAPHITE, INC.; ATMI, INC.; ADVANCED TECHNOLOGY MATERIALS, INC.; ATMI PACKAGING, INC.
To: GOLDMAN SACHS BANK USA, AS COLLATERAL AGENT
Reel/Frame 032812/0192 →
SECURITY INTEREST Recorded May 1, 2014
From: ENTEGRIS, INC.; POCO GRAPHITE, INC.; ATMI, INC.; ADVANCED TECHNOLOGY MATERIALS, INC.; ATMI PACKAGING, INC.
To: GOLDMAN SACHS BANK USA, AS COLLATERAL AGENT
Reel/Frame 032815/0852 →
Continuity (6)
Continuation 13321810
Provisional Application 61180518 · May 22, 2009
Provisional Application 61223225 · Jul 6, 2009
Provisional Application 61263089 · Nov 20, 2009
Provisional Application 61317819 · Mar 26, 2010
Related Publication 20140106549A1 · Apr 17, 2014